Abstract: A wired circuit board, including a metal supporting layer; an insulating layer formed on one side of the metal supporting layer in a thickness direction thereof; and a conductive layer having a plurality of terminal portions placed to be spaced apart from each other and formed on one side of the insulating layer in the thickness direction. The insulating layer has a first opening which is formed to include the plurality of terminal portions, and the metal supporting layer includes a second opening formed to include the plurality of terminal portions, when projected in the thickness direction. The wired circuit board further includes at least one reinforcing insulating portion which is placed between the plurality of terminal portions in the first opening, and/or at least one reinforcing metal supporting portion which is placed between the plurality of terminal portions in the second opening, when projected in the thickness direction.

Abstract: A suspension board with circuit includes one pair of pedestals. A pedestal conductive layer of one pedestal has a fan portion and a continuous portion. The pedestal conductive layer of the other pedestal has at least the fan portion. When the pedestal conductive layer of the other pedestal has only the fan portion, the pedestal supporting layer is disposed so as to be overlapped with the fan portion in the thickness direction in each of the pedestals and so as not to be overlapped with the continuous portion in the one pedestal and when the pedestal conductive layer of the other pedestal has the continuous portion, the pedestal supporting layer is disposed so as to be overlapped with the continuous portion or is disposed so as to be overlapped with the fan portion and so as not to be overlapped with the continuous portion in each of the pedestals.

Abstract: A suspension board with circuit includes a metal supporting board having a support opening portion, a base insulating layer disposed at one side of the metal supporting board, and a conductive layer disposed at one side of the base insulating layer and including a plurality of terminal portions overlapped with the support opening portion and disposed at spaced intervals to each other. The base insulating layer includes a plurality of base opening portions that are disposed between the plurality of terminal portions in an arrangement direction, a plurality of thick portions that are overlapped with each of end portions of the plurality of terminal portions in a direction orthogonal to both directions of the thickness direction and the arrangement direction, and a plurality of thin portions that are disposed along edge portions of the plurality of base opening portions between the plurality of thick portions and are thinner than the plurality of thick portions.

Abstract: A suspension board with circuit includes a metal supporting layer, an insulating base layer on one side thereof in a thickness direction, a conductive pattern disposed on the insulating base layer, an insulating cover layer disposed on the insulating base layer so as to cover the conductive pattern, and a pedestal for supporting a slider which includes a thin pedestal portion. The thin pedestal portion includes a pedestal base layer included in the insulating base layer, a pedestal conductive layer included in the conductive pattern which extends over the pedestal base layer, and a pedestal cover layer included in the insulating cover layer and disposed on the pedestal conductive layer. The conductive pattern includes a first wire placed to extend over the insulating base layer which has a narrower portion, and a dimension of the pedestal conductive layer is 0.5 to 3 times the dimension of the narrower portion.

Abstract: A suspension board with circuit includes a metal supporting board having a support opening portion, a base insulating layer disposed at one side of the metal supporting board, and a conductive layer disposed at one side of the base insulating layer and including a plurality of terminal portions overlapped with the support opening portion and disposed at spaced intervals to each other. The base insulating layer includes a plurality of base opening portions that are disposed between the plurality of terminal portions in an arrangement direction, a plurality of thick portions that are overlapped with each of end portions of the plurality of terminal portions in a direction orthogonal to both directions of the thickness direction and the arrangement direction, and a plurality of thin portions that are disposed along edge portions of the plurality of base opening portions between the plurality of thick portions and are thinner than the plurality of thick portions.

Abstract: A suspension board with circuit includes one pair of pedestals. A pedestal conductive layer of one pedestal has a fan portion and a continuous portion. The pedestal conductive layer of the other pedestal has at least the fan portion. When the pedestal conductive layer of the other pedestal has only the fan portion, the pedestal supporting layer is disposed so as to be overlapped with the fan portion in the thickness direction in each of the pedestals and so as not to be overlapped with the continuous portion in the one pedestal and when the pedestal conductive layer of the other pedestal has the continuous portion, the pedestal supporting layer is disposed so as to be overlapped with the continuous portion or is disposed so as to be overlapped with the fan portion and so as not to be overlapped with the continuous portion in each of the pedestals.

Abstract: A suspension board with circuit includes a slider mounting region configured to mount a slider thereon, a pedestal portion provided in the slider mounting region and configured to support the slider, and a dam portion provided in the slider mounting region and configured to prevent an adhesive fixing the slider from flowing out of the slider mounting region. The thickness of the pedestal portion is thicker than that of the dam portion.

Abstract: A suspension board with circuit includes a slider mounting region configured to mount a slider thereon, a pedestal portion provided in the slider mounting region and configured to support the slider, and a dam portion provided in the slider mounting region and configured to prevent an adhesive fixing the slider from flowing out of the slider mounting region. The thickness of the pedestal portion is thicker than that of the dam portion.

Abstract: A wired circuit board includes a wire and a terminal formed continuously to the wire and electrically connected to an electronic element at one surface thereof in a thickness direction. The terminal includes a first contact portion, and a second contact portion provided around the first contact portion to protrude more than the first contact portion toward one side in the thickness direction.

Abstract: A suspension board with circuit includes a metal supporting layer, an insulating base layer on one side thereof in a thickness direction, a conductive pattern disposed on the insulating base layer, an insulating cover layer disposed on the insulating base layer so as to cover the conductive pattern, and a pedestal for supporting a slider which includes a thin pedestal portion. The thin pedestal portion includes a pedestal base layer included in the insulating base layer, a pedestal conductive layer included in the conductive pattern which extends over the pedestal base layer, and a pedestal cover layer included in the insulating cover layer and disposed on the pedestal conductive layer. The conductive pattern includes a first wire placed to extend over the insulating base layer which has a narrower portion, and a dimension of the pedestal conductive layer is 0.5 to 3 times the dimension of the narrower portion.

Abstract: A wired circuit board, including a metal supporting layer; an insulating layer formed on one side of the metal supporting layer in a thickness direction thereof; and a conductive layer having a plurality of terminal portions placed to be spaced apart from each other and formed on one side of the insulating layer in the thickness direction. The insulating layer has a first opening which is formed to include the plurality of terminal portions, and the metal supporting layer includes a second opening formed to include the plurality of terminal portions, when projected in the thickness direction. The wired circuit board further includes at least one reinforcing insulating portion which is placed between the plurality of terminal portions in the first opening, and/or at least one reinforcing metal supporting portion which is placed between the plurality of terminal portions in the second opening, when projected in the thickness direction.

Abstract: A method of producing a wired circuit board includes a first step of preparing a metal supporting layer, a second step of forming, on one side of the metal supporting layer in a thickness direction thereof, an insulating layer having a first opening, and a plurality of terminal formation portions, a third step of forming, on one side of the insulating layer in the thickness direction, a conductive layer having a plurality of terminal portions each corresponding to the plurality of terminal formation portions, a fourth step of partially removing the metal supporting layer to form a second opening and at least one reinforcing metal supporting portion placed between the plurality of terminal formation portions, and a fifth step of removing the plurality of terminal formation portions exposed from the second opening to expose both side surfaces of the plurality of terminal portions in the thickness direction.

Abstract: A wired circuit board includes an insulating layer to be formed with an opening extending therethrough in a thickness direction of the wired circuit board, a conductive layer formed on one surface of the insulating layer in the thickness direction and including a one-side terminal portion, an other-side terminal portion formed on the other surface of the insulating layer in the thickness direction, disposed so as to overlap the opening and the one-side terminal portion when projected in the thickness direction, and used to be connected to an electronic element via a conductive adhesive, and a conductive portion filling the opening to provide electrical conduction between the one-side terminal portion and the other-side terminal portion.

Abstract: A method of producing a wired circuit board includes a first step of preparing a metal supporting layer, a second step of forming, on one side of the metal supporting layer in a thickness direction thereof, an insulating layer having a first opening, and a plurality of terminal formation portions, a third step of forming, on one side of the insulating layer in the thickness direction, a conductive layer having a plurality of terminal portions each corresponding to the plurality of terminal formation portions, a fourth step of partially removing the metal supporting layer to form a second opening and at least one reinforcing metal supporting portion placed between the plurality of terminal formation portions, and a fifth step of removing the plurality of terminal formation portions exposed from the second opening to expose both side surfaces of the plurality of terminal portions in the thickness direction.

Abstract: A wired circuit board includes an insulating layer to be formed with an opening extending therethrough in a thickness direction of the wired circuit board, a conductive layer formed on one surface of the insulating layer in the thickness direction and including a one-side terminal portion, an other-side terminal portion formed on the other surface of the insulating layer in the thickness direction, disposed so as to overlap the opening and the one-side terminal portion when projected in the thickness direction, and used to be connected to an electronic element via a conductive adhesive, and a conductive portion filling the opening to provide electrical conduction between the one-side terminal portion and the other-side terminal portion.

Abstract: A wired circuit board includes a wire and a terminal formed continuously to the wire and electrically connected to an electronic element at one surface thereof in a thickness direction. The terminal includes a first contact portion, and a second contact portion provided around the first contact portion to protrude more than the first contact portion toward one side in the thickness direction.