Patents by Inventor Sascha Preu

Sascha Preu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240067526
    Abstract: An arrangement of carbon nanotubes (CNTs) is disclosed. The arrangement includes: a substrate (100); a first CNT block (110) rising up from the substrate (100); a second CNT block (120) rising up from the substrate (100), the first CNT block (110) and the second CNT block (120) being spaced apart from each other; and a CNT link (130) connecting the first CNT block (110) to the second CNT block (120). The CNTs of the CNT link (130) are aligned in a same direction as the CNTs of the first CNT block (110) and the second CNT block (120), and the CNT link (130) is configured as a CNT bridge.
    Type: Application
    Filed: August 24, 2023
    Publication date: February 29, 2024
    Applicant: Technische Universität Darmstadt
    Inventors: Oktay YILMAZOGLU, Sandeep YADAV, Jörg SCHNEIDER, Yasaameen AL-MAFRACHI, Sascha PREU
  • Publication number: 20230268450
    Abstract: A photoconducting layered material arrangement for producing or detecting high frequency radiation includes a semiconductor material including an alloy comprised of InGaAs, InGaAsSb, or GaSb, with an admixture of Al, which material is applied to a suitable support substrate in a manner such that the lattices are suitably adjusted, wherewith the semiconductor material comprised of InGaAlAs, InGaAlAsSb, or GaAlSb has a band gap of more than 1 eV, as a consequence of the admixed proportion of Al. The proportion x of Al in the semiconductor material InyGa1-y-xAlxAs is between x=0.2 and x=0.35, wherewith the proportion y of In may be between 0.5 and 0.55. The support substrate is InP or GaAs.
    Type: Application
    Filed: April 25, 2023
    Publication date: August 24, 2023
    Applicant: Technische Universität Darmstadt
    Inventors: Sascha Preu, Arthur C. Gossard, Christopher J. Palmstrom, Hong Lu
  • Patent number: 11239538
    Abstract: A photonic integrated circuit is disclosed comprising: a dielectric substrate (110); a dielectric waveguide arrangement (120) on the substrate (110) for guiding terahertz (THz) waves; and a local functionalization (130) having a metallization in a surface area of the dielectric waveguide arrangement (120). The metallization is localized along a propagation direction of the THz waves to allow a metallization-free propagation of the THz wave outside of the local functionalization.
    Type: Grant
    Filed: February 20, 2020
    Date of Patent: February 1, 2022
    Assignee: Technische Universität Darmstadt
    Inventor: Sascha Preu
  • Publication number: 20210384367
    Abstract: A photoconducting layered material arrangement for producing or detecting high frequency radiation includes a semiconductor material including an alloy comprised of InGaAs, InGaAsSb, or GaSb, with an admixture of Al, which material is applied to a suitable support substrate in a manner such that the lattices are suitably adjusted, wherewith the semiconductor material comprised of InGaAlAs, InGaAlAsSb, or GaAlSb has a band gap of more than 1 eV, as a consequence of the admixed proportion of Al. The proportion x of Al in the semiconductor material InyGa1-y-xAlxAs is between x=0.2 and x=0.35, wherewith the proportion y of In may be between 0.5 and 0.55. The support substrate is InP or GaAs.
    Type: Application
    Filed: August 22, 2021
    Publication date: December 9, 2021
    Applicant: Technische Universität Darmstadt
    Inventors: Sascha Preu, Arthur C. Gossard, Christopher J. Palmstrom, Hong Lu
  • Patent number: 10866141
    Abstract: The invention relates to a device for the spectral analysis of an electromagnetic measurement signal using an optoelectronic mixer, wherein the optoelectronic mixer is designed to generate the electrical superimposition signal by superimposing the electromagnetic measurement signal and a reference signal with at least one known frequency (fo). The device comprises the following features: a signal input for receiving an electrical superimposition signal from the optoelectronic mixer, a low-pass filter, a rectifier, and a read-out unit. The low-pass filter is designed to generate a filtered superimposition signal from the electrical superimposition signal by filtering out frequency portions above an upper cutoff frequency (fG). The rectifier is designed to generate a rectified superimposition signal from the filtered superimposition signal.
    Type: Grant
    Filed: February 7, 2017
    Date of Patent: December 15, 2020
    Assignee: TECHNISCHE UNIVERSITAT DARMSTADT
    Inventor: Sascha Preu
  • Publication number: 20200274220
    Abstract: A photonic integrated circuit is disclosed comprising: a dielectric substrate (110); a dielectric waveguide arrangement (120) on the substrate (110) for guiding terahertz (THz) waves; and a local functionalization (130) having a metallization in a surface area of the dielectric waveguide arrangement (120). The metallization is localized along a propagation direction of the THz waves to allow a metallization-free propagation of the THz wave outside of the local functionalization.
    Type: Application
    Filed: February 20, 2020
    Publication date: August 27, 2020
    Applicant: Technische Universität Darmstadt
    Inventor: Sascha Preu
  • Publication number: 20200025614
    Abstract: The invention relates to a device for the spectral analysis of an electromagnetic measurement signal using an optoelectronic mixer, wherein the optoelectronic mixer is designed to generate the electrical superimposition signal by superimposing the electromagnetic measurement signal and a reference signal with at least one known frequency (fo). The device comprises the following features: a signal input for receiving an electrical superimposition signal from the optoelectronic mixer , a low-pass filter, a rectifier, and a read-out unit. The low-pass filter is designed to generate a filtered superimposition signal from the electrical superimposition signal by filtering out frequency portions above an upper cutoff frequency (fG). The rectifier is designed to generate a rectified superimposition signal from the filtered superimposition signal.
    Type: Application
    Filed: February 7, 2017
    Publication date: January 23, 2020
    Inventor: Sascha Preu
  • Publication number: 20190334044
    Abstract: A photoconducting layered material arrangement for producing or detecting high frequency radiation includes a semiconductor material including an alloy comprised of InGaAs, InGaAsSb, or GaSb, with an admixture of Al, which material is applied to a suitable support substrate in a manner such that the lattices are suitably adjusted, wherewith the semiconductor material comprised of InGaAlAs, InGaAlAsSb, or GaAlSb has a band gap of more than 1 eV, as a consequence of the admixed proportion of Al. The proportion x of Al in the semiconductor material InyGa1-y-xAlxAs is between x=0.2 and x=0.35, wherewith the proportion y of in may be between 0.5 and 0.55. The support substrate is InP or GaAs.
    Type: Application
    Filed: July 5, 2019
    Publication date: October 31, 2019
    Applicant: Technische Universitat Darmstadt
    Inventors: Sascha Preu, Arthur C. Gossard, Christopher J. Palmstrom, Hong Lu
  • Publication number: 20160240707
    Abstract: A photoconducting layered material arrangement for producing or detecting high frequency radiation includes a semiconductor material including an alloy comprised of InGaAs, InGaAsSb, or GaSb, with an admixture of Al, which material is applied to a suitable support substrate in a manner such that the lattices are suitably adjusted, wherewith the semiconductor material comprised of InGaAlAs, InGaAlAsSb, or GaAlSb has a band gap of more than 1 eV, as a consequence of the admixed proportion of Al. The proportion x of Al in the semiconductor material InyGa1?y?xAlxAs is between x=0.2 and x=0.35, wherewith the proportion y of In may be between 0.5 and 0.55. The support substrate is InP or GaAs.
    Type: Application
    Filed: February 12, 2016
    Publication date: August 18, 2016
    Applicant: Technische Universität Darmstadt
    Inventors: Sascha Preu, Arthur C. Gossard, Christopher J. Palmstrom, Hong Lu
  • Patent number: D619824
    Type: Grant
    Filed: December 2, 2008
    Date of Patent: July 20, 2010
    Assignee: Rittal GmbH & Co. KG
    Inventors: Sascha Preuβner-Pfaff, Markus Neuhof