Patents by Inventor Saptarshi Mandal

Saptarshi Mandal has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230420443
    Abstract: Integrated circuit (IC) devices with diodes formed in a subfin between a support structure of an IC device and one or more nanoribbon stacks are disclosed. To alleviate challenges of limited semiconductor cross-section provided by the subfin, etch depths in the subfin (i.e., depths of recesses in the subfin formed as a part of forming the diodes) are selectively optimized and varied. Deeper recesses are made in subfin portions at which diode terminals (e.g., anodes and cathodes) are formed, to increase the semiconductor cross-section in those portions, thus providing improved subfin contacts. Shallower recesses (or no recesses) are made in subfin portion between the diode terminals, to increase subfin retention. Thus, subfin diodes may be provided in a manner that enables improved diode conductance and/or improved current carrying capabilities while advantageously using substantially the same etch processes as those used for forming nanoribbon-based transistors elsewhere in the IC device.
    Type: Application
    Filed: June 27, 2022
    Publication date: December 28, 2023
    Inventors: Nicholas A. Thomson, Ayan Kar, Kalyan C. Kolluru, Benjamin John Orr, Chu-Hsin Liang, Biswajeet Guha, Saptarshi Mandal, Brian Greene, Sameer Jayanta Joglekar, Chung-Hsun Lin, Mauro J. Kobrinsky
  • Publication number: 20230207696
    Abstract: Embodiments of the disclosure are directed to advanced integrated circuit structure fabrication and, in particular, to integrated circuits utilizing gate plugs to induce compressive channel strain. Other embodiments may be described or claimed.
    Type: Application
    Filed: December 23, 2021
    Publication date: June 29, 2023
    Inventors: Mohammad HASAN, Wonil CHUNG, Biswajeet GUHA, Saptarshi MANDAL, Pratik PATEL, Tahir GHANI, Stephen M. CEA, Anand S. MURTHY
  • Publication number: 20090261146
    Abstract: A method and apparatus is disclosed for forming a friction stir weld joint using a friction stir tool. A first metallic work material and a second metallic work material are provided and are substantially abutted to define a joint interface having a weld surface. A quantity of metallic donor material is provided and deposited into a depression formed in the weld surface along the joint interface. A friction stir welding tool having a shoulder and a pin depending from the shoulder is provided and applied against the donor material within the depression using a plunge force. The friction stir welding tool is rotated such that the pin contacts the donor material and heats the donor material to plasticize at least a portion of the donor material forming a friction stir weld joint. The friction stir welding tool is then urged along the joint interface.
    Type: Application
    Filed: March 25, 2009
    Publication date: October 22, 2009
    Inventors: Gene J. Hou, Keith M. Williamson, Saptarshi Mandal, Abdelmageed A. Elmustafa, Ayodeji Demuren, Sebastian Y. Bawab, Justin M. Rice