Abstract: A scalable diffusion-couple apparatus including: a transfer chamber configured to load a wafer into a process chamber which is configured to receive the wafer, the process chamber including: a heatable bottom disk including a first heating mechanism, where the heatable bottom disk is fixed, heatable to a specified temperature, and the wafer placed; and a heatable top disk including a second heating mechanism, where the heatable top disk is configured to move up and down along an x axis and an x prime axis to apply a mechanical pressure to the wafer, and where the heatable top disk applies the pressure while a chamber pressure is maintained at a less than or equal to 10?3 torr, where the first and second heating mechanisms are tuned independently, and where the wafer includes a diffusion material prior to application of the mechanical pressure and the specified temperature.

Abstract: An intercalation doping apparatus including: a reactor chamber where single or multiple wafers or substrates (SoMWoSubs) are disposed within the reactor chamber, where SoMWoSubs have a diameter or a side distance from 25 mm to 450 mm; a heater, where the heater is configured to provide heat to the SOMWoSubs disposed within the reactor chamber, where the SoMWoSubs include a temperature from 25° C. to 500° C.; where pressure is applied to at least one surface of the SOMWoSubs disposed within the reactor chamber within a range of 2 bar to 500 bar; and a dopant application apparatus, where the dopant application apparatus includes at least valves and tubing which bring dopants from outside to within the reactor chamber and includes at least a dopant crucible disposed within the reactor chamber, where the dopants include material in solid, liquid, or gaseous phase, and where the dopants include intercalation doping agents.

Abstract: In one aspect, a highly scalable diffusion-couple apparatus includes a transfer chamber configured to load a wafer into a process chamber. The process chamber is configured to receive the wafer substrate from the transfer chamber. The process chamber comprises a chamber for growth of a diffusion material on the wafer. A heatable bottom substrate disk includes a first heating mechanism. The heatable bottom substrate disk is fixed and heatable to a specified temperature. The wafer is placed on the heatable bottom substrate disk. A heatable top substrate disk comprising a second heating mechanism. The heatable top substrate disk is configured to move up and down along an x axis and an x prime axis to apply a mechanical pressure to the wafer on the heatable bottom substrate disk. While the heatable top substrate disk applies the mechanical pressure a chamber pressure is maintained at a specified low value.

Abstract: In one aspect, a highly scalable diffusion-couple apparatus includes a transfer chamber configured to load a wafer into a process chamber. The process chamber is configured to receive the wafer substrate from the transfer chamber. The process chamber comprises a chamber for growth of a diffusion material on the wafer. A heatable bottom substrate disk includes a first heating mechanism. The heatable bottom substrate disk is fixed and heatable to a specified temperature. The wafer is placed on the heatable bottom substrate disk. A heatable top substrate disk comprising a second heating mechanism. The heatable top substrate disk is configured to move up and down along an x axis and an x prime axis to apply a mechanical pressure to the wafer on the heatable bottom substrate disk. While the heatable top substrate disk applies the mechanical pressure a chamber pressure is maintained at a specified low value.

Abstract: In one aspect, a highly scalable diffusion-couple apparatus includes a transfer chamber configured to load a wafer into a process chamber. The process chamber is configured to receive the wafer substrate from the transfer chamber. The process chamber comprises a chamber for growth of a diffusion material on the wafer. A heatable bottom substrate disk includes a first heating mechanism. The heatable bottom substrate disk is fixed and heatable to a specified temperature. The wafer is placed on the heatable bottom substrate disk. A heatable top substrate disk comprising a second heating mechanism. The heatable top substrate disk is configured to move up and down along an x axis and an x prime axis to apply a mechanical pressure to the wafer on the heatable bottom substrate disk. While the heatable top substrate disk applies the mechanical pressure a chamber pressure is maintained at a specified low value.

Abstract: In one aspect, a highly scalable diffusion-couple apparatus includes a transfer chamber configured to load a wafer into a process chamber. The process chamber is configured to receive the wafer substrate from the transfer chamber. The process chamber comprises a chamber for growth of a diffusion material on the wafer. A heatable bottom substrate disk includes a first heating mechanism. The heatable bottom substrate disk is fixed and heatable to a specified temperature. The wafer is placed on the heatable bottom substrate disk. A heatable top substrate disk comprising a second heating mechanism. The heatable top substrate disk is configured to move up and down along an x axis and an x prime axis to apply a mechanical pressure to the wafer on the heatable bottom substrate disk. While the heatable top substrate disk applies the mechanical pressure a chamber pressure is maintained at a specified low value.

Abstract: A suitcase with retractable wheels is described. A linkage provides a means to raise and lower wheels either by a vertical motion or a folding motion such that the wheels may be extended for rolling the suitcase when the use is walking and the wheels may be retracted for easy stowage of the suitcase such as in a luggage compartment. The linkage may be attached to the back of the suitcase, located in the interior of the suitcase or enclosed in a shell that is attached to the back of the suitcase.

Abstract: A wafer processing system has a ring maintenance module for loading wafers into a chuck assembly, and for cleaning and inspecting the chuck assembly used in electroplating processors of the system. A shaft is attached to a rotor plate. A rotation motor rotates the shaft and a rotor plate on the shaft. A chuck clamp on an upper end of the shaft holds the chuck assembly onto the rotor plate. A lift motor raises and lowers the rotor plate and the shaft, to move open the chuck assembly for wafer loading and unloading, and to move the chuck assembly into different process positions. A swing arm having spray nozzles may be provided for cleaning the chuck assembly.

Abstract: A wafer processing system has a ring maintenance module for loading wafers into a chuck assembly, and for cleaning and inspecting the chuck assembly used in electroplating processors of the system. A shaft is attached to a rotor plate. A rotation motor rotates the shaft and a rotor plate on the shaft. A chuck clamp on an upper end of the shaft holds the chuck assembly onto the rotor plate. A lift motor raises and lowers the rotor plate and the shaft, to move open the chuck assembly for wafer loading and unloading, and to move the chuck assembly into different process positions. A swing arm having spray nozzles may be provided for cleaning the chuck assembly.

Abstract: Described herein is a method and apparatus for performing calibrations on robotic components. In one embodiment, a method for performing robotic calibrations includes moving the calibrating device across a target (e.g., a wafer chuck). Next, the method includes measuring distances between light spots from the sensors and a perimeter of the target using the sensors located on the calibrating device. Next, the method includes determining a displacement of the calibrating device relative to a center of the target. Then, the method includes determining a rotation angle of the calibrating device relative to a system of coordinates of the target. Next, the method includes calibrating a robot position of the robot based on the displacement and rotation angle of the calibrating device with respect to the target.

Abstract: Systems, apparatus and methods for transporting substrates between system components of an electronic device manufacturing system are provided. The systems and apparatus include an electrostatic end effector having a base, an electrode pair on the base, and spacer members for spacing the substrate from the electrode pairs to provide a gap between the electrode pair and the substrate. Methods of the invention as well as numerous other aspects are provided.

Abstract: Described herein is a method and apparatus for performing calibrations on robotic components. In one embodiment, a method for performing robotic calibrations includes moving the calibrating device across a target (e.g., a wafer chuck). Next, the method includes measuring distances between light spots from the sensors and a perimeter of the target using the sensors located on the calibrating device. Next, the method includes determining a displacement of the calibrating device relative to a center of the target. Then, the method includes determining a rotation angle of the calibrating device relative to a system of coordinates of the target. Next, the method includes calibrating a robot position of the robot based on the displacement and rotation angle of the calibrating device with respect to the target.

Abstract: Described herein is a method and system for performing calibrations on robotic components. In one embodiment, a method for performing robotic calibrations includes manually calibrating a center of a robot blade aligned with respect to a target. The method further includes recording a first positional value of the center of the robot blade aligned with respect to a camera. The method further includes automatically determining a second positional value of the center of the robot blade aligned with respect to the camera. The method further includes automatically recalibrating the robot blade based on an offset between the second positional value and the first positional value exceeding a tolerance offset from the first positional value.

Abstract: Described herein is a method and apparatus for performing calibrations on robotic components. In one embodiment, a method for performing robotic calibrations includes moving the calibrating device across a target (e.g., a wafer chuck). Next, the method includes measuring distances between light spots from the sensors and a perimeter of the target using the sensors located on the calibrating device. Next, the method includes determining a displacement of the calibrating device relative to a center of the target. Then, the method includes determining a rotation angle of the calibrating device relative to a system of coordinates of the target. Next, the method includes calibrating a robot position of the robot based on the displacement and rotation angle of the calibrating device with respect to the target.

Abstract: A detection apparatus for, and a method of, detecting the location of the tip of a tubular element, in particular a needle, within a region, in particular one of the epidural space and the peritoneal cavity.

Abstract: A controller for closed loop control of infusion devices is described. A variety of infusion systems are described that use the closed loop control architecture. In some embodiments the closed loop control may be adapted to current commonly used infusion means such as a gravity feed intravenous system. Other embodiments describe infusion pump system that use biasing or drive mechanisms of springs, elastomers, rotary and linear motors.

Abstract: A system architecture for closed loop control of infusion devices is described. The architecture provides means to control the flow from an infusion device as well as in some embodiments the pressure of the delivery. A variety of infusion systems are described that use the closed loop control architecture. In some embodiments the closed loop control may be adapted to current commonly used infusion means such as a gravity feed intravenous system. Other embodiments describe infusion pump system that use biasing or drive mechanisms of springs, elastomers, rotary and linear motors.

Abstract: A detection apparatus for, and a method of, detecting the location of the tip of a tubular element, in particular a needle, within a region, in particular one of the epidural space and the peritoneal cavity.

Abstract: A new apparatus for processing substrates is disclosed. A multi-level load lock chamber having four environmentally isolated chambers interfaces with a transfer chamber that has a robotic assembly. The robotic assembly has two arms that each can move horizontally as the robotic assembly rotates about its axis. The arms can reach into the isolated chambers of the load lock to receive substrates from the bottom isolated chambers, transport the substrates to process chambers, and then place the substrates in the upper chambers. The isolated chambers in the load lock chamber may have a pivotably attached lid that may be opened to access the inside of the isolated chambers.

Abstract: Embodiments of the present invention provide an end effector for a substrate handling robot. In one embodiment, the end effector comprises one or more Bernoulli chucks surrounded by a plurality of suction cup devices. In one embodiment, the suction cup devices are configured in the form of a bellows to provide both cushioning and lateral stability to the substrate. In one embodiment, the suction cup devices further include an air pressure device to provide light positive pressure to the substrate during release. Embodiments of the end effector described herein provide a small vacuum pressure over a large area of ultra-thin substrates to minimize damage during handling.