Patents by Inventor Sathya Swaroop GANTA
Sathya Swaroop GANTA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250022694Abstract: A substrate support assembly includes a heater plate including a dielectric material, a heater electrode embedded within the heater plate, a set of distributed purge channels formed within the heater plate, wherein the set of distributed purge channels provides a set of gas flow paths to equalize a gas flow from within the heater plate and direct the gas flow in a direction below the heater plate, a ground electrode embedded within the heater plate, and a radio frequency (RF) mesh embedded within the plate.Type: ApplicationFiled: July 3, 2024Publication date: January 16, 2025Inventors: Pranav Vijay Gadre, Adib M. Khan, Qiwei Liang, Dmitry Lubomirsky, Hyun Joo Lee, Paneendra Prakash Bhat, Douglas A. Buchberger, JR., Onkara Swamy Korasiddaramaiah, Vijay D. Parkhe, Junghoon Kim, Kallol Bera, Rupali Sahu, Sathya Swaroop Ganta
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Publication number: 20240395506Abstract: A microwave plasma impedance transformers comprising a thermal break and methods of use are described. The impedance transformer comprises a housing having a first end and a second end defining a length of the housing. The housing has a channel with channel walls extending through the length from the first end to the second end, and the channel has an opening in the first end of the housing with a first end diameter and an opening in the second end of the housing with a second end diameter. The first end diameter being greater than the second end diameter. The channel acts as a conical impedance transformer.Type: ApplicationFiled: November 9, 2023Publication date: November 28, 2024Applicant: Applied Materials, Inc.Inventors: Kenneth Brian Doering, Xiaokang Yang, Sathya Swaroop Ganta
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Publication number: 20240297059Abstract: Embodiments of the present disclosure generally relate to semiconductor processing equipment, and more specifically to apparatus, e.g., magnet holding structures, that can be used with magnets during plasma processing of a substrate. In an embodiment, a magnet holding structure for a plasma-enhanced chemical vapor deposition chamber is provided. The magnet holding structure includes a top piece having a plurality of magnet retention members and a bottom piece having a plurality of magnet retention members. The top piece has a first inside edge and a first outside edge, and the bottom piece has a second inside edge and a second outside edge. The magnet holding structure further includes a plurality of casings. Each casing of the plurality of casings is configured to at least partially encapsulate a magnet, and each casing positioned between a magnet retention member of the top piece and a magnet retention member of the bottom piece.Type: ApplicationFiled: May 14, 2024Publication date: September 5, 2024Inventors: Andrew NGUYEN, Sathya Swaroop GANTA, Kallol BERA, Canfeng LAI
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Publication number: 20240271284Abstract: Embodiments described herein relate to magnetic and electromagnetic systems and a method for controlling the density profile of plasma generated in a process volume of a PECVD chamber to affect deposition profile of a film on a substrate and/or facilitate chamber cleaning after processing. In one embodiment, a system is disclosed that includes a rotational magnetic housing disposed about an exterior sidewall of a chamber. The rotational magnetic housing includes a plurality of magnets coupled to a sleeve that are configured to travel in a circular path when the rotational magnetic housing is rotated around the chamber, and a plurality of shunt doors movably disposed between the chamber and the sleeve, wherein each of the shunt doors are configured to move relative to the magnets.Type: ApplicationFiled: April 12, 2024Publication date: August 15, 2024Inventors: Kallol BERA, Sathya Swaroop GANTA, Timothy Joseph FRANKLIN, Kaushik ALAYAVALLI, Akshay DHANAKSHIRUR, Stephen C. GARNER, Bhaskar KUMAR
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Patent number: 12033835Abstract: Embodiments disclosed herein include a modular microwave source array. In an embodiment, a housing assembly for the source array comprises a first conductive layer, wherein the first conductive layer comprises a first coefficient of thermal expansion (CTE), and a second conductive layer over the first conductive layer, wherein the second conductive layer comprises a second CTE that is different than the first CTE. In an embodiment, the housing assembly further comprises a plurality of openings through the housing assembly, where each opening passes through the first conductive layer and the second conductive layer.Type: GrantFiled: June 10, 2020Date of Patent: July 9, 2024Assignee: Applied Materials, Inc.Inventors: Philip Allan Kraus, Robert Moore, James Carducci, Richard Fovell, Sathya Swaroop Ganta, Karthikeyan Balaraman, Silverst Rodrigues
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Patent number: 12020965Abstract: Embodiments of the present disclosure generally relate to semiconductor processing equipment, and more specifically to apparatus, e.g., magnet holding structures, that can be used with magnets during plasma processing of a substrate. In an embodiment, a magnet holding structure for a plasma-enhanced chemical vapor deposition chamber is provided. The magnet holding structure includes a top piece having a plurality of magnet retention members and a bottom piece having a plurality of magnet retention members. The top piece has a first inside edge and a first outside edge, and the bottom piece has a second inside edge and a second outside edge. The magnet holding structure further includes a plurality of casings. Each casing of the plurality of casings is configured to at least partially encapsulate a magnet, and each casing positioned between a magnet retention member of the top piece and a magnet retention member of the bottom piece.Type: GrantFiled: October 21, 2020Date of Patent: June 25, 2024Assignee: APPLIED MATERIALS, INC.Inventors: Andrew Nguyen, Sathya Swaroop Ganta, Kallol Bera, Canfeng Lai
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Patent number: 11984302Abstract: A plasma chamber includes a chamber body having a processing region therewithin, a liner disposed on the chamber body, the liner surrounding the processing region, a substrate support disposed within the liner, a magnet assembly comprising a plurality of magnets disposed around the liner, and a magnetic-material shield disposed around the liner, the magnetic-material shield encapsulating the processing region near the substrate support.Type: GrantFiled: November 3, 2020Date of Patent: May 14, 2024Assignee: Applied Materials, Inc.Inventors: Job George Konnoth Joseph, Sathya Swaroop Ganta, Kallol Bera, Andrew Nguyen, Jay D. Pinson, II, Akshay Dhanakshirur, Kaushik Comandoor Alayavalli, Canfeng Lai, Ren-Guan Duan, Jennifer Y. Sun, Anil Kumar Kalal, Abhishek Pandey
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Patent number: 11959174Abstract: Embodiments described herein relate to magnetic and electromagnetic systems and a method for controlling the density profile of plasma generated in a process volume of a PECVD chamber to affect deposition profile of a film on a substrate and/or facilitate chamber cleaning after processing. In one embodiment, a system is disclosed that includes a rotational magnetic housing disposed about an exterior sidewall of a chamber. The rotational magnetic housing includes a plurality of magnets coupled to a sleeve that are configured to travel in a circular path when the rotational magnetic housing is rotated around the chamber, and a plurality of shunt doors movably disposed between the chamber and the sleeve, wherein each of the shunt doors are configured to move relative to the magnets.Type: GrantFiled: December 22, 2020Date of Patent: April 16, 2024Assignee: Applied Materials, Inc.Inventors: Kallol Bera, Sathya Swaroop Ganta, Timothy Joseph Franklin, Kaushik Alayavalli, Akshay Dhanakshirur, Stephen C. Garner, Bhaskar Kumar
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Publication number: 20240018646Abstract: Embodiments disclosed herein include semiconductor processing tools. In an embodiment, the semiconductor processing tool comprises a chamber, a chuck within the chamber, where the chuck is configured to rotate, a pedestal holder around the chuck, and a utility column coupled to the chuck. In an embodiment, the utility column comprises a magnetic coupler to enable rotation of portions of the utility column and the chuck, and a rotary electrical feedthrough.Type: ApplicationFiled: July 14, 2022Publication date: January 18, 2024Inventors: ANANTHA SUBRAMANI, YANG GUO, JOHN FORSTER, WADE HARRELSON, ANDREW TOMKO, ANTHONY CHAN, SATHYA SWAROOP GANTA, MIKE MURTAGH, SANJEEV BALUJA
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Publication number: 20230377855Abstract: Embodiments of the present disclosure generally relate to a substrate processing chamber, and methods for cleaning the substrate processing chamber are provided herein. An electrode cleaning ring is disposed in a lower portion of a process volume (e.g., disposed below a substrate support in the process volume). The electrode cleaning ring is a capacitively coupled plasma source. The electrode cleaning ring propagates plasma into the lower portion of the process volume. RF power is provided to the electrode cleaning ring via an RF power feed-through. The RF plasma propagated by the electrode cleaning ring removes deposition residue in the lower portion of the process volume.Type: ApplicationFiled: May 20, 2022Publication date: November 23, 2023Inventors: Mukesh Shivakumaraiah CHITRADURGA, Luke BONECUTTER, Sathya Swaroop GANTA, Canfeng LAI, Jay D. PINSON, Kaushik Comandoor ALAYAVALLI, Kallol BERA
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Publication number: 20220349050Abstract: Embodiments of the present disclosure generally relate a process chamber including a lid and a chamber body coupled to the lid. The chamber body and lid define a process volume and a coupling ring is disposed within the chamber body and below the lid. The coupling ring is coupled to ground or is coupled to a coupling RF power source. A substrate support is disposed and movable within the process volume.Type: ApplicationFiled: April 25, 2022Publication date: November 3, 2022Inventors: Rick KUSTRA, Kaushik Comandoor ALAYAVALLI, Jay D. PINSON, II, Sathya Swaroop GANTA, Anup Kumar SINGH
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Publication number: 20220139679Abstract: A plasma chamber includes a chamber body having a processing region therewithin, a liner disposed on the chamber body, the liner surrounding the processing region, a substrate support disposed within the liner, a magnet assembly comprising a plurality of magnets disposed around the liner, and a magnetic-material shield disposed around the liner, the magnetic-material shield encapsulating the processing region near the substrate support.Type: ApplicationFiled: November 3, 2020Publication date: May 5, 2022Inventors: Job George KONNOTH JOSEPH, Sathya Swaroop GANTA, Kallol BERA, Andrew NGUYEN, Jay D. PINSON, II, Akshay DHANAKSHIRUR, Kaushik Comandoor ALAYAVALLI, Canfeng LAI, Ren-Guan DUAN, Jennifer Y. SUN, Anil Kumar KALAL, Abhishek PANDEY
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Publication number: 20220122866Abstract: Embodiments of the present disclosure generally relate to semiconductor processing equipment, and more specifically to apparatus, e.g., magnet holding structures, that can be used with magnets during plasma processing of a substrate. In an embodiment, a magnet holding structure for a plasma-enhanced chemical vapor deposition chamber is provided. The magnet holding structure includes a top piece having a plurality of magnet retention members and a bottom piece having a plurality of magnet retention members. The top piece has a first inside edge and a first outside edge, and the bottom piece has a second inside edge and a second outside edge. The magnet holding structure further includes a plurality of casings. Each casing of the plurality of casings is configured to at least partially encapsulate a magnet, and each casing positioned between a magnet retention member of the top piece and a magnet retention member of the bottom piece.Type: ApplicationFiled: October 21, 2020Publication date: April 21, 2022Inventors: Andrew NGUYEN, Sathya Swaroop GANTA, Kallol BERA, Canfeng LAI
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Publication number: 20220064797Abstract: A lid for a process chamber includes a plate having a first surface and a second surface opposite the first surface. The first surface has a recess and a seal groove formed in the first surface and surrounding the recess. The lid further includes an array of holes extending from the recess to the second surface.Type: ApplicationFiled: August 16, 2021Publication date: March 3, 2022Inventors: Akshay DHANAKSHIRUR, Juan Carlos ROCHA-ALVAREZ, Kaushik Comandoor ALAYAVALLI, Jay D. PINSON, II, Rick KUSTRA, Badri N. RAMAMURTHI, Anup Kumar SINGH, Ganesh BALASUBRAMANIAN, Bhaskar KUMAR, Vinayak Vishwanath HASSAN, Canfeng LAI, Kallol BERA, Sathya Swaroop GANTA
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Publication number: 20210391149Abstract: Embodiments disclosed herein include a modular microwave source array. In an embodiment, a housing assembly for the source array comprises a first conductive layer, wherein the first conductive layer comprises a first coefficient of thermal expansion (CTE), and a second conductive layer over the first conductive layer, wherein the second conductive layer comprises a second CTE that is different than the first CTE. In an embodiment, the housing assembly further comprises a plurality of openings through the housing assembly, where each opening passes through the first conductive layer and the second conductive layer.Type: ApplicationFiled: June 10, 2020Publication date: December 16, 2021Inventors: Philip Allan Kraus, Robert Moore, James Carducci, Richard Fovell, Sathya Swaroop Ganta, Karthikeyan Balaraman, Silverst Rodrigues
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Publication number: 20210269919Abstract: Embodiments described herein relate to magnetic and electromagnetic systems and a method for controlling the density profile of plasma generated in a process volume of a PECVD chamber to affect deposition profile of a film on a substrate and/or facilitate chamber cleaning after processing. In one embodiment, a system is disclosed that includes a rotational magnetic housing disposed about an exterior sidewall of a chamber. The rotational magnetic housing includes a plurality of magnets coupled to a sleeve that are configured to travel in a circular path when the rotational magnetic housing is rotated around the chamber, and a plurality of shunt doors movably disposed between the chamber and the sleeve, wherein each of the shunt doors are configured to move relative to the magnets.Type: ApplicationFiled: December 22, 2020Publication date: September 2, 2021Inventors: Kallol BERA, Sathya Swaroop GANTA, Timothy Joseph FRANKLIN, Kaushik ALAYAVALLI, Akshay DHANAKSHIRUR, Stephen C. GARNER, Bhaskar KUMAR