Patents by Inventor Sarah Colline McQuaide
Sarah Colline McQuaide has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240345385Abstract: A method of fabricating a fiber scanning system includes forming a set of piezoelectric elements. The method also includes coating an interior surface and an exterior surface of each of the set of piezoelectric elements with a first conductive material. The method also includes providing a fiber optic element having an actuation region and coating the actuation region of the fiber optic element with a second conductive material. The method also includes joining the interior surfaces of the set of piezoelectric elements to the actuation region of the fiber optic element and poling the set of piezoelectric elements. The method also includes forming electrical connections to the exterior surface of each of the set of piezoelectric elements and the fiber optic element.Type: ApplicationFiled: June 24, 2024Publication date: October 17, 2024Applicant: Magic Leap, Inc.Inventors: Emma Rae Mullen, Mina Rohani, Benjamin John Kuehn, Abhijith Rajiv, Brian T. Schowengerdt, Sarah Colline McQuaide
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Patent number: 12055706Abstract: A fiber scanning system includes a fiber optic element having an actuation region and a motion actuator mechanically coupled to the fiber optic element. A continuous bond line is present between the actuation region and the motion actuator. The fiber scanning system also includes a retention collar mechanically coupled to the motion actuator.Type: GrantFiled: December 18, 2020Date of Patent: August 6, 2024Assignee: Magic Leap, Inc.Inventors: Emma Rae Mullen, Mina Rohani, Benjamin John Kuehn, Abhijith Rajiv, Brian T. Schowengerdt, Sarah Colline McQuaide
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Patent number: 11912566Abstract: A semiconductor substrate includes a first semiconductor layer, a first dielectric layer coupled to the first semiconductor layer, and a second semiconductor layer coupled to the first dielectric layer. The second semiconductor layer includes a base portion substantially aligned with the first dielectric layer and a cantilever portion protruding from an end of the first dielectric layer. The cantilever portion includes a tapered surface tapering from a bottom surface of the second semiconductor layer toward a top surface of the second semiconductor layer.Type: GrantFiled: April 24, 2023Date of Patent: February 27, 2024Assignee: Magic Leap, Inc.Inventors: Steven Alexander-Boyd Hickman, Sarah Colline McQuaide, Abhijith Rajiv, Brian T. Schowengerdt, Charles David Melville
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Publication number: 20230264948Abstract: A semiconductor substrate includes a first semiconductor layer, a first dielectric layer coupled to the first semiconductor layer, and a second semiconductor layer coupled to the first dielectric layer. The second semiconductor layer includes a base portion substantially aligned with the first dielectric layer and a cantilever portion protruding from an end of the first dielectric layer. The cantilever portion includes a tapered surface tapering from a bottom surface of the second semiconductor layer toward a top surface of the second semiconductor layer.Type: ApplicationFiled: April 24, 2023Publication date: August 24, 2023Applicant: Magic Leap, Inc.Inventors: Steven Alexander-Boyd Hickman, Sarah Colline McQuaide, Abhijith Rajiv, Brian T. Schowengerdt, Charles David Melville
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Patent number: 11681097Abstract: A method of forming a tapered tip of a polarization-maintaining (PM) fiber includes inserting a tip of the PM fiber into a first etchant solution characterized by a first etching rate for the core of the PM fiber and a second etching rate for the stress members of the PM fiber, the second etching rate being lower than the first etching rate, withdrawing the tip of the PM fiber from the first etchant solution at a withdrawal rate, immersing the tip of the PM fiber in a second etchant solution for a time duration. The second etchant solution is characterized by a third etching rate for the core and a fourth etching rate for the stress members, the fourth etching rate being greater than the third etching rate. The method further includes withdrawing the tip of the PM fiber from the second etchant solution.Type: GrantFiled: May 12, 2021Date of Patent: June 20, 2023Assignee: Magic Leap, Inc.Inventors: Sarah Colline McQuaide, Brian T. Schowengerdt
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Patent number: 11661335Abstract: A method for fabricating a cantilever having a device surface, a tapered surface, and an end region includes providing a semiconductor substrate having a first side and a second side opposite to the first side and etching a predetermined portion of the second side to form a plurality of recesses in the second side. Each of the plurality of recesses comprises an etch termination surface. The method also includes anisotropically etching the etch termination surface to form the tapered surface of the cantilever and etching a predetermined portion of the device surface to release the end region of the cantilever.Type: GrantFiled: May 22, 2021Date of Patent: May 30, 2023Assignee: Magic Leap, Inc.Inventors: Steven Alexander-Boyd Hickman, Sarah Colline McQuaide, Abhijith Rajiv, Brian T. Schowengerdt, Charles David Melville
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Publication number: 20210363003Abstract: A method for fabricating a cantilever having a device surface, a tapered surface, and an end region includes providing a semiconductor substrate having a first side and a second side opposite to the first side and etching a predetermined portion of the second side to form a plurality of recesses in the second side. Each of the plurality of recesses comprises an etch termination surface. The method also includes anisotropically etching the etch termination surface to form the tapered surface of the cantilever and etching a predetermined portion of the device surface to release the end region of the cantilever.Type: ApplicationFiled: May 22, 2021Publication date: November 25, 2021Applicant: Magic Leap, Inc.Inventors: Steven Alexander-Boyd Hickman, Sarah Colline McQuaide, Abhijith Rajiv, Brian T. Schowengerdt, Charles David Melville
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Publication number: 20210356654Abstract: A method of forming a tapered tip of a polarization-maintaining (PM) fiber includes inserting a tip of the PM fiber into a first etchant solution characterized by a first etching rate for the core of the PM fiber and a second etching rate for the stress members of the PM fiber, the second etching rate being lower than the first etching rate, withdrawing the tip of the PM fiber from the first etchant solution at a withdrawal rate, immersing the tip of the PM fiber in a second etchant solution for a time duration. The second etchant solution is characterized by a third etching rate for the core and a fourth etching rate for the stress members, the fourth etching rate being greater than the third etching rate. The method further includes withdrawing the tip of the PM fiber from the second etchant solution.Type: ApplicationFiled: May 12, 2021Publication date: November 18, 2021Applicant: Magic Leap, Inc.Inventors: Sarah Colline McQuaide, Brian T. Schowengerdt
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Publication number: 20210223542Abstract: A fiber scanning system includes a fiber optic element having an actuation region and a motion actuator mechanically coupled to the fiber optic element. A continuous bond line is present between the actuation region and the motion actuator. The fiber scanning system also includes a retention collar mechanically coupled to the motion actuator.Type: ApplicationFiled: December 18, 2020Publication date: July 22, 2021Applicant: Magic Leap, Inc.Inventors: Emma Rae Mullen, Mina Rohani, Benjamin John Kuehn, Abhijith Rajiv, Brian T. Schowengerdt, Sarah Colline McQuaide