Abstract: A device and a method for the electrical contacting of semiconductor devices. One embodiment provides for testing semiconductor devices by using a contacting device for the electrical contacting of a number of semiconductor devices to be tested and for the electrical connection with a test system. The contacting device includes a fluid container for accommodating a fluid adapted to be tempered.

Abstract: A test device for semiconductor devices is disclosed. One embodiment provides a probe card, having at least one contact test body for contacting a semiconductor device. The probe card includes self-alignment devices and/or a penetration restriction device, or parts thereof. A semiconductor device is provided having at least one contact field adapted to be contacted by contact test bodies of a test device. The semiconductor device includes self-alignment devices and/or a penetration restriction device, or parts thereof, for the contact test body in the region of the contact field.

Abstract: A semiconductor device with a number of contact pads for the electrical contacting of the semiconductor device is disclosed. A padding layer, which is manufactured of a hard material, is provided at least partially below an upper layer of the contact pads.

Abstract: To trim interface devices on semiconductor devices, such as trimmable output drivers and terminations, a measurement current produced in the test apparatus is impressed onto the interface device, and a measurement voltage produced by the measurement current in the interface device is detected by a trimming unit provided within the semiconductor device and is trimmed using control elements and trimming registers controlled by the trimming unit. To this end, the trimming unit ascertains trimming information which is stored in nonvolatile fashion in a memory unit in the semiconductor device and is loaded into the trimming registers in the semiconductor device whenever the semiconductor device is started up.

Abstract: To trim interface devices on semiconductor devices, such as trimmable output drivers and terminations, a measurement current produced in the test apparatus is impressed onto the interface device, and a measurement voltage produced by the measurement current in the interface device is detected by a trimming unit provided within the semiconductor device and is trimmed using control elements and trimming registers controlled by the trimming unit. To this end, the trimming unit ascertains trimming information which is stored in nonvolatile fashion in a memory unit in the semiconductor device and is loaded into the trimming registers in the semiconductor device whenever the semiconductor device is started up.