Abstract: An electrical cable including four copper layers, where at least two of the four copper layers are separated by a polymeric base layer, and where at least two of the four copper layers are separated by an adhesive. The electrical cable further includes a polymeric cover layer adhered to an outermost copper layer.

Abstract: An electrical cable comprising four copper layers, where at least two of the four copper layers are separated by a polymeric base layer, and where at least two of the four copper layers are separated by an adhesive.

Abstract: A flex circuit for connection to a moving device. The flex circuit includes a connections tab configured to present first and second pluralities of electrical conductors for electrically coupling to the moving device. First and second flex circuit paths extend from the connections tab and having separate distal ends, and include the first and second pluralities of electrical conductors, respectively. The first and second flex circuit paths are configured at their distal ends to present the first and second pluralities of electrical conductors, respectively, for electrical coupling to a circuit board.

Abstract: A system in one embodiment includes a cable having a plurality of cable leads, and a multi-diode chip having a pad-side not facing the cable. The multi-diode chip includes a plurality of sets of contact pads on the pad-side of the multi-diode chip, and a plurality of crossed diode sets, wherein each set of crossed diodes is coupled between a first contact pad and a second contact pad of one set of contact pads, wherein at least two of the plurality of cable leads are coupled via wire-bonding to one of the plurality of sets of contact pads of the multi-diode chip for providing electrostatic discharge (ESD) protection for at least one element of the electronic device coupled to the at least two cable leads.

Abstract: A cable having an electrostatic discharge (ESD) dissipative layer in one embodiment includes a plurality of leads; an ESD dissipative layer; and a coupling layer between the leads and the ESD dissipative layer, the coupling layer electrically connecting each of the leads, individually, to the ESD dissipative layer. A cable having an electrostatic discharge (ESD) dissipative layer in another embodiment comprises at least 16 leads; an ESD dissipative layer; and a coupling layer between the leads and the ESD dissipative layer, the coupling layer electrically connecting each of the leads, individually, to the ESD dissipative layer. A method for fabricating a cable in one embodiment comprises coupling an electrostatic discharge (ESD) dissipative layer to a plurality of leads using a coupling layer between the leads and the ESD dissipative layer, the coupling layer electrically connecting each of the leads, individually, to the ESD dissipative layer.

Abstract: A tape drive system according to one general embodiment includes a magnetic head; a drive mechanism for passing a magnetic recording tape over the head; a cable coupled to the magnetic head, the cable comprising a first layer of liquid crystal polymer, and at least 16 electrically conductive leads operatively coupled to the first layer of liquid crystal polymer; and a controller coupled to the cable, and communicating with the head using the cable. A cable according to another general embodiment includes a first layer of liquid crystal polymer; and at least 16 electrically conductive leads operatively coupled to the first layer of liquid crystal polymer.

Abstract: A system in one embodiment includes a cable having a plurality of cable leads, and a multi-diode chip having a pad-side not facing the cable. The multi-diode chip includes a plurality of sets of contact pads on the pad-side of the multi-diode chip, and a plurality of crossed diode sets, wherein each set of crossed diodes is coupled between a first contact pad and a second contact pad of one set of contact pads, wherein at least two of the plurality of cable leads are coupled via wire-bonding to one of the plurality of sets of contact pads of the multi-diode chip for providing electrostatic discharge (ESD) protection for at least one element of the electronic device coupled to the at least two cable leads.

Abstract: A cable having an electrostatic discharge (ESD) dissipative layer in one embodiment includes a plurality of leads; an ESD dissipative layer; and a coupling layer between the leads and the ESD dissipative layer, the coupling layer electrically connecting each of the leads, individually, to the ESD dissipative layer. A cable having an electrostatic discharge (ESD) dissipative layer in another embodiment comprises at least 16 leads; an ESD dissipative layer; and a coupling layer between the leads and the ESD dissipative layer, the coupling layer electrically connecting each of the leads, individually, to the ESD dissipative layer. A method for fabricating a cable in one embodiment comprises coupling an electrostatic discharge (ESD) dissipative layer to a plurality of leads using a coupling layer between the leads and the ESD dissipative layer, the coupling layer electrically connecting each of the leads, individually, to the ESD dissipative layer.

Abstract: A cable in one embodiment includes a plurality of leads; and an electrostatic discharge (ESD) dissipative layer operatively coupled to the leads, the ESD dissipative layer being characterized as being at least one of translucent, semi-transparent or transparent. A cable in another embodiment includes a plurality of leads; an ESD dissipative layer operatively coupled to the leads, the ESD dissipative layer; and a metallic layer operatively coupled to the leads, the metallic and ESD dissipative layers being characterized as being at least one of translucent, semi-transparent or transparent. A cable in another embodiment includes a plurality of leads; a metallic layer operatively coupled to the leads, the metallic layer being characterized as being at least one of translucent, semi-transparent or transparent, wherein the metallic layer has a volume resistivity of greater than 1×104 ohm·cm as defined by ANSI/EIA-541-1988; and an insulating layer positioned between the metallic layer and the leads.

Abstract: A tape drive system according to one general embodiment includes a magnetic head; a drive mechanism for passing a magnetic recording tape over the head; a cable coupled to the magnetic head, the cable comprising a first layer of liquid crystal polymer, and at least 16 electrically conductive leads operatively coupled to the first layer of liquid crystal polymer; and a controller coupled to the cable, and communicating with the head using the cable. A cable according to another general embodiment includes a first layer of liquid crystal polymer; and at least 16 electrically conductive leads operatively coupled to the first layer of liquid crystal polymer.

Abstract: A tape head read/write module that has a composite air bearing surface, and a method and apparatus for embedding a chip in a substrate to form a composite air bearing surface. An example of the module includes a substrate that has an air bearing surface, a front, a back, and a chip receiving slot. The air bearing surface of the substrate has a first portion adjoining a first side of the chip receiving slot, and a second portion adjoining a second side of the chip receiving slot. The module also includes a chip that has an air bearing surface, a bottom surface, a front, a back, and active elements. The active elements are located proximate the front of the chip. The chip is positioned in the chip receiving slot in the substrate, with the air bearing surface of the chip substantially aligned with the air bearing surface of the substrate.

Abstract: A tape head read/write module that has a composite air bearing surface, and a method and apparatus for embedding a chip in a substrate to form a composite air bearing surface. An example of the module includes a substrate that has an air bearing surface, a front, a back, and a chip receiving slot. The air bearing surface of the substrate has a first portion adjoining a first side of the chip receiving slot, and a second portion adjoining a second side of the chip receiving slot. The module also includes a chip that has an air bearing surface, a bottom surface, a front, a back, and active elements. The active elements are located proximate the front of the chip. The chip is positioned in the chip receiving slot in the substrate, with the air bearing surface of the chip substantially aligned with the air bearing surface of the substrate.

Abstract: A method is provided for providing air-skiving edges of a tape head. A slot is created in an upper face of a substrate of a tape head. The slot includes at least one edge defining an edge of a tape bearing surface (TBS) of the tape head. The surface of the tape head is then formed and finished, such as by lapping. A grind operation is subsequently conducted to form a notch in the upper face of the substrate of the tape head. Such notch extends from the slot to an outside end of the substrate of the tape head.

Abstract: A method and apparatus for embedding a chip in a substrate to form a composite air bearing surface. An example of the method includes securing the substrate in a fixed position, aligning the chip in a first direction with a chip receiving slot in the substrate, depositing adhesive in the chip receiving slot, and aligning the chip in a second direction with the chip receiving slot. The chip is pushed into the adhesive in the chip receiving slot until the air bearing surface of the chip is substantially at a desired protrusion in a third direction in relation to the air bearing surface of the substrate. The adhesive is cured with the air bearing surface of the chip substantially at the desired protrusion in the third direction, and with the chip substantially aligned in the first and second directions with chip receiving slot.

Abstract: A method and apparatus for embedding a chip in a substrate to form a composite air bearing surface. An example of the method includes securing the substrate in a fixed position, aligning the chip in a first direction with a chip receiving slot in the substrate, depositing adhesive in the chip receiving slot, and aligning the chip in a second direction with the chip receiving slot. The chip is pushed into the adhesive in the chip receiving slot until the air bearing surface of the chip is substantially at a desired protrusion in a third direction in relation to the air bearing surface of the substrate. The adhesive is cured with the air bearing surface of the chip substantially at the desired protrusion in the third direction, and with the chip substantially aligned in the first and second directions with chip receiving slot.