Abstract: Disclosed are a method, apparatus, and computer program product to implement routing for double patterning lithography. A three-phase routing scheme is employed, comprising a global router, a C-router, and a detail router. The C-router provides double patterning color seeding for routing tracks in the electronic design. The detail router employs space-tiles to perform double-patterning based routing for wires in the electronic design.

Abstract: Disclosed are a method, apparatus, and computer program product to implement routing for double patterning lithography. A three-phase routing scheme is employed, comprising a global router, a C-router, and a detail router. The C-router provides double patterning color seeding for shapes on routing tracks in the electronic design. The detail router employs space-tiles to perform double-patterning based routing for wires in the electronic design.

Abstract: Disclosed are a method, apparatus, and computer program product to implement routing for double patterning lithography using colored space tiles. A three-phase routing scheme is employed, comprising a global router, a C-router, and a detail router. The C-router provides double patterning color seeding for routing tracks in the electronic design. The detail router employs space-tiles to perform double-patterning based routing for wires in the electronic design. Colored space tiles may be utilized to perform the detail routing.

Abstract: Disclosed are methods and mechanisms for implementing tessellation-based processing of an integrated circuit design. Tessellation based routing of objects on an integrated circuit layout can be performed by identifying a spacing rule for tessellating at least a portion of the integrated circuit layout, forming one or more plane figures in the tessellation having one or more edges compliant with the spacing rule, the edges of the one or more plane figures forming a contour derived from a shape of a blockage object, and identifying a routing path along at least part of the one or more edges. Packing and pushing of objects may be performed using this approach.

Abstract: Disclosed are methods and mechanisms for implementing tessellation-based processing of an integrated circuit design. Tessellation based routing of objects on an integrated circuit layout can be performed by identifying a spacing rule for tessellating at least a portion of the integrated circuit layout, forming one or more plane figures in the tessellation having one or more edges compliant with the spacing rule, the edges of the one or more plane figures forming a contour derived from a shape of a blockage object, and identifying a routing path along at least part of the one or more edges. Packing and pushing of objects may be performed using this approach.

Abstract: Disclosed are methods and mechanisms for implementing tessellation-based processing of an integrated circuit design. Tessellation based routing of objects on an integrated circuit layout can be performed by identifying a spacing rule for tessellating at least a portion of the integrated circuit layout, forming one or more plane figures in the tessellation having one or more edges compliant with the spacing rule, the edges of the one or more plane figures forming a contour derived from a shape of a blockage object, and identifying a routing path along at least part of the one or more edges. Packing and pushing of objects may be performed using this approach.