Patents by Inventor Saori INOUE

Saori INOUE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Boron nitride/resin composite circuit board, and circuit board including boron nitride/resin composite integrated with heat radiation plate
    Patent number: 9516741
    Abstract: A boron nitride/resin composite circuit board having high heat dissipation characteristics and high reliability is provided. A boron nitride/resin composite circuit board, including: a plate-shaped resin-impregnated boron nitride sintered body having a plate thickness of 0.2 to 1.5 mm, the plate-shaped resin-impregnated boron nitride sintered body including 30 to 85 volume % of a boron nitride sintered body having boron nitride particles bonded three-dimensionally, the boron nitride particles having an average long diameter of 5 to 50 ?m, and 70 to 15 volume % of a resin; and a metal circuit adhered onto both principal planes of the plate-shaped resin-impregnated boron nitride sintered body, the metal circuit being copper or aluminum, wherein: a ratio of a linear thermal expansion coefficient in a plane direction of the resin-impregnated boron nitride sintered body at 40 to 150° C. (CTE1) and a linear thermal expansion coefficient of the metal circuit at 40 to 150° C. (CTE2) (CTE1/CTE2) is 0.5 to 2.0.
    Type: Grant
    Filed: August 12, 2014
    Date of Patent: December 6, 2016
    Assignee: Denka Company Limited
    Inventors: Hideki Hirotsuru, Shuhei Nonaka, Toshikatsu Mitsunaga, Koki Ikarashi, Kouji Miyata, Taiki Nishi, Saori Inoue, Fumiya Kobayashi
  • BORON NITRIDE/RESIN COMPOSITE CIRCUIT BOARD, AND CIRCUIT BOARD INCLUDING BORON NITRIDE/RESIN COMPOSITE INTEGRATED WITH HEAT RADIATION PLATE
    Publication number: 20160227644
    Abstract: A boron nitride/resin composite circuit board having high heat dissipation characteristics and high relyability is provided. A boron nitride/resin composite circuit board, including: a plate-shaped resin-impregnated boron nitride sintered body having a plate thickness of 0.2 to 1.5 mm, the plate-shaped resin-impregnated boron nitride sintered body including 30 to 85 volume % of a boron nitride sintered body having boron nitride particles bonded three-dimensionally, the boron nitride particles having an average long diameter of 5 to 50 ?m, and 70 to 15 volume % of a resin; and a metal circuit adhered onto both principal planes of the plate-shaped resin-impregnated boron nitride sintered body, the metal circuit being copper or aluminum, wherein: a ratio of a linear thermal expansion coefficient in a plane direction of the resin-impregnated boron nitride sintered body at 40 to 150° C. (CTE1) and a linear thermal expansion coefficient of the metal circuit at 40 to 150° C. (CTE2) (CTE1/CTE2) is 0.5 to 2.0.
    Type: Application
    Filed: August 12, 2014
    Publication date: August 4, 2016
    Applicant: Denka Company Limited
    Inventors: Hideki HIROTSURU, Shuhei NONAKA, Toshikatsu MITSUNAGA, Koki IKARASHI, Kouji MIYATA, Taiki NISHI, Saori INOUE, Fumiya KOBAYASHI