Patents by Inventor Sarah Xu

Sarah Xu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240158412
    Abstract: Described herein are compounds that are useful in treating a USP7-mediated disorder. In some embodiments, the USP7-mediated disorder is cancer.
    Type: Application
    Filed: February 7, 2022
    Publication date: May 16, 2024
    Inventors: Xianhai HUANG, Takao SUZUKI, Sarah BOYCE, Yan ZHANG, Zhaowu XU, Alexandre COTE, Jeremy GREENWOOD, Heidi KOLDSOE, Eric THERRIEN, Michael TRZOSS, Jiayi XU
  • Publication number: 20240131974
    Abstract: Aspects of the present invention relate to a method (500) of fabricating a cover for an interior trim component or an exterior trim component for a vehicle. The method comprising forming a 3D knitted structure (510) by knitting together at least one heat activated yarn and at least one non-heat activated yarn. The structure may be arranged whereby, during a subsequent heat treatment process (520) in which the cover is heated to a temperature at or above an activation temperature, the heat-activated yarn is activated thereby to form an automotive cover having a knitted structure of increased stiffness once cooled.
    Type: Application
    Filed: February 17, 2022
    Publication date: April 25, 2024
    Inventors: Belinda MASON, Sarah-Kate FRASER, Gege XU, Robert CROW
  • Patent number: 11962002
    Abstract: The present disclosure concerns lithium zirconium phosphate (LZP) chemical oxides for coated cathode active materials, which are useful in cathodes (i.e., positive electrodes) of rechargeable lithium-batteries for reversibly storing lithium ions (Li+).
    Type: Grant
    Filed: September 7, 2023
    Date of Patent: April 16, 2024
    Assignee: QuantumScape Battery, Inc.
    Inventors: Cheng-Chieh Chao, Sarah Chavez, Hyeseung Chung, Seitaro Ito, Yuki Katoh, Konstantin Lokshin, Akinari Ohash, Jessa Silver, Yaosen Tian, Virgil Xu, Zhenfeng Yu
  • Publication number: 20240091412
    Abstract: Curable compounds, hydrogels, build materials, and methods of 3D printing are described herein. In some embodiments, a build material for 3D printing described herein comprises one or more compounds having the structure(s) of Formula (I) and/or Formula (II) herein. Such a build material may also comprise an additional acrylate component and water.
    Type: Application
    Filed: September 21, 2022
    Publication date: March 21, 2024
    Inventors: Pingyong Xu, Michael Brady, Jeff Banning, Sarah Patty, Peter Scott Turner, Monica Keilsohn
  • Patent number: 11934256
    Abstract: In accordance with various embodiments of the present disclosure, a first instance of a data intake and query system (DIQS) may receive latency data that indicates latency states of second instances of the DIQS, the latency states indicative of latencies associated with processing of event data by the plurality of second instances. The first instance may then determine overall latency state of the first instance based, at least in part, on determining number or percentage of the first instance and the second instances of the DIQS having one or more particular latency states, and determining whether the number or percentage of the first instance and the f second instances of the DIQS having the one or more particular latency states is equal to or exceeds a threshold. The first instance may then present the overall latency state of the first instance.
    Type: Grant
    Filed: June 1, 2021
    Date of Patent: March 19, 2024
    Assignee: SPLUNK INC.
    Inventors: Vitaly Akulov, Amritpal Singh Bath, William King Colgate, Sarah Harun, Jibang Liu, Vishal Patel, Tingjin Xu
  • Patent number: 6556082
    Abstract: A temperature compensating circuit for use with a current mirror circuit for maintaining a reference current value during temperature variations includes a compensating transistor connected in parallel with a reference current transistor and bias circuitry for biasing the compensating transistor whereby current flows from the reference node to ground through the compensating transistor to remove excess current from the reference transistor when temperature increases. A diode can be included in the bias circuitry for limiting bias current flow when the reference voltage drops below the voltage drop of the diode. An on/off switch circuit can be provided in parallel with the reference current transistor to further reduce reference current in specific applications.
    Type: Grant
    Filed: October 12, 2001
    Date of Patent: April 29, 2003
    Assignee: EiC Corporation
    Inventors: Nanlei Larry Wang, Sarah Xu, Shuo-Yuan Hsiao
  • Publication number: 20030071688
    Abstract: A temperature compensating circuit for use with a current mirror circuit for maintaining a reference current value during temperature variations includes a compensating transistor connected in parallel with a reference current transistor and bias circuitry for biasing the compensating transistor whereby current flows from the reference node to ground through the compensating transistor to remove excess current from the reference transistor when temperature increases. A diode can be included in the bias circuitry for limiting bias current flow when the reference voltage drops below the voltage drop of the diode. An on/off switch circuit can be provided in parallel with the reference current transistor to further reduce reference current in specific applications.
    Type: Application
    Filed: October 12, 2001
    Publication date: April 17, 2003
    Applicant: EiC Corporation
    Inventors: Nanlei Larry Wang, Sarah Xu, Shuo-Yuan Hsiao