Abstract: A composition which is useful for bonding integrated circuits to inorganic dielectric substrates comprising an admixture of finely divided particles of a thermally conductive metal or metal-containing compound, non-aqueously milled amorphous glass frit and fatty acid-based surfactant dispersed, in a solution of primary organic solvent selected from ethylene glycol monobutyl ether acetate, dimethyl adipate and mixtures thereof and optionally minor amounts of certain secondary solvents and an acrylic polymer which is free of polar functional groups.