Patents by Inventor Sarel Bin Ismail

Sarel Bin Ismail has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit package fabrication
    Patent number: 9859197
    Abstract: A method of making an integrated circuit (“IC”) device includes forming a lead frame in a lead frame strip. Only portions of the lead frame are plated with a conductor. A die pad is attached to an unplated portion of said lead frame.
    Type: Grant
    Filed: April 21, 2015
    Date of Patent: January 2, 2018
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Lee Han Meng@ Eugene Lee, Sueann Lim Wei Fen, Sarel Bin Ismail
  • Lead frame with abutment surface
    Patent number: 9184119
    Abstract: A lead frame device may include an integral die pad member, two separate finger members, a central body portion, each of the finger members have a top and a bottom surface connected by a peripheral edge surface. The lead frame also has a first ear portion, and a second ear portion, each has an ear top surface and an ear bottom surface coplanar with the top surface and bottom surface of the central body portion. The lead frame also has a first longitudinally extending groove and second longitudinally extending groove separate the first ear portion and the second ear portion from the central portion. The first ear portion and the second ear portion each have an abutment surface.
    Type: Grant
    Filed: April 21, 2015
    Date of Patent: November 10, 2015
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Lee Han Meng@ Eugene Lee, Sueann Lim Wei Fen, Sarel Bin Ismail
  • LEAD FRAME WITH ABUTMENT SURFACE
    Publication number: 20150228563
    Abstract: A lead frame device may include an integral die pad member, two separate finger members, a central body portion, each of the finger members have a top and a bottom surface connected by a peripheral edge surface. The lead frame also has a first ear portion, and a second ear portion, each has an ear top surface and an ear bottom surface coplanar with the top surface and bottom surface of the central body portion. The lead frame also has a first longitudinally extending groove and second longitudinally extending groove separate the first ear portion and the second ear portion from the central portion. The first ear portion and the second ear portion each have an abutment surface.
    Type: Application
    Filed: April 21, 2015
    Publication date: August 13, 2015
    Inventors: Lee Han Meng@ Eugene Lee, Sueann Lim Wei Fen, Sarel Bin Ismail
  • INTEGRATED CIRCUIT PACKAGE FABRICATION
    Publication number: 20150228581
    Abstract: A method of making an integrated circuit (“IC”) device includes forming a lead frame in a lead frame strip. Only portions of the lead frame are plated with a conductor. A die pad is attached to an unplated portion of said lead frame.
    Type: Application
    Filed: April 21, 2015
    Publication date: August 13, 2015
    Inventors: Lee Han Meng@ Eugene Lee, Sueann Lim Wei Fen, Sarel Bin Ismail
  • Integrated circuit package and method of making
    Patent number: 9013028
    Abstract: An integrated circuit (“IC”) device and method of making it. The IC device may include a conductive lead frame that has a die pad with a relatively larger central body portion and at least one relatively smaller peripheral portion in electrical continuity with the central body portion. The peripheral portion(s) project laterally outwardly from the central body portion of the die pad. Lateral displacement of a portion(s) of an encapsulation layer overlying the peripheral portion(s) is resisted by abutting surfaces on the peripheral portion(s) and the encapsulation layer.
    Type: Grant
    Filed: January 4, 2013
    Date of Patent: April 21, 2015
    Assignee: Texas Instruments Incorporated
    Inventors: Lee Han Meng@Eugene Lee, Sueann Lim Wei Fen, Sarel Bin Ismail
  • INTEGRATED CIRCUIT PACKAGE AND METHOD OF MAKING
    Publication number: 20140191380
    Abstract: An integrated circuit (“IC”) device and method of making it. The IC device may include a conductive lead frame that has a die pad with a relatively larger central body portion and at least one relatively smaller peripheral portion in electrical continuity with the central body portion. The peripheral portion(s) project laterally outwardly from the central body portion of the die pad. Lateral displacement of a portion(s) of an encapsulation layer overlying the peripheral portion(s) is resisted by abutting surfaces on the peripheral portion(s) and the encapsulation layer.
    Type: Application
    Filed: January 4, 2013
    Publication date: July 10, 2014
    Applicant: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Lee Han Meng@Eugene Lee, Sueann Lim Wei Fen, Sarel Bin Ismail