Patents by Inventor Saori KANAZAKI

Saori KANAZAKI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • WIRED CIRCUIT BOARD AND PRODUCING METHOD THEREOF
    Publication number: 20160081185
    Abstract: A wired circuit board includes a wire, and a terminal formed continuously to the wire to be electrically connected to an electronic element at one surface thereof in a thickness direction of the wired circuit board. The terminal includes, at the one surface thereof in the thickness direction, a projecting portion projecting toward one side thereof in the thickness direction, and a covering layer covering one end portion of the projecting portion in the thickness direction.
    Type: Application
    Filed: November 25, 2015
    Publication date: March 17, 2016
    Applicant: NITTO DENKO CORPORATION
    Inventors: Jun ISHII, Saori KANAZAKI
  • Wired circuit board and producing method thereof
    Patent number: 9253879
    Abstract: A wired circuit board includes a wire, and a terminal formed continuously to the wire to be electrically connected to an electronic element at one surface thereof in a thickness direction of the wired circuit board. The terminal includes, at the one surface thereof in the thickness direction, a projecting portion projecting toward one side thereof in the thickness direction, and a covering layer covering one end portion of the projecting portion in the thickness direction.
    Type: Grant
    Filed: May 2, 2013
    Date of Patent: February 2, 2016
    Assignee: NITTO DENKO CORPORATION
    Inventors: Jun Ishii, Saori Kanazaki
  • WIRED CIRCUIT BOARD AND PRODUCING METHOD THEREOF
    Publication number: 20130319743
    Abstract: A wired circuit board includes a wire, and a terminal formed continuously to the wire to be electrically connected to an electronic element at one surface thereof in a thickness direction of the wired circuit board. The terminal includes, at the one surface thereof in the thickness direction, a projecting portion projecting toward one side thereof in the thickness direction, and a covering layer covering one end portion of the projecting portion in the thickness direction.
    Type: Application
    Filed: May 2, 2013
    Publication date: December 5, 2013
    Applicant: NITTO DENKO CORPORATION
    Inventors: Jun ISHII, Saori KANAZAKI