Abstract: The present invention relates to a compound as a reactive diluent for resin compositions as well as a resin composition comprising the same for coating an article and a resin obtained by curing said resin composition.

Abstract: Compositions for providing a dielectric layer in an electronic device wherein the composition comprises a polymer which polymer contains one or more building blocks, wherein at least 25 mol % of the total number of building blocks in the polymer are of the general formula having olefinic oligo-dihydrodicyclopentadienyl functionalities.

Abstract: Compositions for providing a dielectric layer in an electronic device wherein the composition comprises a polymer which polymer contains one or more building blocks, wherein at least 25 mol % of the total number of building blocks in the polymer are of the general formula having olefinic oligo-dihydrodicyclopentadienyl functionalities.

Abstract: The present invention relates to a solvent-free wire enamel composition containing extrudable, polyesterimide-containing binders, prepared from polyols, polycarboxylic acids, imide-forming components, and structural elements which are crosslinkable after extrusion.

Abstract: Compositions for providing a dielectric layer in an electronic device wherein the composition comprises a polymer which polymer contains one or more building blocks, wherein at least 25 mol % of the total number of building blocks in the polymer are of the general formula having olefinic oligo-dihydrodicyclopentadienyl functionalities.

Abstract: The present invention relates to a solvent-free wire enamel composition containing extrudable, polyesterimide-containing binders, prepared from polyols, polycarboxylic acids, imide-forming components, and structural elements which are crosslinkable after extrusion.

Abstract: The invention relates to an overcoat lacquer containing a) at least one binding agent containing alkyd resins made from tris-(2-hydroxylethyl)-isocyanurate, 2,6-naphthaline dicarboxylic acid, drying fatty acids, and, optionally, other components known from alkyd resin chemistry, b) at least one solvent or at least one technical solvent or mixture thereof based on hydrocarbon and c) at least one siccative or at least one mixture of siccatives or several anti-skin agents.

Abstract: The present invention relates to coating compositions for flat assemblies, hybrids, SMD assemblies, comprising at least one binder or binder mixtures which are curable at 60° C.-120° C., preferably at 70° C.-110° C., more particularly at 80° C.-90° C., and also to a process for preparing them and to their use for flat assemblies in electronics, hybrids, SMD assemblies and assembled printed circuit boards.

Abstract: The present invention relates to a polyamideimide resin solution preparable by reacting (a) aromatic polycarboxylic acids and/or their anhydrides with (b) aromatic imide- and amide-forming components in cresol at temperatures above 170° C., to the use of this polyamideimide solution for the preparation of wire enamels, to the wire enamels in question, and to the enamelled wires coated therewith.

Abstract: The invention relates to novel liquid epoxy resin emulsions which contain the following components, dissolved and/or dispersed in water: (A) at least one binding agent selected from the group made of epoxy resins and modified epoxy resins, (B) at least one non ionic thickener and (C) at least one catalyst for hardening, produced by reacting at least one boron trifluoride complex with at least one compound containing at least one epoxy group. The invention also relates to a method for the production and use thereof as an impregnating varnish for electrotechnical components, particularly for electrical winding items.