Abstract: A semiconductor-laminated substrate includes: a substrate; and a laminated structure that includes a first semiconductor laminate which is provided on the substrate and processed into a light emitting element and a second semiconductor laminate which is provided on the first semiconductor laminate and processed into at least one thyristor, in which the laminated structure is adjusted such that two resonant wavelengths due to an effect of the thyristor are located on both sides of a resonant wavelength of the light emitting element.

Abstract: A light-emitting component includes: a substrate; multiple light-emitting elements provided on the substrate, each having a light-emitting area; and multiple thyristors which are provided on each of the light-emitting elements, which include gate layers, and which cause light to be emitted, or increase an amount of light emitted, from the light-emitting areas of the light-emitting elements by being in an ON state. The substrate absorbs light emitted from the thyristors and emits light not absorbed by the gate layers.

Abstract: A light emitting component includes: a substrate; a plural light emitting elements that are provided on the substrate and respectively have light emission regions; and a plural thyristors that are turned on to cause the light emission regions of the respective light emitting elements to emit light, or that increase amounts of emitted light of the light emission regions, in which the light emitting elements absorb light emitted from a corresponding thyristor among the plural thyristors.

Abstract: An optical measurement apparatus includes: an emission section that emits light such that the light travels across an anterior chamber of an eyeball of a measurement subject; a light reception section that receives light that is emitted from the emission section and travels across the anterior chamber; and a positioning section that performs positioning of one of the emission section and the light reception section at a position where skin on a periphery of an inner canthus of the eyeball is squeezed into an eye socket accommodating the eyeball.

Abstract: An optical measurement apparatus includes: an emission section that emits light such that the light travels across an anterior chamber of an eyeball of a measurement subject; a light reception section that receives light that is emitted from the emission section and travels across the anterior chamber; and a positioning section that performs positioning of one of the emission section and the light reception section at a position where skin on a periphery of an inner canthus of the eyeball is squeezed into an eye socket accommodating the eyeball.

Abstract: A measurement apparatus includes: an eyelid opening section that comes into contact with skin on a periphery of an eyeball of a measurement subject and maintains an eyelid of the measurement subject in an open state; an emission section that emits light such that the light travels across an anterior chamber of the eyeball in which the eyelid is maintained in an open state by the eyelid opening portion; and a light reception section that receives the light which travels across the anterior chamber.

Abstract: Provided is a semiconductor manufacturing device including an expanding unit that expands a holding member having an adhesive layer on which a substrate in a state of being diced into plural semiconductor chips is held, a detection unit that detects an adhesive state between one of the semiconductor chips and the holding member, in a state in which the holding member is expanded, and a pickup unit that picks up the semiconductor chip by changing an operation relevant to pickup of the semiconductor chip based on the detected adhesive state.

Abstract: An optical measuring apparatus includes a light output device that outputs light so as to cross an anterior chamber of an eyeball of a subject, a light receiving device that receives the light having crossed the anterior chamber, and a positioning device that positions the light output device and the light receiving device at such positions that, when the eyeball is adducted, the light output from the light output device crosses the anterior chamber and is received by the light receiving device.

Abstract: Provided is a semiconductor manufacturing device including an expanding unit that expands a holding member having an adhesive layer on which a substrate in a state of being diced into plural semiconductor chips is held, a detection unit that detects an adhesive state between one of the semiconductor chips and the holding member, in a state in which the holding member is expanded, and a pickup unit that picks up the semiconductor chip by changing an operation relevant to pickup of the semiconductor chip based on the detected adhesive state.