Patents by Inventor Sarjerao Pingale

Sarjerao Pingale has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • COMPOSITE INTERCONNECTION CONDUITS FOR HVAC SYSTEMS
    Publication number: 20230417427
    Abstract: A heating, ventilation, and/or air conditioning (HVAC) packaged unit includes a first refrigerant circuit component configured to change a temperature or a pressure of a refrigerant flowing through the first refrigerant circuit component and a second refrigerant circuit component configured to change a temperature or a pressure of the refrigerant flowing through the second refrigerant circuit component. The first and the second refrigerant circuit components are within a common refrigerant circuit that is disposed within a common support structure. The HVAC packaged unit also includes an interconnection conduit having a length formed from aluminum, a first end segment coupled to a first end of the length, and a second end segment coupled to a second end of the length. The first end segment and the second end segment are each formed from copper, and the interconnection conduit extends between the first refrigerant circuit component and the second refrigerant circuit component.
    Type: Application
    Filed: September 11, 2023
    Publication date: December 28, 2023
    Inventors: Sarjerao Pingale, Manjur Tamboli, Neelkanth S. Gupte, Anand Talikot, Baskaran Kandhappan
  • Composite interconnection conduits for HVAC systems
    Patent number: 11754298
    Abstract: A heating, ventilation, and/or air conditioning (HVAC) packaged unit includes a first refrigerant circuit component configured to change a temperature or a pressure of a refrigerant flowing through the first refrigerant circuit component and a second refrigerant circuit component configured to change a temperature or a pressure of the refrigerant flowing through the second refrigerant circuit component. The first and the second refrigerant circuit components are within a common refrigerant circuit that is disposed within a common support structure. The HVAC packaged unit also includes an interconnection conduit having a length formed from aluminum, a first end segment coupled to a first end of the length, and a second end segment coupled to a second end of the length. The first end segment and the second end segment are each formed from copper, and the interconnection conduit extends between the first refrigerant circuit component and the second refrigerant circuit component.
    Type: Grant
    Filed: September 13, 2021
    Date of Patent: September 12, 2023
    Assignee: Johnson Controls Tyco IP Holdings LLP
    Inventors: Sarjerao Pingale, Manjur Tamboli, Neelkanth S. Gupte, Anand Talikot, Baskaran Kandhappan
  • COMPOSITE INTERCONNECTION CONDUITS FOR HVAC SYSTEMS
    Publication number: 20220065468
    Abstract: A heating, ventilation, and/or air conditioning (HVAC) packaged unit includes a first refrigerant circuit component configured to change a temperature or a pressure of a refrigerant flowing through the first refrigerant circuit component and a second refrigerant circuit component configured to change a temperature or a pressure of the refrigerant flowing through the second refrigerant circuit component. The first and the second refrigerant circuit components are within a common refrigerant circuit that is disposed within a common support structure. The HVAC packaged unit also includes an interconnection conduit having a length formed from aluminum, a first end segment coupled to a first end of the length, and a second end segment coupled to a second end of the length. The first end segment and the second end segment are each formed from copper, and the interconnection conduit extends between the first refrigerant circuit component and the second refrigerant circuit component.
    Type: Application
    Filed: September 13, 2021
    Publication date: March 3, 2022
    Inventors: Sarjerao Pingale, Manjur Tamboli, Neelkanth S. Gupte, Anand Talikot, Baskaran Kandhappan
  • Composite interconnection conduits for HVAC systems
    Patent number: 11118795
    Abstract: A heating, ventilation, and/or air conditioning (HVAC) packaged unit includes a first refrigerant circuit component configured to change a temperature or a pressure of a refrigerant flowing through the first refrigerant circuit component and a second refrigerant circuit component configured to change a temperature or a pressure of the refrigerant flowing through the second refrigerant circuit component. The first and the second refrigerant circuit components are within a common refrigerant circuit that is disposed within a common support structure. The HVAC packaged unit also includes an interconnection conduit having a length formed from aluminum, a first end segment coupled to a first end of the length, and a second end segment coupled to a second end of the length. The first end segment and the second end segment are each formed from copper, and the interconnection conduit extends between the first refrigerant circuit component and the second refrigerant circuit component.
    Type: Grant
    Filed: February 28, 2019
    Date of Patent: September 14, 2021
    Assignee: Johnson Controls Technology Company
    Inventors: Sarjerao Pingale, Manjur Tamboli, Neelkanth S. Gupte, Anand Talikot, Baskaran Kandhappan
  • COMPOSITE INTERCONNECTION CONDUITS FOR HVAC SYSTEMS
    Publication number: 20200256567
    Abstract: A heating, ventilation, and/or air conditioning (HVAC) packaged unit includes a first refrigerant circuit component configured to change a temperature or a pressure of a refrigerant flowing through the first refrigerant circuit component and a second refrigerant circuit component configured to change a temperature or a pressure of the refrigerant flowing through the second refrigerant circuit component. The first and the second refrigerant circuit components are within a common refrigerant circuit that is disposed within a common support structure. The HVAC packaged unit also includes an interconnection conduit having a length formed from aluminum, a first end segment coupled to a first end of the length, and a second end segment coupled to a second end of the length. The first end segment and the second end segment are each formed from copper, and the interconnection conduit extends between the first refrigerant circuit component and the second refrigerant circuit component.
    Type: Application
    Filed: February 28, 2019
    Publication date: August 13, 2020
    Inventors: Sarjerao Pingale, Manjur Tamboli, Neelkanth S. Gupte, Anand Talikot, Baskaran Kandhappan