Patents by Inventor Sasson R. Somekh
Sasson R. Somekh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11629365Abstract: Provided are aqueous fermentation feedstocks comprising glucose monomers at a concentration of less than 50 gram/Liter (g/L) of the total feedstock, water-soluble dextrose oligomers at a concentration in a range between 50 g/L and 300 g/L of the total feedstock; and water. Further provided are methods of production thereof and uses thereof in the production of single cell protein and/or ethanol.Type: GrantFiled: August 27, 2019Date of Patent: April 18, 2023Assignee: SUPERBREWED FOOD INC.Inventors: Bryan P. Tracy, Dale A. Monceaux, Aharon M. Eyal, Sasson R. Somekh
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Publication number: 20210180100Abstract: Provided are aqueous fermentation feedstocks comprising glucose monomers at a concentration of less than 50 gram/Liter (g/L) of the total feedstock, water-soluble dextrose oligomers at a concentration in a range between 50 g/L and 300 g/L of the total feedstock; and water. Further provided are methods of production thereof and uses thereof in the production of single cell protein and/or ethanol.Type: ApplicationFiled: August 27, 2019Publication date: June 17, 2021Inventors: Bryan P. TRACY, Dale A. MONCEAUX, Aharon M. Eyal, Sasson R. Somekh
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Patent number: 10934562Abstract: Integrated mixotrophic fermentation method comprising (i) an isolated naturally acetogenic organism; (ii) a first feedstock comprising a carbon source for use in a fermentation medium; (iii) a second feedstock comprising elemental hydrogen for use in the fermentation medium; wherein the second feedstock comprises performing electrolysis; and (iv) culturing the organism in the fermentation medium, whereby both feedstocks are metabolized and a fermentation broth is formed, which broth comprises at least one bioproduct.Type: GrantFiled: May 23, 2017Date of Patent: March 2, 2021Assignee: White Dog Labs, Inc.Inventors: Bryan Patrick Tracy, Sasson R. Somekh, John Randall Phillips, Aharon M. Eyal
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Publication number: 20190144892Abstract: Integrated mixotrophic fermentation method comprising (i) an isolated naturally acetogenic organism; (ii) a first feedstock comprising a carbon source for use in a fermentation medium; (iii) a second feedstock comprising elemental hydrogen for use in the fermentation medium; wherein the second feedstock comprises performing electrolysis; and (iv) culturing the organism in the fermentation medium, whereby both feedstocks are metabolized and a fermentation broth is formed, which broth comprises at least one bioproduct.Type: ApplicationFiled: May 23, 2017Publication date: May 16, 2019Applicant: White Dog Labs, Inc.Inventors: Bryan Patrick TRACY, Sasson R. SOMEKH, John Randall PHILLIPS, Aharon M. EYAL
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Patent number: 7585686Abstract: A method of a single wafer wet/dry cleaning apparatus comprising: a transfer chamber having a wafer handler contained therein; a first single wafer wet cleaning chamber directly coupled to the transfer chamber; and a first single wafer ashing chamber directly coupled to the transfer chamber.Type: GrantFiled: October 26, 2007Date of Patent: September 8, 2009Assignee: Applied Materials, Inc.Inventors: Steven Verhaverbeke, J Kelly Truman, Christopher T Lane, Sasson R Somekh
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Publication number: 20080286697Abstract: A method of a single wafer wet/dry cleaning apparatus comprising: a transfer chamber having a wafer handler contained therein; a first single wafer wet cleaning chamber directly coupled to the transfer chamber; and a first single wafer ashing chamber directly coupled to the transfer chamber.Type: ApplicationFiled: October 26, 2007Publication date: November 20, 2008Inventors: Steven Verhaverbeke, J Kelly Truman, Christopher T. Lane, Sasson R. Somekh
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Publication number: 20080145797Abstract: A method of a single wafer wet/dry cleaning apparatus comprising: a transfer chamber having a wafer handler contained therein; a first single wafer wet cleaning chamber directly coupled to the transfer chamber; and a first single wafer ashing chamber directly coupled to the transfer chamber.Type: ApplicationFiled: October 26, 2007Publication date: June 19, 2008Inventors: Steven Verha Verbeke, J. Kelly Truman, Christopher T. Lane, Sasson R. Somekh
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Publication number: 20080138917Abstract: A method of a single wafer wet/dry cleaning apparatus comprising: a transfer chamber having a wafer handler contained therein; a first single wafer wet cleaning chamber directly coupled to the transfer chamber; and a first single wafer ashing chamber directly coupled to the transfer chamber.Type: ApplicationFiled: October 26, 2007Publication date: June 12, 2008Inventors: STEVEN VERHAVERBEKE, J KELLY TRUMAN, CHRISTOPHER T. LANE, SASSON R. SOMEKH
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Patent number: 7159599Abstract: A method of a single wafer wet/dry cleaning apparatus comprising: a transfer chamber having a wafer handler contained therein; a first single wafer wet cleaning chamber directly coupled to the transfer chamber; and a first single wafer ashing chamber directly coupled to the transfer chamber.Type: GrantFiled: August 27, 2002Date of Patent: January 9, 2007Assignee: Applied Materials, Inc.Inventors: Steven Verhaverbeke, J Kelly Truman, Christopher T Lane, Sasson R Somekh
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Patent number: 7048837Abstract: Plasma etching or resputtering of a layer of sputtered materials including opaque metal conductor materials may be controlled in a sputter reactor system. In one embodiment, resputtering of a sputter deposited layer is performed after material has been sputtered deposited and while additional material is being sputter deposited onto a substrate. A path positioned within a chamber of the system directs light or other radiation emitted by the plasma to a chamber window or other optical view-port which is protected by a shield against deposition by the conductor material. In one embodiment, the radiation path is folded to reflect plasma light around the chamber shield and through the window to a detector positioned outside the chamber window.Type: GrantFiled: September 11, 2003Date of Patent: May 23, 2006Assignee: Applied Materials, Inc.Inventors: Sasson R. Somekh, Marc O. Schweitzer, John C. Forster, Zheng Xu, Roderick C. Mosely, Barry L. Chin, Howard E. Grunes
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Patent number: 6900135Abstract: A wafer processing station includes an air gap chuck and a light emitter/collector assembly configured to gather light when scattered or reflected by contaminants on the wafer. The light emitter/collector assembly is driven by an actuator so that it passes across a backside surface of a wafer when supported within the chuck during wafer inspection. The wafer processing station may also include a cleaning module configured to clean the backside surface of the wafer when contaminants are discovered during wafer inspection. A computer system may be coupled to receive one or more signals from the light emitter/collector assembly that are indicative of contaminants on the backside surface of the wafer and to provide one or more control signals to the cleaning module in accordance therewith. The cleaning module may be used independently of the light emitter/collector assembly and vice-versa.Type: GrantFiled: December 27, 2002Date of Patent: May 31, 2005Assignee: Applied Materials, Inc.Inventors: Sasson R. Somekh, Yoram Uziel, Raphy Adout
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Patent number: 6729944Abstract: A chemical mechanical polishing apparatus has a rotatable platen, a polishing sheet that is wider than the substrate extending between two reels, a drive mechanism to advance the polishing sheet, and a chucking mechanism to intermittently secure the polishing sheet to the platen. The platen can have a platen base that is adaptable to receive either a circular platen top or a rectangular platen top.Type: GrantFiled: June 17, 2002Date of Patent: May 4, 2004Assignee: Applied Materials Inc.Inventors: Manoocher Birang, Lawrence M Rosenberg, Sasson R Somekh, John M White
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Publication number: 20040042877Abstract: A wafer processing station includes an air gap chuck and a light emitter/collector assembly configured to gather light when scattered or reflected by contaminants on the wafer. The light emitter/collector assembly is driven by an actuator so that it passes across a backside surface of a wafer when supported within the chuck during wafer inspection. The wafer processing station may also include a cleaning module configured to clean the backside surface of the wafer when contaminants are discovered during wafer inspection. A computer system may be coupled to receive one or more signals from the light emitter/collector assembly that are indicative of contaminants on the backside surface of the wafer and to provide one or more control signals to the cleaning module in accordance therewith.Type: ApplicationFiled: December 27, 2002Publication date: March 4, 2004Inventors: Sasson R. Somekh, Yoram Uziel, Raphy Adout
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Publication number: 20030045131Abstract: A method of a single wafer wet/dry cleaning apparatus comprising:Type: ApplicationFiled: August 27, 2002Publication date: March 6, 2003Applicant: Applied Materials, Inc.Inventors: Steven Verha Verbeke, J. Kelly Truman, Christopher T. Lane, Sasson R. Somekh
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Patent number: 5643366Abstract: A structure and method for handling and processing wafers in a face down configuration is disclosed. A robot insertion blade supports a wafer to be processed in a recess having conically sloping wafer holding surfaces which touch the wafer only at its outer periphery. Once positioned in the chamber, a set of three transfer finger with sloped contact surfaces supported from a "C" shaped support assembly raise the wafer adjacent to a susceptor bottom surface. A recess in the face of the susceptor covering a large portion of the wafer is evacuated, compared to process chamber pressure, and when the differential pressure between the processing chamber and the evacuated recess behind the wafer can support the wafer, the transfer finger supports are lower and rotated out from under the wafer and susceptor assembly. The susceptor with the wafer attached by vacuum is then lowered to a processing location in contact with shadow rings supported by the "C" shaped support assembly and opposite a gas distribution plate.Type: GrantFiled: January 31, 1994Date of Patent: July 1, 1997Assignee: Applied Materials, Inc.Inventors: Sasson R. Somekh, Philip M. Salzman, Oskar U. Vierny
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Patent number: 5280983Abstract: A wafer processing system includes an autoloader mounted within a load lock for providing batch, cassette-to-cassette automatic wafer transfer between the semiconductor processing chamber and cassette load and unload positions within the load lock. The system provides rapid, contamination-free loading and unloading of semiconductor wafers.Type: GrantFiled: October 19, 1992Date of Patent: January 25, 1994Assignee: Applied Materials, Inc.Inventors: Dan Maydan, Sasson R. Somekh, Charles Ryan-Harris, Richard A. Seilheimer, David Cheng, Edward M. Abolnikov, Lance S. Reinke, J. Christopher Moran, Richard M. Catlin, Jr., Robert B. Lowrance, Gregory W. Ridgeway
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Patent number: 5224809Abstract: A wafer processing system includes an autoloader mounted within a load lock for providing batch, cassette-to-cassette automatic wafer transfer between the semiconductor processing chamber and cassette load and unload positions within the load lock. The system provides rapid, contamination-free loading and unloading of semiconductor wafers.Type: GrantFiled: December 30, 1991Date of Patent: July 6, 1993Assignee: Applied Materials, Inc.Inventors: Dan Maydan, Sasson R. Somekh, Charles Ryan-Harris, Richard A. Seilheimer, David Cheng, Edward M. Abolnikov, Lance S. Reinke, J. Christopher Moran, Richard M. Catlin, Jr., Robert B. Lowrance, Gregory W. Ridgeway
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Patent number: 4911597Abstract: A wafer processing system includes an autoloader mounted within a load lock for providing batch, cassette-to-cassette automatic wafer transfer between the semiconductor processing chamber and cassette load and unload positions within the load lock. The system provides rapid, contamination-free loading and unloading of semiconductor wafers.Type: GrantFiled: August 25, 1987Date of Patent: March 27, 1990Assignee: Applied Materials, Inc.Inventors: Dan Maydan, Sasson R. Somekh, Charles Ryan-Harris, Richard A. Seilheimer, David Cheng, Edward M. Abolnikov, Lance S. Reinke, J. Christopher Moran, Richard M. Catlin, Jr., Robert B. Lowrance, Gregory W. Ridgeway