Patents by Inventor Sathish Balakrishnan

Sathish Balakrishnan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Image based ultrasound probe calibration
    Patent number: 11911223
    Abstract: An image-based approach of calibrating an ultrasound-probe is described, wherein at least two ultrasound-images which cross each other are acquired with a tracked ultrasound probe, and wherein the intersection areas of these images, which have been calculated on the basis of the tracked spatial position of the ultrasound probe are checked for similar image content. The grade of similarity gives an indication as to how well the ultrasound probe is calibrated.
    Type: Grant
    Filed: February 23, 2018
    Date of Patent: February 27, 2024
    Assignee: Brainlab AG
    Inventors: Hubert Götte, Alfredo Guillermo Illanes Manríquez, Michael Friebe, Sathish Balakrishnan, Prabal Poudel
  • Transducer and method for mounting the same
    Publication number: 20070257083
    Abstract: A transducer is provided that comprises a horn having a longitudinal axis, a bonding tool attached to the horn, and an ultrasonic generator attached to the horn and spaced from the bonding tool along the longitudinal axis of the horn. A flexure is attached to the horn between the bonding tool and the ultrasonic generator for supporting the horn whereby to increase its dynamic rigidity in directions transverse to the longitudinal axis. (FIG.
    Type: Application
    Filed: May 3, 2006
    Publication date: November 8, 2007
    Inventors: Srikanth Narasimalu, Chee Lim, Sathish Balakrishnan
  • Forced heat transfer apparatus for heating stacked dice
    Publication number: 20070152324
    Abstract: An apparatus and method are provided for effectively heating a first die stacked above a second die attached onto a substrate during wire bonding conducted on the first die. A gas outlet positionable adjacent to the first die is configured to project a hot gas onto bond pads of the first die for bringing the bond pads to a desired bonding temperature, thereby rapidly heating the first die for effective wire bonding.
    Type: Application
    Filed: December 29, 2005
    Publication date: July 5, 2007
    Inventors: Srikanth Narasimalu, Sathish Balakrishnan, Lin Ji
  • Bonding apparatus comprising improved oscillation amplification device
    Publication number: 20070084900
    Abstract: A bonding apparatus such as an ultrasonic transducer is provided that comprises an oscillation amplification device having a longitudinal axis and a substantially triangular cross-sectional area on a plane that is orthogonal to the longitudinal axis. An ultrasonic driver is coupled to the oscillation amplification device at a first position along the longitudinal axis and a bonding tool is mounted to the oscillation amplification device at a second position along the longitudinal axis spaced from the first position.
    Type: Application
    Filed: October 14, 2005
    Publication date: April 19, 2007
    Inventors: Srikanth Narasimalu, Sathish Balakrishnan, Chee Lim