Patents by Inventor Satoharu Nishino

Satoharu Nishino has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Nozzle pressing mechanism
    Patent number: 7314369
    Abstract: A mechanism for pressing a nozzle 26 of an injection device 10 against a die 33, comprises a hooking device 12 which moves so that a hooking body 23 hooks or does not hook on a to-be-hooked portion 24; and a traction device 11 having, on its one end, the hooking device 12 and having, on its other end, the injection device 10. In this mechanism, the portion of the hooking device 12, opposite to the side adjacent to the traction device 11 is attached to the die 33 in the vicinity of the portion of the die 33, against which the nozzle 26 is abutted.
    Type: Grant
    Filed: October 5, 2005
    Date of Patent: January 1, 2008
    Assignee: Kabushiki Kaisha Meiki Seisakusho
    Inventors: Satoharu Nishino, Takashi Shinoda
  • Die clamping apparatus and die clamping method
    Patent number: 7179409
    Abstract: In a die clamping apparatus wherein a movable platen is moved toward a stationary platen, and after a half nut is engaged with an engaging part of a tie bar, the tie bar is pulled by a die clamping cylinder for clamping, provision is made of a first engaging position adjusting mechanism for controlling a movement of the tie bar or the half nut to a half nut engaging position at the time of die thickness adjustment and a second engaging position adjusting mechanism which allows the tie bar or the half nut to move and which moves the tie bar or the half nut to the half nut engaging position at the time of molding.
    Type: Grant
    Filed: June 25, 2004
    Date of Patent: February 20, 2007
    Assignee: Kabushiki Kaisha Meiki Seisakusho
    Inventor: Satoharu Nishino
  • Nozzle pressing mechanism
    Publication number: 20060078646
    Abstract: A mechanism for pressing a nozzle 26 of an injection device 10 against a die 33, comprises a hooking device 12 which moves so that a hooking body 23 hooks or does not hook on a to-be-hooked portion 24; and a traction device 11 having, on its one end, the hooking device 12 and having, on its other end, the injection device 10. In this mechanism, the portion of the hooking device 12, opposite to the side adjacent to the traction device 11 is attached to the die 33 in the vicinity of the portion of the die 33, against which the nozzle 26 is abutted.
    Type: Application
    Filed: October 5, 2005
    Publication date: April 13, 2006
    Applicant: Kabushiki Kaisha Meiki Seisakusho
    Inventors: Satoharu Nishino, Takashi Shinoda
  • Die clamping apparatus and die clamping method
    Publication number: 20050025856
    Abstract: In a die clamping apparatus wherein a movable platen is moved toward a stationary platen, and after a half nut is engaged with an engaging part of a tie bar, the tie bar is pulled by a die clamping cylinder for clamping, provision is made of a first engaging position adjusting mechanism for controlling a movement of the tie bar or the half nut to a half nut engaging position at the time of die thickness adjustment and a second engaging position adjusting mechanism which allows the tie bar or the half nut to move and which moves the tie bar or the half nut to the half nut engaging position at the time of molding.
    Type: Application
    Filed: June 25, 2004
    Publication date: February 3, 2005
    Applicant: Kabushiki Kaisha Meiki Seisakusho
    Inventor: Satoharu Nishino