Abstract: A method comprising forming a mesoporous conductive layer and depositing a capacitive material within pores of the mesoporous conductive layer through a thickness of the mesoporous conductive layer. The mesoporous conductive layer may be formed by physical deposition or electrodeposition of gold, platinum or titanium, and the capacitive material may be Ru, Ni, Fe, Co, Ir or Mn, yielding a mesoporous electrode. Two such electrodes may be assembled using a solid electrolyte, yielding an all-solid-state supercapacitor. The mesoporous conductive layer may be deposited on a substrate provided with an interdigitated electrode resin mask, and the resin mask removed after depositing the capacitive material within pores of the mesoporous conductive layer, to yield interdigitated electrodes.