Abstract: An ultrasonic bonding device includes a bonding head movable and/or positionable in a movement axis and rotatable and/or positionable about a rotational axis. The bonding head has a tool for ultrasonically bonding a bonding wire and a transducer module for exciting the tool to produce ultrasonic vibrations. The ultrasonic bonding device further includes: a stationary wire supply for the bonding wire; an elongated wire feed that is cylindrical in cross-section; a first wire guiding module having an inlet and outlet opening for the bonding wire, and being associated with the tool such that bonding wire emerging from the outlet opening is guided under the tool; and a second wire guiding module having an elongated guide channel for the bonding wire, the second guide channel having an inlet and outlet opening, the second wire guiding module being provided between the wire feed and the first wire guiding module.

Abstract: A hold-down tool for a laser welding system. A tubular hollow body has a lateral surface that is designed to be closed in a laminar manner at least in some sections. A tool insert is formed as a contact element which is flexibly held on the hollow body and provides a tool contact surface for bringing the tool insert into contact with a first contact component to be welded.

Abstract: A hold-down tool for a laser welding system, comprising a tubular hollow body which has a lateral surface that is designed to be closed in a laminar manner at least in some sections. At least one contact element is designed to be flexible and/or is held in a flexible manner and provides a tool contact surface for bringing the contact element into contact with a contact component to be welded. A laser welding system comprising a laser source, which comprises an optical unit for shaping a laser beam provided by the laser source and for providing a focused laser beam, and comprises the hold-down tool. The focused laser beam being guided through the hollow body of the hold-down tool.

Abstract: An ultrasonic bonding device includes a bonding head movable and/or positionable in a movement axis and rotatable and/or positionable about a rotational axis. The bonding head has a tool for ultrasonically bonding a bonding wire and a transducer module for exciting the tool to produce ultrasonic vibrations. The ultrasonic bonding device further includes: a stationary wire supply for the bonding wire; an elongated wire feed that is cylindrical in cross-section; a first wire guiding module having an inlet and outlet opening for the bonding wire, and being associated with the tool such that bonding wire emerging from the outlet opening is guided under the tool; and a second wire guiding module having an elongated guide channel for the bonding wire, the second guide channel having an inlet and outlet opening, the second wire guiding module being provided between the wire feed and the first wire guiding module.