Patents by Inventor Sarah Schwab

Sarah Schwab has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer-scale package for surface acoustic wave circuit and method of manufacturing the same
    Patent number: 6744336
    Abstract: A surface acoustic wave (SAW) circuit package and a method of fabricating the package. In one embodiment, the package includes: (1) a substantially planar piezoelectric substrate, (2) SAW circuit conductors located over the substrate and (3) a passivation layer located over the SAW circuit conductors, the substrate and the passivation layer cooperating to form a hermetic seal to isolate the SAW circuit conductors from an environment proximate the package.
    Type: Grant
    Filed: October 15, 2002
    Date of Patent: June 1, 2004
    Assignee: Clarisay, Incorporated
    Inventors: Martin Goetz, Sarah Schwab
  • Wafer-scale package for surface acoustic wave circuit and method of manufacturing the same
    Patent number: 6650205
    Abstract: A surface acoustic wave (SAW) circuit package and a method of fabricating the package. In one embodiment, the package includes: (1) a substantially planar piezoelectric substrate, (2) SAW circuit conductors located over the substrate and (3) a passivation layer located over the SAW circuit conductors, the substrate and the passivation layer cooperating to form a hermetic seal to isolate the SAW circuit conductors from an environment proximate the package.
    Type: Grant
    Filed: March 29, 2001
    Date of Patent: November 18, 2003
    Assignee: Clarisay, Inc.
    Inventors: Martin Goetz, Sarah Schwab
  • Wafer-scale package for surface acoustic wave circuit and method of manufacturing the same
    Publication number: 20020140525
    Abstract: A surface acoustic wave (SAW) circuit package and a method of fabricating the package. In one embodiment, the package includes: (1) a substantially planar piezoelectric substrate, (2) SAW circuit conductors located over the substrate and (3) a passivation layer located over the SAW circuit conductors, the substrate and the passivation layer cooperating to form a hermetic seal to isolate the SAW circuit conductors from an environment proximate the package.
    Type: Application
    Filed: March 29, 2001
    Publication date: October 3, 2002
    Inventors: Martin Goetz, Sarah Schwab