Patents by Inventor Satish Sivarama Gunturi
Satish Sivarama Gunturi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20150022975Abstract: A method and system for cooling a heat-generating component are provided. The system includes a heat generating electronic component including a heat conductive face, a heat sink device including at least one open face pin fin array surface directly coupled to the conductive face, each fin including a distal end including an outwardly facing contact area, the contact areas covering only a portion of the conductive face, the contact areas configured to carry electrical current therethrough, and an immersion of dielectric fluid contained in a vessel, the vessel including a heat-conductive hull at least partially submerged in a heat sink fluid.Type: ApplicationFiled: July 19, 2013Publication date: January 22, 2015Applicant: General Electric CompanyInventors: Eric Ayres Browne, Satish Sivarama Gunturi, Brian Magann Rush, Rixin Lai, Anurag Kasyap Vejjupalle Subramanyam
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Publication number: 20130313906Abstract: A load bypass switch enables continuous power to remote loads in the event of 1) failure of one or more remote loads, or 2) faults within the remote loads, within a dc power system. The bypass switch utilizes the passive components of the dc loads or inverters and therefore reduces overall component count. A black start method for the remote dc system uses the same passives present inside the loads/inverters and simultaneously uses some of the features of the bypass switch. A bypass-module-yard uses multiple bypass switches enabling continuous power to the remote loads in the event of failure of one or more power distribution cables (in-feed to the remote loads) located remotely in the dc system.Type: ApplicationFiled: May 23, 2012Publication date: November 28, 2013Applicant: GENERAL ELECTRIC COMPANYInventors: Ranjan Kumar Gupta, Christof Martin Sihler, Satish Sivarama Gunturi, Stefan Schroeder, Joseph Song Manguelle, Ravisekhar Nadimpalli Raju, Rajib Datta
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Patent number: 8531027Abstract: Systems and methods for utilizing power overlay (POL) technology and semiconductor press-pack technology to produce semiconductor packages with higher reliability and power density are provided. A POL structure may interconnect semiconductor devices within a semiconductor package, and certain embodiments may be implemented to reduce the probability of damaging the semiconductor devices during the pressing of the conductive plates. In one embodiment, springs and/or spacers may be used to reduce or control the force applied by an emitter plate onto the semiconductor devices in the package. In another embodiment, the emitter plate may be recessed to exert force on the POL structure, rather than directly against the semiconductor devices. Further, in some embodiments, the conductive layer of the POL structure may be grown to function as an emitter plate, and regions of the conductive layer may be made porous to provide compliance.Type: GrantFiled: April 30, 2010Date of Patent: September 10, 2013Assignee: General Electric CompanyInventors: Arun Virupaksha Gowda, Ahmed Elasser, Satish Sivarama Gunturi
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Patent number: 8218320Abstract: A heat sink for cooling at least one electronic device package includes a lower lid, an upper lid, and a body formed of at least one thermally conductive material. The body is disposed between and sealed to the lower and upper lids and defines a tapered inlet distribution chamber configured to receive a coolant, C-shaped inlet manifolds configured to receive the coolant from the tapered inlet distribution chamber, inverted C-shaped outlet manifolds configured to exhaust the coolant. The inlet and outlet manifolds are interleaved and disposed in a circular arrangement. The outlet manifolds extend around only a portion of the body and terminate adjacent to opposing sides of the inlet chamber. The body further defines a tapered outlet chamber configured to receive the coolant from the outlet manifolds, where the inlet manifolds extend around only a portion of the body and terminate adjacent to opposing sides of the tapered outlet chamber.Type: GrantFiled: June 29, 2010Date of Patent: July 10, 2012Assignee: General Electric CompanyInventors: Adam Gregory Pautsch, Satish Sivarama Gunturi, Patrick Jose Lazatin
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Patent number: 8120915Abstract: A heat sink is provided for directly cooling at least one electronic device package having an upper contact surface and a lower contact surface. The heat sink comprises a cooling piece formed of at least one thermally conductive material, where the cooling piece defines at least one inlet manifold configured to receive a coolant and at least one outlet manifolds configured to exhaust the coolant. The inlet and outlet manifolds are interleaved and are disposed in a spiral arrangement. The cooling piece further defines a number of millichannels disposed in a radial arrangement and configured to receive the coolant from the inlet manifolds and to deliver the coolant to the outlet manifolds. The millichannels and inlet and outlet manifolds are further configured to directly cool one of the upper and lower contact surface of the electronic device package by direct contact with the coolant, such that the heat sink comprises an integral heat sink.Type: GrantFiled: August 23, 2010Date of Patent: February 21, 2012Assignee: General Electric CompanyInventors: Adam Gregory Pautsch, Satish Sivarama Gunturi, Patrick Jose Lazatin
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Publication number: 20110317369Abstract: A heat sink for cooling at least one electronic device package includes a lower lid, an upper lid and a body formed of at least one thermally conductive material. The body is disposed between and sealed to the lower and upper lids and defines inlet manifolds configured to receive a coolant and outlet manifolds configured to exhaust the coolant. The inlet and outlet manifolds are interleaved and are disposed in a circular or spiral arrangement. Millichannels are formed in the body or in the lids, are disposed in a radial arrangement, and are configured to receive the coolant from the inlet manifolds and to deliver the coolant to the outlet manifolds. The millichannels and inlet and outlet manifolds are further configured to cool one of the upper and lower contact surfaces of the electronic device package. Heat sinks with a single lid are also provided.Type: ApplicationFiled: June 29, 2010Publication date: December 29, 2011Applicant: GENERAL ELECTRIC COMPANYInventors: Adam Gregory Pautsch, Satish Sivarama Gunturi, Patrick Jose Lazatin
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Publication number: 20110317368Abstract: A heat sink for cooling at least one electronic device package includes a lower lid, an upper lid, and a body formed of at least one thermally conductive material. The body is disposed between and sealed to the lower and upper lids and defines a tapered inlet distribution chamber configured to receive a coolant, C-shaped inlet manifolds configured to receive the coolant from the tapered inlet distribution chamber, inverted C-shaped outlet manifolds configured to exhaust the coolant. The inlet and outlet manifolds are interleaved and disposed in a circular arrangement. The outlet manifolds extend around only a portion of the body and terminate adjacent to opposing sides of the inlet chamber. The body further defines a tapered outlet chamber configured to receive the coolant from the outlet manifolds, where the inlet manifolds extend around only a portion of the body and terminate adjacent to opposing sides of the tapered outlet chamber.Type: ApplicationFiled: June 29, 2010Publication date: December 29, 2011Applicant: GENERAL ELECTRIC COMPANYInventors: Adam Gregory Pautsch, Satish Sivarama Gunturi, Patrick Jose Lazatin
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Publication number: 20110266665Abstract: Systems and methods for utilizing power overlay (POL) technology and semiconductor press-pack technology to produce semiconductor packages with higher reliability and power density are provided. A POL structure may interconnect semiconductor devices within a semiconductor package, and certain embodiments may be implemented to reduce the probability of damaging the semiconductor devices during the pressing of the conductive plates. In one embodiment, springs and/or spacers may be used to reduce or control the force applied by an emitter plate onto the semiconductor devices in the package. In another embodiment, the emitter plate may be recessed to exert force on the POL structure, rather than directly against the semiconductor devices. Further, in some embodiments, the conductive layer of the POL structure may be grown to function as an emitter plate, and regions of the conductive layer may be made porous to provide compliance.Type: ApplicationFiled: April 30, 2010Publication date: November 3, 2011Applicant: General Electric CompanyInventors: Arun Virupaksha Gowda, Ahmed Elasser, Satish Sivarama Gunturi
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Publication number: 20110135956Abstract: A method of joining a first component and a second component is provided. The first component has a surface that comprises at least about 75% by volume of a refractory metal. The second component has a coefficient of thermal expansion greater than a coefficient of thermal expansion of the first component. The method includes disposing a coating on the surface of the first component. The coating includes an adhesion layer and a wetting layer disposed over the adhesion layer. The method further includes disposing a bonding material between the first and second components and joining them. The bonding material has a melting temperature lower than a melting temperature of the second component. An article made using the method is also presented.Type: ApplicationFiled: December 8, 2009Publication date: June 9, 2011Applicant: GENERAL ELECTRIC COMPANYInventors: Satish Sivarama Gunturi, Thomas Carson Tiearney, JR., Kristopher John Frutschy, Dalong Zhong, Xi Zhang
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Publication number: 20100315782Abstract: A heat sink is provided for directly cooling at least one electronic device package having an upper contact surface and a lower contact surface. The heat sink comprises a cooling piece formed of at least one thermally conductive material, where the cooling piece defines at least one inlet manifold configured to receive a coolant and at least one outlet manifolds configured to exhaust the coolant. The inlet and outlet manifolds are interleaved and are disposed in a spiral arrangement. The cooling piece further defines a number of millichannels disposed in a radial arrangement and configured to receive the coolant from the inlet manifolds and to deliver the coolant to the outlet manifolds. The millichannels and inlet and outlet manifolds are further configured to directly cool one of the upper and lower contact surface of the electronic device package by direct contact with the coolant, such that the heat sink comprises an integral heat sink.Type: ApplicationFiled: August 23, 2010Publication date: December 16, 2010Applicant: GENERAL ELECTRIC COMPANYInventors: Adam Gregory Pautsch, Satish Sivarama Gunturi, Patrick Jose Lazatin
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Patent number: 7817422Abstract: A heat sink for directly cooling at least one electronic device package is provided. The electronic device package has an upper contact surface and a lower contact surface. The heat sink comprises a cooling piece formed of at least one thermally conductive material. The cooling piece defines multiple inlet manifolds configured to receive a coolant and multiple outlet manifolds configured to exhaust the coolant. The inlet and outlet manifolds are interleaved. The cooling piece further defines multiple millichannels configured to receive the coolant from the inlet manifolds and to deliver the coolant to the outlet manifolds. The millichannels and inlet and outlet manifolds are further configured to directly cool one of the upper and lower contact surface of the electronic device package by direct contact with the coolant, such that the heat sink comprises an integral heat sink.Type: GrantFiled: August 18, 2008Date of Patent: October 19, 2010Assignee: General Electric CompanyInventors: Satish Sivarama Gunturi, Mahadevan Balasubramaniam, Ramakrishna Venkata Mallina, Richard Alfred Beaupre, Le Yan, Richard S. Zhang, Ljubisa Dragoljub Stevanovic, Adam Gregory Pautsch, Stephen Adam Solovitz
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Publication number: 20100038058Abstract: A heat sink for directly cooling at least one electronic device package is provided. The electronic device package has an upper contact surface and a lower contact surface. The heat sink comprises a cooling piece formed of at least one thermally conductive material. The cooling piece defines multiple inlet manifolds configured to receive a coolant and multiple outlet manifolds configured to exhaust the coolant. The inlet and outlet manifolds are interleaved. The cooling piece further defines multiple millichannels configured to receive the coolant from the inlet manifolds and to deliver the coolant to the outlet manifolds. The millichannels and inlet and outlet manifolds are further configured to directly cool one of the upper and lower contact surface of the electronic device package by direct contact with the coolant, such that the heat sink comprises an integral heat sink.Type: ApplicationFiled: August 18, 2008Publication date: February 18, 2010Applicant: GENERAL ELECTRIC COMPANYInventors: Satish Sivarama Gunturi, Mahadevan Balasubramaniam, Ramakrishna Venkata Mallina, Richard Alfred Beaupre, Le Yan, Richard S. Zhang, Ljubisa Dragoljub Stevanovic, Adam Gregory Pautsch, Stephen Adam Solovitz