Abstract: Laser soldering processes are disclosed. The laser soldering process includes beaming a lower-intensity laser beam from a laser soldering system at a first position, analyzing infrared feedback of the lower-intensity laser beam at the first position, and beaming a higher-intensity laser beam at a second position, the second position corresponding with the infrared feedback of the lower-intensity laser beam. The lower-intensity laser beam generates a lower temperature below a soldering temperature of a solder material and the higher-intensity laser beam generates a higher temperature above the soldering temperature.