Abstract: A monolithic ceramic capacitor includes an element body having therein a multilayer portion formed of a plurality of conductor layers and a plurality of ceramic dielectric layers alternately stacked in a thickness direction; and a first outer electrode and a second outer electrode provided on an outer portion of the element body. The element body is divided in the thickness direction into a thickness-direction first outer layer portion, a thickness-direction second outer layer portion, and a thickness-direction inner layer portion located between the thickness-direction first outer layer portion and the thickness-direction second outer layer portion and including the multilayer portion. A first conductor layer and a second conductor layer, which are outermost layers among the plurality of conductor layers, have lower conductor densities than any of conductor densities of the other conductor layers.

Abstract: A monolithic ceramic capacitor includes an element body having therein a multilayer portion formed of a plurality of conductor layers and a plurality of ceramic dielectric layers alternately stacked in a thickness direction; and a first outer electrode and a second outer electrode provided on an outer portion of the element body. The element body is divided in the thickness direction into a thickness-direction first outer layer portion, a thickness-direction second outer layer portion, and a thickness-direction inner layer portion located between the thickness-direction first outer layer portion and the thickness-direction second outer layer portion and including the multilayer portion. A first conductor layer and a second conductor layer, which are outermost layers among the plurality of conductor layers, have lower conductor densities than any of conductor densities of the other conductor layers.

Abstract: A monolithic ceramic capacitor includes an element body having therein a multilayer portion formed of a plurality of conductor layers and a plurality of ceramic dielectric layers alternately stacked in a thickness direction; and a first outer electrode and a second outer electrode provided on an outer portion of the element body. The element body is divided in the thickness direction into a thickness-direction first outer layer portion, a thickness-direction second outer layer portion, and a thickness-direction inner layer portion located between the thickness-direction first outer layer portion and the thickness-direction second outer layer portion and including the multilayer portion. A first conductor layer and a second conductor layer, which are outermost layers among the plurality of conductor layers, have lower conductor densities than any of conductor densities of the other conductor layers.

Abstract: A multilayer ceramic electronic component includes a ceramic body, first and second outer electrodes, and a plurality of first and second inner electrodes opposing each other across ceramic layers in a lamination direction of the ceramic body. At least two inner electrodes among the plurality of first and second inner electrodes include bent portions on lead-out regions as portions on which the plurality of first inner electrodes and the plurality of second inner electrodes do not oppose each other across the ceramic layers in the lamination direction, and vertexes of the bent portions of the inner electrodes adjacent in the lamination direction are at different positions in a lead-out direction.

Abstract: A monolithic ceramic capacitor includes an element body having therein a multilayer portion formed of a plurality of conductor layers and a plurality of ceramic dielectric layers alternately stacked in a thickness direction; and a first outer electrode and a second outer electrode provided on an outer portion of the element body. The element body is divided in the thickness direction into a thickness-direction first outer layer portion, a thickness-direction second outer layer portion, and a thickness-direction inner layer portion located between the thickness-direction first outer layer portion and the thickness-direction second outer layer portion and including the multilayer portion. A first conductor layer and a second conductor layer, which are outermost layers among the plurality of conductor layers, have lower conductor densities than any of conductor densities of the other conductor layers.

Abstract: Provided is an electronic component that can suppress the occurrence of disconnections between line conductor layers and via hole conductors and a method of manufacturing the electronic component. A multilayer body is formed by stacking insulating layers. A conductor layer is provided on a first insulating layer. A line conductor layer is provided on a second insulating layer that is provided on an upper side of the first insulating layer in a stacking (z-axis) direction. A via hole conductor connects an end portion of the line conductor layer to the conductor layer and extends through the second insulating layer in the z-axis direction. In the via hole conductor, a connection surface connected to the line conductor layer is formed of a circular portion and a protrusion. The protrusion protrudes from the circular portion in the x-axis direction in which the line conductor layer extends from the end portion.

Abstract: Exact transfer of electronic element main bodies, held by virtue of an adhesive property provided by an adhesive surface, is provided from a first holder to a second holder. A plurality of through holes are formed in the first holder, so that a pressing force provided by a pusher member can be applied through the through holes to the electronic element main bodies bonded on an adhesive surface of the first holder. Meanwhile, the first holder is separated from the electronic element main bodies which are at the same time bonded on to an adhesive surface of the second holder.

Abstract: An inspection terminal for accurately measuring a characteristic of an electronic chip component without causing an inner electrode layer constituting an external electrode of the electronic chip component to be exposed to the outside, an inspection method, and an inspection apparatus using the same, involves storing an electronic chip component in a storing portion of a turntable and sucking the electronic chip component by a sucking portion provided in a side guard. A linear edge portion of the inspection terminal is pressed from the bottom so as to abut against the external electrode of the electronic chip component. The linear edge portion is arranged to have an obtuse angle and is brought into contact with the external electrode such that the edge portion lies substantially parallel to the longitudinal direction of the external electrode.

Abstract: Exact transfer of electronic element main bodies, held by virtue of an adhesive property provided by an adhesive surface, is provided from a first holder to a second holder. A plurality of through holes are formed in the first holder, so that a pressing force provided by a pusher member can be applied through the through holes to the electronic element main bodies bonded on an adhesive surface of the first holder. Meanwhile, the first holder is separated from the electronic element main bodies which are at the same time bonded on to an adhesive surface of the second holder.

Abstract: An inspection terminal for accurately measuring a characteristic of an electronic chip component without causing an inner electrode layer constituting an external electrode of the electronic chip component to be exposed to the outside, an inspection method, and an inspection apparatus using the same, involves storing an electronic chip component in a storing portion of a turntable and sucking the electronic chip component by a sucking portion provided in a side guard. A linear edge portion of the inspection terminal is pressed from the bottom so as to abut against the external electrode of the electronic chip component. The linear edge portion is arranged to have an obtuse angle and is brought into contact with the external electrode such that the edge portion lies substantially parallel to the longitudinal direction of the external electrode.

Abstract: Exact transfer of electronic element main bodies, held by virtue of an adhesive property provided by an adhesive surface, is provided from a first holder to a second holder. A plurality of through holes are formed in the first holder, so that a pressing force provided by a pusher member can be applied through the through holes to the electronic element main bodies bonded on an adhesive surface of the first holder. Meanwhile, the first holder is separated from the electronic element main bodies which are at the same time bonded on to an adhesive surface of the second holder.