Patents by Inventor Sarah H. Felix
Sarah H. Felix has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11801381Abstract: The present disclosure relates to a modular system for deep brain stimulation (DBS) and electrocorticography (ECoG). The system may have an implantable neuromodulator for generating electrical stimulation signals adapted to be applied to a desired region of a brain via an attached electrode array. An aggregator module may be used for collecting and aggregating electrical signals and transmitting the electrical signals to the neuromodulator. A control module may be used which is in communication with the aggregator module for controlling generation of the electrical signals and transmitting the electrical signals to the aggregator.Type: GrantFiled: December 9, 2016Date of Patent: October 31, 2023Assignee: Lawrence Livermore National Security, LLCInventors: Satinderpall S. Pannu, Kedar G. Shah, Supin Chen, Marissa Crosetti, Timir B. Datta-Chaudhuri, Sarah H. Felix, Anna N. Ivanovskaya, Jason Jones, Kye Young Lee, Susant Patra, Vanessa Tolosa, Angela C. Tooker
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Patent number: 11357975Abstract: A cylindrical microelectrode array having an elongated cylindrical core, and a multilayer structure conformally folded around and affixed to the cylindrical core so as to extend between opposite ends of the core. The multilayer structure has integrated sections including an electrode section with electrodes exposed through electrically insulating layers, a connector section with conductive bond pads for interfacing with external electronics, and a cable section with conductive traces encapsulated in electrically insulating layers and which connect between the electrodes and their corresponding bond pads. The array may be fabricated using a planar multilayer structure having the electrode, connector, and cable sections, and conformally folding the multilayer structure around and affixing to the cylindrical core. The cable section in particular may be conformally coiled around and affixed to the cylindrical core so that the electrical conduits helically extend between the connector and electrode sections.Type: GrantFiled: June 9, 2016Date of Patent: June 14, 2022Assignee: Lawrence Livermore National Security, LLCInventors: Kedar G. Shah, Supin Chen, Sarah H. Felix, Satinderpall S. Pannu, Susant Patra, Vanessa Tolosa, Angela C. Tooker, Jason Jones
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Patent number: 10342128Abstract: Thicker electrodes are provided on microelectronic device using thermo-compression bonding. A thin-film electrical conducting layer forms electrical conduits and bulk depositing provides an electrode layer on the thin-film electrical conducting layer. An insulating polymer layer encapsulates the electrically thin-film electrical conducting layer and the electrode layer. Some of the insulating layer is removed to expose the electrode layer.Type: GrantFiled: September 23, 2016Date of Patent: July 2, 2019Assignee: Lawrence Livermore National Security, LLCInventors: Kedar G. Shah, Satinderpall S. Pannu, Vanessa Tolosa, Angela C. Tooker, Heeral J. Sheth, Sarah H. Felix, Terri L. Delima
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Publication number: 20190054295Abstract: The present disclosure relates to a modular system for deep brain stimulation (DBS) and electrocorticography (ECoG). The system may have an implantable neuromodulator for generating electrical stimulation signals adapted to be applied to a desired region of a brain via an attached electrode array. An aggregator module may be used for collecting and aggregating electrical signals and transmitting the electrical signals to the neuromodulator. A control module may be used which is in communication with the aggregator module for controlling generation of the electrical signals and transmitting the electrical signals to the aggregator.Type: ApplicationFiled: December 9, 2016Publication date: February 21, 2019Applicants: Lawrence Livermore National Security, LLC, Lawrence Livermore National Security, LLCInventors: Satinderpall S. PANNU, Kedar G. SHAH, Supin CHEN, Marissa CROSETTI, Timir B. DATTA-CHAUDHURI, Sarah H. FELIX, Anna N. IVANOVSKAYA, Jason JONES, Kye Young LEE, Susant PATRA, Vanessa TOLOSA, Angela C. TOOKER
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Publication number: 20180169406Abstract: A cylindrical microelectrode array having an elongated cylindrical core, and a multilayer structure conformally folded around and affixed to the cylindrical core so as to extend between opposite ends of the core. The multilayer structure has integrated sections including an electrode section with electrodes exposed through electrically insulating layers, a connector section with conductive bond pads for interfacing with external electronics, and a cable section with conductive traces encapsulated in electrically insulating layers and which connect between the electrodes and their corresponding bond pads. The array may be fabricated using a planar multilayer structure having the electrode, connector, and cable sections, and conformally folding the multilayer structure around and affixing to the cylindrical core. The cable section in particular may be conformally coiled around and affixed to the cylindrical core so that the electrical conduits helically extend between the connector and electrode sections.Type: ApplicationFiled: June 9, 2016Publication date: June 21, 2018Inventors: Kedar G. Shah, Supin Chen, Sarah H. Felix, Satinderpall S. Pannu, Susant Patra, Venessa Tolosa
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Patent number: 9999363Abstract: A modular, high density electrical system is disclosed which makes use of an interface component, which is well suited to being placed in contact with an anatomy of either a human or an animal, and which may be releasably coupled to an electronics module subsystem. The interface component has a plurality of electrically conductive interconnect pads that may be releasably secured by a member to a plurality of electrically conductive pads of the electronics module subsystem. The electronics module subsystem may have a substrate which supports both an electronics circuit and the interconnect pads.Type: GrantFiled: April 13, 2015Date of Patent: June 19, 2018Assignee: Lawrence Livermore National Security, LLCInventors: Kedar G. Shah, Sarah H. Felix, Satinderpall S. Pannu, Vanessa Tolosa, Angela C. Tooker
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Publication number: 20170348534Abstract: An implantable device has a cylindrical base, at least one electrode on the cylindrical base, at least one electrically conducting lead on the cylindrical base connected to the electrode wherein the electrically conducting lead has a feature size of <10 micrometers. A protective coating on the cylindrical base covers the at least one electrically conducting lead.Type: ApplicationFiled: June 29, 2017Publication date: December 7, 2017Inventors: Vanessa Tolosa, Satinderpall S. Pannu, Heeral Sheth, Angela C. Tooker, Kedar G. Shah, Sarah H. Felix
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Patent number: 9788740Abstract: A neural interface includes a first dielectric material having at least one first opening for a first electrical conducting material, a first electrical conducting material in the first opening, and at least one first interconnection trace electrical conducting material connected to the first electrical conducting material. A stiffening shank material is located adjacent the first dielectric material, the first electrical conducting material, and the first interconnection trace electrical conducting material.Type: GrantFiled: July 13, 2016Date of Patent: October 17, 2017Assignee: Lawrence Livermore National Security, LLCInventors: Angela C. Tooker, Sarah H. Felix, Satinderpall S. Pannu, Kedar G. Shah, Heeral Sheth, Vanessa Tolosa
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Patent number: 9694190Abstract: An implantable device has a cylindrical base, at least one electrode on the cylindrical base, at least one electrically conducting lead on the cylindrical base connected to the electrode wherein the electrically conducting lead has a feature size of <10 micrometers. A protective coating on the cylindrical base covers the at least one electrically conducting lead.Type: GrantFiled: March 14, 2014Date of Patent: July 4, 2017Assignee: Lawrence Livermore National Security, LLCInventors: Vanessa Tolosa, Satinderpall S. Pannu, Heeral Sheth, Angela C. Tooker, Kedar G. Shah, Sarah H. Felix
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Publication number: 20170013713Abstract: Thicker electrodes are provided on microelectronic device using thermo-compression bonding. A thin-film electrical conducting layer forms electrical conduits and bulk depositing provides an electrode layer on the thin-film electrical conducting layer. An insulating polymer layer encapsulates the electrically thin-film electrical conducting layer and the electrode layer. Some of the insulating layer is removed to expose the electrode layer.Type: ApplicationFiled: September 23, 2016Publication date: January 12, 2017Inventors: Kedar G. Shah, Satinderpall S. Pannu, Vanessa Tolosa, Angela C. Tooker, Heeral J. Sheth, Sarah H. Felix, Terri L. Delima
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Publication number: 20160338607Abstract: A neural interface includes a first dielectric material having at least one first opening for a first electrical conducting material, a first electrical conducting material in the first opening, and at least one first interconnection trace electrical conducting material connected to the first electrical conducting material. A stiffening shank material is located adjacent the first dielectric material, the first electrical conducting material, and the first interconnection trace electrical conducting material.Type: ApplicationFiled: July 13, 2016Publication date: November 24, 2016Inventors: Angela C. Tooker, Sarah H. Felix, Satinderpall S. Pannu, Kedar G. Shah, Heeral Sheth, Vanessa Tolosa
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Patent number: 9486641Abstract: An optical waveguide integrated into a multielectrode array (MEA) neural interface includes a device body, at least one electrode in the device body, at least one electrically conducting lead coupled to the at least one electrode, at least one optical channel in the device body, and waveguide material in the at least one optical channel. The fabrication of a neural interface device includes the steps of providing a device body, providing at least one electrode in the device body, providing at least one electrically conducting lead coupled to the at least one electrode, providing at least one optical channel in the device body, and providing a waveguide material in the at least one optical channel.Type: GrantFiled: March 13, 2014Date of Patent: November 8, 2016Assignee: Lawrence Livermore National Security, LLCInventors: Vanessa Tolosa, Terri L. Delima, Sarah H. Felix, Satinderpall S. Pannu, Kedar G. Shah, Heeral Sheth, Angela C. Tooker
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Patent number: 9485873Abstract: Thicker electrodes are provided on microelectronic device using thermo-compression bonding. A thin-film electrical conducting layer forms electrical conduits and bulk depositing provides an electrode layer on the thin-film electrical conducting layer. An insulating polymer layer encapsulates the electrically thin-film electrical conducting layer and the electrode layer. Some of the insulating layer is removed to expose the electrode layer.Type: GrantFiled: March 13, 2014Date of Patent: November 1, 2016Assignee: Lawrence Livermore National Security, LLCInventors: Kedar G. Shah, Satinderpall S. Pannu, Vanessa Tolosa, Angela C. Tooker, Heeral J. Sheth, Sarah H. Felix, Terri L. Delima
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Publication number: 20160296130Abstract: A modular, high density electrical system is disclosed which makes use of an interface component, which is well suited to being placed in contact with an anatomy of either a human or an animal, and which may be releasably coupled to an electronics module subsystem. The interface component has a plurality of electrically conductive interconnect pads that may be releasably secured by a member to a plurality of electrically conductive pads of the electronics module subsystem. The electronics module subsystem may have a substrate which supports both an electronics circuit and the interconnect pads.Type: ApplicationFiled: April 13, 2015Publication date: October 13, 2016Inventors: Kedar G. SHAH, Sarah H. FELIX, Satinderpall S. PANNU, Vanessa TOLOSA, Angela C. TOOKER
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Patent number: 9399128Abstract: A neural interface includes a first dielectric material having at least one first opening for a first electrical conducting material, a first electrical conducting material in the first opening, and at least one first interconnection trace electrical conducting material connected to the first electrical conducting material. A stiffening shank material is located adjacent the first dielectric material, the first electrical conducting material, and the first interconnection trace electrical conducting material.Type: GrantFiled: March 13, 2014Date of Patent: July 26, 2016Assignee: Lawrence Livermore National Security, LLCInventors: Angela C. Tooker, Sarah H. Felix, Satinderpall S. Pannu, Kedar G. Shah, Heeral Sheth, Vanessa Tolosa
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Publication number: 20160082271Abstract: An implantable device has a cylindrical base, at least one electrode on the cylindrical base, at least one electrically conducting lead on the cylindrical base connected to the electrode wherein the electrically conducting lead has a feature size of <10 micrometers. A protective coating on the cylindrical base covers the at least one electrically conducting lead.Type: ApplicationFiled: March 14, 2014Publication date: March 24, 2016Inventors: Vanessa Tolosa, Satinderpall S. Pannu, Heeral Sheth, Angela C. Tooker, Kedar G. Shah, Sarah H. Felix
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Publication number: 20140277317Abstract: A neural interface includes a first dielectric material having at least one first opening for a first electrical conducting material, a first electrical conducting material in the first opening, and at least one first interconnection trace electrical conducting material connected to the first electrical conducting material. A stiffening shank material is located adjacent the first dielectric material, the first electrical conducting material, and the first interconnection trace electrical conducting material.Type: ApplicationFiled: March 13, 2014Publication date: September 18, 2014Inventors: Angela C. Tooker, Sarah H. Felix, Satinderpall S. Pannu, Kedar G. Shah, Heeral Sheth, Vanessa Tolosa
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Publication number: 20140262462Abstract: Thicker electrodes are provided on microelectronic device using thermo-compression bonding. A thin-film electrical conducting layer forms electrical conduits and bulk depositing provides an electrode layer on the thin-film electrical conducting layer. An insulating polymer layer encapsulates the electrically thin-film electrical conducting layer and the electrode layer. Some of the insulating layer is removed to expose the electrode layer.Type: ApplicationFiled: March 13, 2014Publication date: September 18, 2014Inventors: Kedar G. Shah, Satinderpall S. Pannu, Vanessa Tolosa, Angela C. Tooker, Heeral J. Sheth, Sarah H. Felix, Terri L. Delima
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Publication number: 20140277296Abstract: An optical waveguide integrated into a multielectrode array (MEA) neural interface includes a device body, at least one electrode in the device body, at least one electrically conducting lead coupled to the at least one electrode, at least one optical channel in the device body, and waveguide material in the at least one optical channel. The fabrication of a neural interface device includes the steps of providing a device body, providing at least one electrode in the device body, providing at least one electrically conducting lead coupled to the at least one electrode, providing at least one optical channel in the device body, and providing a waveguide material in the at least one optical channel.Type: ApplicationFiled: March 13, 2014Publication date: September 18, 2014Inventors: Vanessa Tolosa, Terri L. Delima, Sarah H. Felix, Satinderpall S. Pannu, Kedar G. Shah, Heeral Sheth, Angela C. Tooker
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Publication number: 20140172051Abstract: A microelectrode array having one or more electrical conduits surrounded and insulated from each other by only a single layer of polymer (e.g. polyimide), and a method of fabricating the same. Multiple layers of an uncured polymer precursor (such as polyamic acid) are separately formed with metal layers sandwiched in between. Formation of the uncured polymer precursor layers includes deposition and heating to remove solvent only but not polymerize the precursor. Upon completing construction, the array is subjected to a high-temperature curing process that converts the uncured polymer precursor layers into the polymer. The different layers of the polymer precursor are thus covalently bonded together during the curing process to create a single continuous layer (e.g. monolithic block) of polymer, with no polymer-polymer interfaces.Type: ApplicationFiled: March 11, 2013Publication date: June 19, 2014Inventors: Satinderpall S. Pannu, Kedar G. Shah, Heeral Sheth, Sarah H. Felix, Angela C. Tooker