Patents by Inventor Sarma VMK Vedhanabhatla

Sarma VMK Vedhanabhatla has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD AND APPARATUS FOR MAINTAINING COOLING OF MODULAR ELECTRONIC SYSTEM DURING MODULE REMOVAL
    Publication number: 20210410312
    Abstract: A method that includes receiving an indication at a modular electronic system of initiation of online removal for a module removably inserted into a slot of the modular electronic system, increasing a fan speed at the modular electronic system before the module is removed, monitoring an internal temperature at the modular electronic system, and providing an indication that the module is ready for removal upon reaching a specified cooling state at the modular electronic system based on the temperature monitoring. A panel on an adjacent module is opened and extends into the slot upon removal of the module to substantially block airflow bypass from the slot and maintain cooling within the modular electronic system. An apparatus and logic are also disclosed herein.
    Type: Application
    Filed: September 9, 2021
    Publication date: December 30, 2021
    Inventors: Rohit Dev Gupta, Joel Richard Goergen, Sarma VMK Vedhanabhatla, Damaruganath Pinjala, Jatin Kohli, Robert Gregory Twiss
  • METHOD AND APPARATUS FOR MAINTAINING COOLING OF MODULAR ELECTRONIC SYSTEM DURING MODULE REMOVAL
    Publication number: 20200221596
    Abstract: In one embodiment, a method includes receiving an indication at a modular electronic system of initiation of online removal for a module removably inserted into a slot of the modular electronic system, increasing a fan speed at the modular electronic system before the module is removed, monitoring an internal temperature at the modular electronic system, and providing an indication that the module is ready for removal upon reaching a specified cooling state at the modular electronic system based on the temperature monitoring. A panel on an adjacent module is opened and extends into the slot upon removal of the module to substantially block airflow bypass from the slot and maintain cooling within the modular electronic system. An apparatus and logic are also disclosed herein.
    Type: Application
    Filed: March 16, 2020
    Publication date: July 9, 2020
    Applicant: CISCO TECHNOLOGY, INC.
    Inventors: Rohit Dev Gupta, Joel Richard Goergen, Sarma VMK Vedhanabhatla, Damaruganath Pinjala, Jatin Kohli, Robert Gregory Twiss
  • Method and apparatus for maintaining cooling of modular electronic system during module removal
    Patent number: 10631424
    Abstract: In one embodiment, a method includes receiving an indication at a modular electronic system of initiation of online removal for a module removably inserted into a slot of the modular electronic system, increasing a fan speed at the modular electronic system before the module is removed, monitoring an internal temperature at the modular electronic system, and providing an indication that the module is ready for removal upon reaching a specified cooling state at the modular electronic system based on the temperature monitoring. A panel on an adjacent module is opened and extends into the slot upon removal of the module to substantially block airflow bypass from the slot and maintain cooling within the modular electronic system. An apparatus and logic are also disclosed herein.
    Type: Grant
    Filed: June 30, 2017
    Date of Patent: April 21, 2020
    Assignee: CISCO TECHNOLOGY, INC.
    Inventors: Rohit Dev Gupta, Joel Richard Goergen, Sarma VMK Vedhanabhatla, Damaruganath Pinjala, Jatin Kohli, Robert Gregory Twiss
  • METHOD AND APPARATUS FOR MAINTAINING COOLING OF MODULAR ELECTRONIC SYSTEM DURING MODULE REMOVAL
    Publication number: 20190008066
    Abstract: In one embodiment, a method includes receiving an indication at a modular electronic system of initiation of online removal for a module removably inserted into a slot of the modular electronic system, increasing a fan speed at the modular electronic system before the module is removed, monitoring an internal temperature at the modular electronic system, and providing an indication that the module is ready for removal upon reaching a specified cooling state at the modular electronic system based on the temperature monitoring. A panel on an adjacent module is opened and extends into the slot upon removal of the module to substantially block airflow bypass from the slot and maintain cooling within the modular electronic system. An apparatus and logic are also disclosed herein.
    Type: Application
    Filed: June 30, 2017
    Publication date: January 3, 2019
    Applicant: CISCO TECHNOLOGY, INC.
    Inventors: Rohit Dev Gupta, Joel Richard Goergen, Sarma VMK Vedhanabhatla, Damaruganath Pinjala, Jatin Kohli, Robert Gregory Twiss