Patents by Inventor Saravana Ranganathan Damodaran

Saravana Ranganathan Damodaran has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9487881
    Abstract: An apparatus is disclosed for electroplating an inside wall of a transfer mold, the transfer mold being suitable for use in semiconductor device encapsulation. Specifically, the apparatus comprises a fixture, as well as a through-hole in the fixture for receiving an electrode to electroplate the inside wall of the transfer mold. In particular, the through-hole is configured to receive the electrode in a slide-fit to form a mutual interference fit for securing the electrode to the fixture. Upon fitting the electrode into the through-hole, the apparatus can then be used to electroplate the inside wall of the transfer mold by introducing the electrode into the space adjacent to the inside wall of the transfer mold. A device for use as an electrode in the apparatus is also disclosed.
    Type: Grant
    Filed: July 18, 2011
    Date of Patent: November 8, 2016
    Assignee: ASM TECHNOLOGY SINGAPORE PTE LTD
    Inventors: Shu Chuen Ho, Kai Fat Yip, Eng Cheng Chng, Yew Lan Ngo, Saravana Ranganathan Damodaran
  • Publication number: 20130020193
    Abstract: An apparatus is disclosed for electroplating an inside wall of a transfer mold, the transfer mold being suitable for use in semiconductor device encapsulation. Specifically, the apparatus comprises a fixture, as well as a through-hole in the fixture for receiving an electrode to electroplate the inside wall of the transfer mold. In particular, the through-hole is configured to receive the electrode in a slide-fit to form a mutual interference fit for securing the electrode to the fixture. Upon fitting the electrode into the through-hole, the apparatus can then be used to electroplate the inside wall of the transfer mold by introducing the electrode into the space adjacent to the inside wall of the transfer mold. A device for use as an electrode in the apparatus is also disclosed.
    Type: Application
    Filed: July 18, 2011
    Publication date: January 24, 2013
    Inventors: Shu Chuen HO, Kai Fat YIP, Eng Cheng CHNG, Yew Lan NGO, Saravana Ranganathan DAMODARAN
  • Publication number: 20110148113
    Abstract: A damper which effectively dampens vibrations experienced by a shaft in a drive train of a wind turbine generator, such as a main shaft of the WTG, is disclosed. The damper includes a vibration sensor adapted to provide a vibration signal in response to the vibrations of the shaft, an electromagnet adapted to provide an electromagnetic force to the shaft, and a controller operably coupled to the vibration sensor and the electromagnet. The controller is adapted to generate command signals to provide a suitable drive current to the electromagnet in response to the vibration signal, and the electromagnet is adapted to provide an electromagnetic force to the shaft and thereby actively dampen the vibrations of the shaft.
    Type: Application
    Filed: December 17, 2010
    Publication date: June 23, 2011
    Applicant: VESTAS WIND SYSTEMS A/S
    Inventors: Huaizhong Li, Saravana Ranganathan Damodaran, Srikanth Narasimalu