Patents by Inventor Sarah Hovsepian

Sarah Hovsepian has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9690286
    Abstract: A digital material skin is made of a set of discrete units with a finite set of parts and joints. The discrete units are assembled into a layer according to a regular geometry, with each of the discrete units being reversibly connected to at least one other unit in the set. The reversibly connected set of units forms an exterior structure surface that is larger than the individual discrete units. Digital material skins may be used to construct any shape or interior volume, whether regular or amorphous. The skin surface may be enclosed or open. The skin may rely on an interior digital material structure for support or may be self-supported. The skin may be part of a larger assembly or apparatus, enclosing an interior volume or structure.
    Type: Grant
    Filed: June 21, 2013
    Date of Patent: June 27, 2017
    Assignee: Massachusetts Institute of Technology
    Inventors: Sarah Hovsepian, Neil Adam Gershenfeld, Kenneth Cheung
  • Publication number: 20160070254
    Abstract: A digital material skin is made of a set of discrete units with a finite set of parts and joints. The discrete units are assembled into a layer according to a regular geometry, with each of the discrete units being reversibly connected to at least one other unit in the set. The reversibly connected set of units forms an exterior structure surface that is larger than the individual discrete units. Digital material skins may be used to construct any shape or interior volume, whether regular or amorphous. The skin surface may be enclosed or open. The skin may rely on an interior digital material structure for support or may be self-supported. The skin may be part of a larger assembly or apparatus, enclosing an interior volume or structure.
    Type: Application
    Filed: June 21, 2013
    Publication date: March 10, 2016
    Applicant: MASSACHUSETTS INSTITUTE OF TECHNOLOGY
    Inventors: Sarah Hovsepian, Neil Adam Gershenfeld, Kenneth Cheung