Patents by Inventor Satish Das

Satish Das has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Messaging abstraction layer for integration with message oriented middleware platforms
    Patent number: 10896077
    Abstract: An apparatus in one embodiment comprises at least one processing platform comprising a plurality of processing devices. The at least one processing platform is configured to provide a plurality of applications with centralized access to a plurality of message oriented middleware (MOM) servers via a connectivity layer, to establish a connection between a given one of the plurality of applications and a given one of the plurality of MOM servers via the connectivity layer, and to exchange data between the given one of the plurality of applications and the given one of the plurality of MOM servers via the connectivity layer.
    Type: Grant
    Filed: March 14, 2019
    Date of Patent: January 19, 2021
    Assignee: Dell Products L.P.
    Inventors: Hung Dinh, Krishna Akkinapalli, Gnanesh Gowda, Reddeppa Kollu, Sabu Syed, Craig Van Der Bogart, Satish Das, Karan Kapoor, Panguluru Vijaya Sekhar, Vinay Sathyanarayana, Abhijit Mishra, Vellore Mohammed Imran, Tousif Mohammed, Nagireddy Bonthu, Vinod Kumar, Puttaraju Bommanna Chikkanna, John Kenneth Maxi
  • Internet of Things connectivity platform
    Patent number: 10819796
    Abstract: An apparatus in one embodiment comprises at least one processing platform comprising a plurality of processing devices. The at least one processing platform is configured to establish a connection between a given one of a plurality of Internet of Things (IoT) clients and a given one of a plurality of IoT brokers via a connectivity layer providing the plurality of IoT clients with centralized access to the plurality of IoT brokers, and to exchange data between the given one of the plurality of IoT clients and the given one of the plurality of IoT brokers via the connectivity layer.
    Type: Grant
    Filed: January 8, 2019
    Date of Patent: October 27, 2020
    Assignee: EMC IP Holding Company LLC
    Inventors: Hung Dinh, Sudhir Vijendra, Satish Das, Sachin Yadav, Reddeppa Kollu
  • MESSAGING ABSTRACTION LAYER FOR INTEGRATION WITH MESSAGE ORIENTED MIDDLEWARE PLATFORMS
    Publication number: 20200293386
    Abstract: An apparatus in one embodiment comprises at least one processing platform comprising a plurality of processing devices. The at least one processing platform is configured to provide a plurality of applications with centralized access to a plurality of message oriented middleware (MOM) servers via a connectivity layer, to establish a connection between a given one of the plurality of applications and a given one of the plurality of MOM servers via the connectivity layer, and to exchange data between the given one of the plurality of applications and the given one of the plurality of MOM servers via the connectivity layer.
    Type: Application
    Filed: March 14, 2019
    Publication date: September 17, 2020
    Inventors: Hung Dinh, Krishna Akkinapalli, Gnanesh Gowda, Reddeppa Kollu, Sabu Syed, Craig Van Der Bogart, Satish Das, Karan Kapoor, Panguluru Vijaya Sekhar, Vinay Sathyanarayana, Abhijit Mishra, Vellore Mohammed Imran, Tousif Mohammed, Nagireddy Bonthu, Vinod Kumar, Puttaraju Bommanna Chikkanna, John Kenneth Maxi
  • INTERNET OF THINGS CONNECTIVITY PLATFORM
    Publication number: 20200220931
    Abstract: An apparatus in one embodiment comprises at least one processing platform comprising a plurality of processing devices. The at least one processing platform is configured to establish a connection between a given one of a plurality of Internet of Things (IoT) clients and a given one of a plurality of IoT brokers via a connectivity layer providing the plurality of IoT clients with centralized access to the plurality of IoT brokers, and to exchange data between the given one of the plurality of IoT clients and the given one of the plurality of IoT brokers via the connectivity layer.
    Type: Application
    Filed: January 8, 2019
    Publication date: July 9, 2020
    Inventors: Hung Dinh, Sudhir Vijendra, Satish Das, Sachin Yadav, Reddeppa Kollu