Patents by Inventor Saori NIWA

Saori NIWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Cover film
    Patent number: 11541645
    Abstract: A cover film having at least (A) a substrate layer, (B) an intermediate layer, (C) an adhesive layer, and (D) a heat seal layer having a heat sealable resin, a thermoplastic resin of the (D) heat sealing layer having a mixture of two types of (meth)acrylic acid ester copolymers having different glass transition temperatures and a hydrazide compound, wherein one of the (meth)acrylic acid ester copolymer in the (meth)acrylic acid ester copolymer mixture has a glass transition temperature of ?20 to 10° C. and the other (meth)acrylic acid ester copolymer has a glass transition temperature of 40 to 80° C.
    Type: Grant
    Filed: October 29, 2018
    Date of Patent: January 3, 2023
    Assignee: DENKA COMPANY LIMITED
    Inventors: Takanori Atsusaka, Akira Sasaki, Saori Niwa, Shun Uchiyama, Akihiro Yoshikawa
  • COVER FILM AND ELECTRONIC COMPONENT PACKAGE USING SAME
    Publication number: 20220242634
    Abstract: A cover film having at least a substrate layer and a sealant resin layer, wherein the sealant resin layer is formed to contact one surface of the substrate layer or is formed on an intermediate resin layer contacting one surface of the substrate layer, and the sealant resin layer contacting the substrate layer or the intermediate resin layer contacting the substrate layer contains an epoxidized fatty acid or a derivative thereof. The epoxidized fatty acid or a derivative thereof in the sealant resin layer contacting the substrate layer or in the intermediate resin layer contacting the substrate layer is preferably at a content of 0.5 parts by mass or less with respect to 100 parts by mass of a resin component constituting the intermediate resin layer contacting the substrate layer and/or the sealant resin layer contacting the substrate layer.
    Type: Application
    Filed: July 3, 2020
    Publication date: August 4, 2022
    Applicant: DENKA COMPANY LIMITED
    Inventors: Takanori ATSUSAKA, Saori NIWA, Takeshi SAITOH
  • COVER FILM
    Publication number: 20200247099
    Abstract: A cover film having at least (A) a substrate layer, (B) an intermediate layer, (C) an adhesive layer, and (D) a heat seal layer having a heat sealable resin, a thermoplastic resin of the (D) heat sealing layer having a mixture of two types of (meth)acrylic acid ester copolymers having different glass transition temperatures and a hydrazide compound, wherein one of the (meth)acrylic acid ester copolymer in the (meth)acrylic acid ester copolymer mixture has a glass transition temperature of ?20 to 10° C. and the other (meth)acrylic acid ester copolymer has a glass transition temperature of 40 to 80° C.
    Type: Application
    Filed: October 29, 2018
    Publication date: August 6, 2020
    Applicant: DENKA COMPANY LIMITED
    Inventors: Takanori ATSUSAKA, Akira SASAKI, Saori NIWA, Shun UCHIYAMA, Akihiro YOSHIKAWA