Abstract: In various embodiments, disclosed herein are systems and methods directed to the fabrication of a coreless semiconductor package (e.g., a millimeter (mm)-wave antenna package) having an asymmetric build-up layer count that can be fabricated on both sides of a temporary substrate (e.g., a core). The asymmetric build-up layer count can reduce the overall layer count in the fabrication of the semiconductor package and can therefore contribute to fabrication cost reduction. In further embodiments, the semiconductor package (e.g., a millimeter (mm)-wave antenna packages) can further comprise dummification elements disposed near one or more antenna layers. Further, the dummification elements disposed near one or more antenna layers can reduce image current and thereby increasing the antenna gain and efficiency.

Abstract: A receiver system for correlating one or more signals (beam patterns) is disclosed. One or more antenna elements are configured to receive the signals. A controller generates correlator outputs based on a first set of duplicated signals, generates a first set of beams based on the one or more correlator outputs using a first beamforming module, generates a second set of beams based on a second set of duplicated signals using a second beamforming module, generates one or more power estimates based on the second set of beams, and divides each of the first set of beams by a corresponding power estimate to generate one or more normalized correlations.

Abstract: Integration of a side-radiating waveguide launcher system into a semiconductor package beneficially permits the coupling of a waveguide directly to the semiconductor package. Included are a first conductive member and a second conductive member separated by a dielectric material. Also included is a conductive structure, such as a plurality of vias, that conductively couples the first conductive member and the second conductive member. Together, the first conductive member, the second conductive member, and the conductive structure form an electrically conductive side-radiating waveguide launcher enclosing shaped space within the dielectric material. The shaped space includes a narrow first end and a wide second end. An RF excitation element is disposed proximate the first end and a waveguide may be operably coupled proximate the second end of the shaped space.

Abstract: A multi node radar network system is disclosed. The system includes a base node configured to transmit a directional 5G RF signal, a request node configured to request the base node to transmit the 5G RF signal, and one or more listening nodes configured to receive reflections of the 5G RF signal off of a target object. The system further includes a computation module configured to determine the location of the target object from data received from at least one of the base node, the request node, or the one or more listening nodes. A method for determining the position of a target object in a multi node radar system is disclosed.

Abstract: A receiver system for correlating one or more signals (beam patterns) is disclosed. One or more antenna elements are configured to receive the signals. A controller generates correlator outputs based on a first set of duplicated signals, generates a first set of beams based on the one or more correlator outputs using a first beamforming module, generates a second set of beams based on a second set of duplicated signals using a second beamforming module, generates one or more power estimates based on the second set of beams, and divides each of the first set of beams by a corresponding power estimate to generate one or more normalized correlations.

Abstract: Embodiments of the invention include autonomous vehicles and mm-wave systems for communication between components. In an embodiment the vehicle includes an electronic control unit (ECU). The ECU may include a printed circuit board (PCB) and a CPU die packaged on a CPU packaging substrate. In an embodiment, the CPU packaging substrate is electrically coupled to the PCB. The ECU may also include an external predefined interface electrically coupled to the CPU die. In an embodiment, an active mm-wave interconnect may include a dielectric waveguide, and a first connector coupled to a first end of the dielectric waveguide. In an embodiment, the first connector comprises a first mm-wave engine, and the first connector is electrically coupled to the external predefined interface. Embodiments may also include a second connector coupled to a second end of the dielectric waveguide, wherein the second connector comprises a second mm-wave engine.

Abstract: A spread-spectrum transmitter is disclosed. The transmitter includes a modulator configured to produce an intermediate frequency signal, a frequency shifter configured to shift the intermediate frequency factor by a first factor, and a local oscillator (LO) configured to generate a LO signal. The transmitter further includes a ramp signal generator configured to determine the value of the first factor and a second factor, is configured to transmit the value of the factor to the frequency shifter, is configured to transmit the value of the second factor to the LO, where the frequency of the intermediate frequency signal shifted by the first factor is shifted synchronously with the frequency of the LO signal shifted by the second factor. The transmitter includes a mixer configured to mix the shifted intermediate frequency with the shifted LO signal that has been shifted by the second factor, producing a spread leaked LO signal.

Abstract: An electromagnetic channel emulator system is disclosed. The system includes an electromagnetic switch matrix sub-system communicatively coupled to one or more systems under test and one or more simulation control layers. The system may include a high performance computing layer including one or more processing element nodes. The electromagnetic switch matrix sub-system may include one or more electromagnetic systems under test input/output layers and one or more high performance computing input/output layers. The one or more input/output layers may include one or more signal converters. The electromagnetic switch matrix sub-system may include one or more switches communicatively coupled to the one or more input/output layers and the high performance computing layer. The one or more switches may be configured to selectively position the one or more analog signals based on the received one or more simulation control layer signals.

Abstract: Embodiments of the invention include dielectric waveguides and connectors for dielectric waveguides. In an embodiment a dielectric waveguide connector may include an outer ring and one or more posts extending from the outer ring towards the center of the outer ring. In some embodiments, a first dielectric waveguide secured within the dielectric ring by the one or more posts. In another embodiment, an enclosure surrounding electronic components may include an enclosure wall having an interior surface and an exterior surface and a dielectric waveguide embedded within the enclosure wall. In an embodiment, a first end of the dielectric waveguide is substantially coplanar with the interior surface of the enclosure wall and a second end of the dielectric waveguide is substantially coplanar with the exterior surface of the enclosure wall.

Abstract: Embodiments of the invention include a mm-wave waveguide connector and methods of forming such devices. In an embodiment the mm-wave waveguide connector may include a plurality of mm-wave launcher portions, and a plurality of ridge based mm-wave filter portions each communicatively coupled to one of the mm-wave launcher portions. In an embodiment, the ridge based mm-wave filter portions each include a plurality of protrusions that define one or more resonant cavities. Additional embodiments may include a multiplexer portion communicatively coupled to the plurality of ridge based mm-wave filter portions and communicative coupled to a mm-wave waveguide bundle. In an embodiment the plurality of protrusions define resonant cavities with openings between 0.5 mm and 2.0 mm, the plurality of protrusions are spaced apart from each other by a spacing between 0.5 mm and 2.0 mm, and wherein the plurality of protrusions have a thickness between 200 ?m and 1,000 ?m.

Abstract: Generally, this disclosure provides apparatus and systems for coupling waveguides to a server package with a modular connector system, as well as methods for fabricating such a connector system. Such a system may be formed with connecting waveguides that turn a desired amount, which in turn may allow a server package to send a signal through a waveguide bundle in any given direction without bending waveguides.

Abstract: Embodiments of the invention may include a mm-wave waveguide. In an embodiment, the mm-wave waveguide may include a first dielectric waveguide and a second dielectric waveguide. A conductive layer may be used to cover the first dielectric waveguide and the second dielectric waveguide in some embodiments. Furthermore, embodiments may include a repeater communicatively coupled between the first dielectric waveguide and the second dielectric waveguide. In an embodiment, the repeater may be an active repeater or a passive repeater. According to an embodiment, a passive repeater may be integrated within the dielectric waveguide. The passive repeater may include a dispersion compensating material that produces a dispersion response in a signal that is substantially opposite to a dispersion response produced when the signal is propagated along the dielectric waveguide.

Abstract: A waveguide coupling system may include at least one waveguide member retention structure disposed on an exterior surface of a semiconductor package. The waveguide member retention structure may be disposed a defined distance or at a defined location with respect to an antenna carried by the semiconductor package. The waveguide member retention structure may engage and guide a waveguide member slidably inserted into the respective waveguide member retention structure. The waveguide member retention structure may position the waveguide member at a defined location with respect to the antenna to maximize the power transfer from the antenna to the waveguide member.

Abstract: Embodiments of the invention include an active mm-wave interconnect. In an embodiment, the active mm-wave interconnect includes a dielectric waveguide that is coupled to a first connector and a second connector. According to an embodiment, each of the first and second connectors may include a mm-wave engine. In an embodiment, the mm-wave engines may include a power management die, a modulator die, a demodulator die, a mm-wave transmitter die, and a mm-wave receiver die. Additional embodiments may include connectors that interface with predefined interfaces, such as small form-factor pluggables (SFP), quad small form-factor pluggables (QSFP), or octal small form-factor pluggables (OSFP). Accordingly, embodiments of the invention allow for plug and play functionality with existing servers and other high performance computing systems.

Abstract: Embodiments of the invention include a dispersion reduced dielectric waveguide and methods of forming such devices. In an embodiment, the dispersion reduced dielectric waveguide may include a first dielectric material that has a first Dk-value, and a second dielectric material that has a second Dk-value that is greater than the first Dk-value. In an embodiment, the dispersion reduced dielectric waveguide may also include a conductive layer formed around the first and second dielectric materials. According to an embodiment, a first portion of a bandwidth of a signal that is propagated along the dispersion reduced dielectric waveguide is primarily propagated along the first dielectric material, and a second portion of a bandwidth of the signal that is propagated along the dispersion reduced dielectric waveguide is primarily propagated along the second dielectric material.

Abstract: A spread-spectrum transmitter is disclosed. The transmitter includes a modulator configured to produce an intermediate frequency signal, a frequency shifter configured to shift the intermediate frequency factor by a first factor, and a local oscillator (LO) configured to generate a LO signal. The transmitter further includes a ramp signal generator configured to determine the value of the first factor and a second factor, is configured to transmit the value of the factor to the frequency shifter, is configured to transmit the value of the second factor to the LO, where the frequency of the intermediate frequency signal shifted by the first factor is shifted synchronously with the frequency of the LO signal shifted by the second factor. The transmitter includes a mixer configured to mix the shifted intermediate frequency with the shifted LO signal that has been shifted by the second factor, producing a spread leaked LO signal.

Abstract: Integration of a side-radiating waveguide launcher system into a semiconductor package beneficially permits the coupling of a waveguide directly to the semiconductor package. Included are a first conductive member and a second conductive member separated by a dielectric material. Also included is a conductive structure, such as a plurality of vias, that conductively couples the first conductive member and the second conductive member. Together, the first conductive member, the second conductive member, and the conductive structure form an electrically conductive side-radiating waveguide launcher enclosing shaped space within the dielectric material. The shaped space includes a narrow first end and a wide second end. An RF excitation element is disposed proximate the first end and a waveguide may be operably coupled proximate the second end of the shaped space.

Abstract: A multi node radar network system is disclosed. The system includes a base node configured to transmit a directional 5G RF signal, a request node configured to request the base node to transmit the 5G RF signal, and one or more listening nodes configured to receive reflections of the 5G RF signal off of a target object. The system further includes a computation module configured to determine the location of the target object from data received from at least one of the base node, the request node, or the one or more listening nodes. A method for determining the position of a target object in a multi node radar system is disclosed.

Abstract: Embodiments of the invention include a mm-wave waveguide connector and methods of forming such devices. In an embodiment the mm-wave waveguide connector may include a plurality of mm-wave launcher portions, and a plurality of ridge based mm-wave filter portions each communicatively coupled to one of the mm-wave launcher portions. In an embodiment, the ridge based mm-wave filter portions each include a plurality of protrusions that define one or more resonant cavities. Additional embodiments may include a multiplexer portion communicatively coupled to the plurality of ridge based mm-wave filter portions and communicative coupled to a mm-wave waveguide bundle. In an embodiment the plurality of protrusions define resonant cavities with openings between 0.5 mm and 2.0 mm, the plurality of protrusions are spaced apart from each other by a spacing between 0.5 mm and 2.0 mm, and wherein the plurality of protrusions have a thickness between 200 ?m and 1,000 ?m.

Abstract: Embodiments of the invention include a mm-wave waveguide connector and methods of forming such devices. In an embodiment the mm-wave waveguide connector may include a plurality of mm-wave launcher portions, and a plurality of ridge based mm-wave filter portions each communicatively coupled to one of the mm-wave launcher portions. In an embodiment, the ridge based mm-wave filter portions each include a plurality of protrusions that define one or more resonant cavities. Additional embodiments may include a multiplexer portion communicatively coupled to the plurality of ridge based mm-wave filter portions and communicative coupled to a mm-wave waveguide bundle. In an embodiment the plurality of protrusions define resonant cavities with openings between 0.5 mm and 2.0 mm, the plurality of protrusions are spaced apart from each other by a spacing between 0.5 mm and 2.0 mm, and wherein the plurality of protrusions have a thickness between 200 ?m and 1,000 ?m.