Patents by Inventor Sarah Wen

Sarah Wen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240081941
    Abstract: Ultrasound imaging is a non-invasive, non-radioactive, and low cost technology for diagnosis and identification of implantable medical devices in real time. Developing new ultrasound activated coatings is important to broaden the utility of in vivo marking by ultrasound imaging. Ultrasound responsive macro-phase segregated micro-composite thin films were developed to be coated on medical devices composed of multiple materials and with multiple shapes and varying surface area. The macro-phase segregated films having silica micro-shells in polycyanoacrylate produces strong color Doppler signals with the use of a standard clinical ultrasound transducer. Electron microscopy showed a macro-phase separation during slow curing of the cyanoacrylate adhesive, as air-filled silica micro-shells were driven to the surface of the film. The air sealed in the hollow space of the silica shells acted as an ultrasound contrast agent and echo decorrelation of air exposed to ultrasound waves produces color Doppler signals.
    Type: Application
    Filed: November 13, 2023
    Publication date: March 14, 2024
    Inventors: Jian Yang, Alexander Liberman, James Wang, Christopher Barback, Natalie Mendez, Erin Ward, Sarah Blair, Andrew C. Kummel, Tsai-Wen Sung, William C. Trogler
  • Publication number: 20190382900
    Abstract: Stable electroless copper plating baths include imidazolium compounds to improve rate of copper deposition on substrates. The copper from the electroless plating baths can be plated at low temperatures and at high plating rates.
    Type: Application
    Filed: May 1, 2019
    Publication date: December 19, 2019
    Inventors: Alejo M. Lifschitz Arribio, Patricia Gumbley, Michael Lipschutz, Feng Liu, Catherine Mulzer, Sarah Wen
  • Publication number: 20190382901
    Abstract: Stable electroless copper plating baths include pyridinium compounds to improve rate of copper deposition on substrates. The copper from the electroless plating baths can be plated at low temperatures and at high plating rates.
    Type: Application
    Filed: May 1, 2019
    Publication date: December 19, 2019
    Inventors: Alejo M. Lifschitz Arribio, Patricia Gumbley, Michael Lipschutz, Feng Liu, Catherine Mulzer, Sarah Wen