Abstract: A tape head read/write module that has a composite air bearing surface, and a method and apparatus for embedding a chip in a substrate to form a composite air bearing surface. An example of the module includes a substrate that has an air bearing surface, a front, a back, and a chip receiving slot. The air bearing surface of the substrate has a first portion adjoining a first side of the chip receiving slot, and a second portion adjoining a second side of the chip receiving slot. The module also includes a chip that has an air bearing surface, a bottom surface, a front, a back, and active elements. The active elements are located proximate the front of the chip. The chip is positioned in the chip receiving slot in the substrate, with the air bearing surface of the chip substantially aligned with the air bearing surface of the substrate.

Abstract: A cable in one embodiment includes a plurality of leads; and an electrostatic discharge (ESD) dissipative layer operatively coupled to the leads, the ESD dissipative layer being characterized as being at least one of translucent, semi-transparent or transparent. A cable in another embodiment includes a plurality of leads; an ESD dissipative layer operatively coupled to the leads, the ESD dissipative layer; and a metallic layer operatively coupled to the leads, the metallic and ESD dissipative layers being characterized as being at least one of translucent, semi-transparent or transparent. A cable in another embodiment includes a plurality of leads; a metallic layer operatively coupled to the leads, the metallic layer being characterized as being at least one of translucent, semi-transparent or transparent, wherein the metallic layer has a volume resistivity of greater than 1×104 ohm cm as defined by ANSI/EIA-541-1988; and an insulating layer positioned between the metallic layer and the leads.

Abstract: A method is provided for providing air-skiving edges of a tape head. A slot is created in an upper face of a substrate of a tape head. The slot includes at least one edge defining an edge of a tape bearing surface (TBS) of the tape head. The surface of the tape head is then formed and finished, such as by lapping. A grind operation is subsequently conducted to form a notch in the upper face of the substrate of the tape head. Such notch extends from the slot to an outside end of the substrate of the tape head.

Abstract: A tape head read/write module that has a composite air bearing surface, and a method and apparatus for embedding a chip in a substrate to form a composite air bearing surface. An example of the module includes a substrate that has an air bearing surface, a front, a back, and a chip receiving slot. The air bearing surface of the substrate has a first portion adjoining a first side of the chip receiving slot, and a second portion adjoining a second side of the chip receiving slot. The module also includes a chip that has an air bearing surface, a bottom surface, a front, a back, and active elements. The active elements are located proximate the front of the chip. The chip is positioned in the chip receiving slot in the substrate, with the air bearing surface of the chip substantially aligned with the air bearing surface of the substrate.

Abstract: A method is provided for providing air-skiving edges of a tape head. A slot is created in an upper face of a substrate of a tape head. The slot includes at least one edge defining an edge of a tape bearing surface (TBS) of the tape head. The surface of the tape head is then formed and finished, such as by lapping. A grind operation is subsequently conducted to form a notch in the upper face of the substrate of the tape head. Such notch extends from the slot to an outside end of the substrate of the tape head.

Abstract: A system and method for tracking the position and orientation of a movable medical imaging device using a first and second sensor disposed on the device. The second sensor is of a different type than the first sensor and measures a P/O parameter different from that of the first sensor. The system and method also include techniques for recalibrating sensors using measurements from other sensors and improving the measurements made by some sensors using measurements from other sensors. The system and method also include measuring the position of a medical implement relative to a movable medical imaging device by providing a first and second subsystem on the medical implement and a third and fourth subsystem on the movable medical imaging device. The first subsystem has a sensor of a first type and the second subsystem has a sensor of a second type different from the sensor of the first type.