Abstract: Embodiments of the present invention are directed to an in-situ warpage monitoring system and method for preventing head-in-pillow (HIP) or other potential defect escapes during a solder reflow process. In a non-limiting embodiment of the invention, a product is passed through a reflow oven. The product can include a printed circuit board (PCB). An amount of warpage of the product is measured at one or more monitoring devices positioned along the reflow oven. Each measured amount of warpage is compared to a predetermined warpage limit. The product is sorted into one of a plurality of designated lots based on the comparison. The lots can include a pass lot, a fail lot, and a marginal pass lot.

Abstract: A chain-reactive, heat-generating microcapsule comprises a first compartment including a first component and a second compartment including a second component. An isolating structure separates the first and second compartments. The isolating structure may rupture when heated above a normal ambient temperature and/or in response to a compressive force. The first component reacts with the second component to produce heat. The microcapsule may further incorporate a blowing agent that responds to heating. In some embodiments, a core within the first compartment comprises a blowing agent material that responds to the heat produced when the first and second components react. The microcapsules can be incorporated into a material comprising a heat-curable resin precursor such that heat generated by the microcapsules can be used to cure the resin precursor.

Abstract: Circuit feature casting for manufacture observation is disclosed herein. According to an aspect, a method includes applying a molding material to a feature of a circuit to substantially cover the feature with the molding material. The method also includes curing the molding material. Further, the method includes separating the molding material from the feature to reveal a cast of the feature of the circuit.

Abstract: A multi-layer thermal interface material including two or more thermal interface materials laminated together, where each of the two or more thermal interface materials comprise different mechanical properties.

Abstract: An adhesive composition includes a photoinitiator and an acrylate-cyanoacrylate monomer. The acrylate-cyanoacrylate monomer includes at least one acrylate functional group to enable photo-curing of the adhesive composition and at least one cyanoacrylate functional group to enable latent curing of the adhesive composition.

Abstract: A microcapsule, a method, and an article of manufacture. The microcapsule includes a degradable shell and a polymerizing agent encapsulated by the degradable shell. The method includes selecting a polymerizing agent, encapsulating the polymerizing agent in a degradable shell, and rupturing the degradable shell by exposure to an energy source, such as a laser, a UV radiation source, and/or a heat source. The article of manufacture includes a microcapsule having a degradable shell and a polymerizing agent encapsulated by the degradable shell.

Abstract: A method of forming a coaxial wire that includes providing a sacrificial trace structure using an additive forming method, the sacrificial trace structure having a geometry for the coaxial wire, and forming a continuous seed metal layer on the sacrificial trace structure. The sacrificial trace structure may be removed and a first interconnect metal layer may be formed on the continuous seed layer. An electrically insulative layer may then be formed on the first interconnect metal layer, and a second interconnect metal layer is formed on the electrically insulative layer. Thereafter, a dielectric material is formed on the second interconnect metal layer to encapsulate a majority of an assembly of the first interconnect metal layer, electrically insulative layer and second interconnect metal layer that provides said coaxial wire. Ends of the coaxial wire may be exposed through opposing surfaces of the dielectric material to provide that the coaxial wire extends through that dielectric material.

Abstract: According to one aspect, a glass-free pre-impregnated material includes a polybenzimidazole (PBI) sheet and a partially cured resin encapsulating the PBI sheet. According to another aspect, a process of forming a glass-free pre-impregnated material includes encapsulating a PBI sheet within a resin and partially curing the resin to form the glass-free pre-impregnated material. According to yet another aspect, a printed circuit board comprises a glass-free dielectric layer that includes a PBI sheet encapsulated within a cured resin.

Abstract: Acoustic dampeners, methods of making acoustic dampener, and uses thereof are described. The acoustic dampener includes a polymer foam article; and a metal-organic framework portion. The metal-organic framework portion comprises a metal-organic framework in a polymer matrix. The metal-organic framework portion is adhered to, or otherwise coupled to or included with, the polymer foam article. Such an acoustic dampener can be used in a computer equipment cabinet.

Abstract: Circuit feature casting for manufacture observation is disclosed herein. According to an aspect, a method includes applying a molding material to a feature of a circuit to substantially cover the feature with the molding material. The method also includes curing the molding material. Further, the method includes separating the molding material from the feature to reveal a cast of the feature of the circuit.

Abstract: In an embodiment, a method of forming a stub-less via is provided. The method includes depositing a plurality of microcapsules containing a metal material in a via of a printed circuit board (PCB); rupturing the microcapsules and releasing the metal material; and sintering the metal material. In another embodiment, a method of forming a stub-less via is provided. The method includes forming a via in a printed circuit board (PCB); installing a plug in a portion of the via; depositing in the via a plurality of nanoparticles containing a metal material; and sintering the metal material.

Abstract: A device includes a syringe, which has a tip, plunger, and barrel containing a fluid. The device also includes a needle electrode coupled to the tip of the syringe, a release component, and a control component configured to receive electrical measurements made by the needle electrode, determine impedance values from the electrical measurements, and identify a target tissue based on the impedance values. In response to the identification, the control component generates instructions to reposition a release component. A method includes receiving electrical measurements from a needle electrode, determining impedance values based on the electrical measurements. A target tissue is identified based on the impedance values, and a release component is repositioned in response.

Abstract: Forming a thermal interface material structure includes forming an assembly that includes a thermal interface material disposed between a first mating surface and a second mating surface. The first mating surface is associated with a module lid, and the second mating surface is associated with a heat sink. Protruding surface features are incorporated onto the first mating surface or the second mating surface. The process also includes compressing the assembly to form a thermal interface material structure. The thermal interface material structure includes the thermal interface material disposed within an interface defined by the first mating surface and the second mating surface. The protruding surface features protrude from the first mating surface or the second mating surface into selected areas of the interface to limit relative movement of the mating surfaces into the selected areas during thermal cycling to reduce thermal interface material migration out of the interface.

Abstract: A material, a process for forming a biocidal material, and an article of manufacture. The material includes a particle and first and second functionalities bound to first and second faces of the particle. At least one of the first and second functionalities are biocides. The process includes forming colloidosomes having particles with exposed first faces partially embedded in a wax droplet. The process also includes selecting first and second functionalities, wherein at least one of the first and second functionalities are biocides, and binding the first functionalities to the first faces of the particles. Further, the process includes removing the particles from the colloidosome, and binding the second functionalities to the second faces. The article of manufacture includes a polymer matrix, particles, first functionalities bound to first faces of the particles, and second functionalities bound to second faces of the particles.

Abstract: A method and a system for detecting defects in plated-through hole by partially submerging a printed circuit board in a fluid bath. The method includes partially submerging a printed circuit board on a first side and measuring a capillary height difference within a plated-through hole and the surrounding fluid bath. The method further includes partially submerging the printed circuit board on a second side and measuring a second capillary height difference within the plated-through hole and the surrounding fluid bath. The method also includes comparing the measured values with predetermined values to determine the quality of the plated-through hole.

Abstract: A method and a system for non-destructively detecting defects within and/or on plated-through holes are provided. The method includes sealing a plated-through hole on a printed circuit board to detect for possible defects along the sidewall of the plated-through hole. The method further includes applying an airflow through the plated-through hole and measuring the airflow entering the plated-through hole at the gasket to determine the initial airflow calculation. The method also includes measuring the airflow again as it exits the plated-through hole to determine an exit airflow calculation. A determination of the quality of the plated-through hole is made by the method by analyzing the initial airflow calculation and the exit airflow calculation.

Abstract: A shoe may include an upper sole and an outer sole. In one state of the shoe, the upper sole is conductively connected to the outer sole. In another state of the shoe, the upper sole is electrically insulated from the outer sole. The shoe may be changed between these states.

Abstract: In an embodiment, a plug formulation includes a mixture of a first part of a two-part epoxy system and artificial platelets formed from a polymeric material that expands upon exposure to ultraviolet (UV) light, moisture, or heat, wherein a portion of the first part of the two-part epoxy system is covalently bonded to a portion of the artificial platelets. In another embodiment, a plug formulation includes a mixture of a first part of a two-part epoxy system, an acrylate monomer, and artificial platelets formed from a polymeric material that expands upon exposure to ultraviolet (UV) light, moisture, or heat, wherein a portion of the first part of the two-part epoxy system is covalently bonded to a portion of the artificial platelets.

Abstract: A method, composition, and article of manufacture. The method can include depositing a layer, which includes a set of particles and a set of microcapsules encapsulating polymerizing agents. The method can also include fusing particles in selected areas of the layer with a laser, and rupturing at least a portion of microcapsules using at least one energy source selected from the laser, an ultraviolet (UV) radiation source, and a heat source. The composition can include a set of particles and a set of microcapsules, each containing a polymerizing agent encapsulated by a degradable shell. The article of manufacture can include fused layers that include fused particles and pores sealed in reactions with polymerizing agents released from degradable microcapsules.

Abstract: A microcapsule, a method, and an article of manufacture. The microcapsule includes a degradable shell and a polymerizing agent encapsulated by the degradable shell. The method includes selecting a polymerizing agent, encapsulating the polymerizing agent in a degradable shell, and rupturing the degradable shell by exposure to an energy source, such as a laser, a UV radiation source, and/or a heat source. The article of manufacture includes a microcapsule having a degradable shell and a polymerizing agent encapsulated by the degradable shell.