Abstract: Various embodiments herein relate to systems, methods, and media for generating digital twins of semiconductor manufacturing equipment. In some embodiments, a digital twin of a process chamber of semiconductor manufacturing equipment is provided. comprising one or more non-transitory machine readable media comprising logic configured to implement; a first model of a first location of the process chamber; and a second model of a second location of the process chamber, wherein the first model is coupled to the second model, and wherein the first model and the second model are each of a model type that is one of: 1) an AI/ML model; 2) an HFS model; and 3) a closed-form solution, and wherein the first model and the second model each represent a class of physical phenomena that is one of: 1) thermal characteristics; 2) plasma characteristics; 3) fluid dynamics; 4) structural characteristics; and 5) chemical reactions.

Abstract: A purge ring including a supply port configured for receiving gas. An outer channel is connected to the supply port. An outlet network is configured for an exit flow of the gas proximate to an inner diameter of the purge ring. The purge ring includes a plurality of channels configured for flow of the gas in a radial direction from the outer channel to the outlet network. The purge ring includes a plurality of passageways configured for reduced flow of the gas in the radial direction between the outer channel and the outlet network. The plurality of channels and the plurality of passageways are configured for providing a uniform pressure of the exit flow of the gas across the outlet network circumference.

Abstract: Various embodiments herein relate to systems and methods for predictive maintenance for semiconductor manufacturing equipment.

Abstract: Methods, systems, and computer programs are presented for predicting the performance of semiconductor manufacturing equipment operations. One method includes an operation for obtaining machine-learning (ML) models, each model related to predicting a performance metric for an operation of a semiconductor manufacturing tool. Further, each ML model utilizes features defining inputs for the ML model. The method further includes an operation for receiving a process definition for manufacturing a product with the semiconductor manufacturing tool. One or more ML models are utilized to estimate a performance of the process definition used in the semiconductor manufacturing tool. Additionally, the method includes presenting, on a display, results showing the estimate of the performance of the manufacturing of the product.

Abstract: A gas exhaust by-product measurement system is provided. A gas chamber is configured to receive exhaust from the exhaust output. A light source, light detector, and at least one optical element are positioned so that a light beam from the light source is directed to the at least one optical element a plurality of times before reaching the light detector. At least one heater provides heat to the at least one optical element. A plurality of purge gas nozzles are in fluid connection with the optical cavity. A high flow line is in fluid connection between a purge gas source and the plurality of purge gas nozzles. A low flow line is in fluid connection between the purge gas source and the plurality of purge gas nozzles. At least one flow controller manages a plurality of flow rates including a high flow and a low flow.

Abstract: A gas exhaust by-product measurement system is provided. A gas chamber is configured to receive exhaust from the exhaust output. A light source, light detector, and at least one optical element are positioned so that a light beam from the light source is directed to the at least one optical element a plurality of times before reaching the light detector. At least one heater provides heat to the at least one optical element. A plurality of purge gas nozzles are in fluid connection with the optical cavity. A high flow line is in fluid connection between a purge gas source and the plurality of purge gas nozzles. A low flow line is in fluid connection between the purge gas source and the plurality of purge gas nozzles. At least one flow controller manages a plurality of flow rates including a high flow and a low flow.

Abstract: Provided herein are assemblies that, when coupled to an object, are capable of keeping the object at a uniform elevated temperature while removing large amounts of heat from an external source. Applications include various integrated circuit fabrication processes that use such external sources to expose wafers to radiation. In certain embodiments, the assemblies include a pedestal for supporting the wafer or other object. In certain embodiments, the assemblies include a calibrated heat resistance that allows heat be conducted away from the pedestal and wafer to maintain the desired set-point temperature. In certain embodiments, the pedestal may have one or more protrusions used to dissipate or transfer heat from the pedestal to a heat sink. Also, in certain embodiments, the pedestal surface is configured to have a spectral reflectivity of desired values in such way as to reflect the wavelengths that are emitted by an external radiant heat source.

Abstract: The present invention provides a heat transfer assembly that, when coupled to an object, is capable of keeping the object at a uniform elevated temperature while removing large amounts of heat from an external source. The assembly may be contained in a pedestal for use in a UV-cure chamber. The heat transfer assembly includes a heating element to control the wafer temperature and a cooling element to remove incident IR heat from the wafer and pedestal. A heat resistant layer having a calibrated heat resistance is located between the heating and cooling elements and between the wafer and the cooling elements. The heat resistant layer is able to sustain high temperature gradient from the wafer to the coolant so that the coolant does not boil while permitting enough heat to be conducted away from the wafer to maintain the desired set-point temperature.