Abstract: A co-extruded sheet reduces swelling and/or cracking of the surface occurring during thermal shaping such as vacuum forming and provides improved mechanical strength. A co-extruded sheet contains a polycarbonate resin, and includes a core layer formed from a foam resin and skin layers formed from a non-foaming resin. The skin layer is laminated to one major surface of the core layer, while the skin layer is laminated to the other major surface of the core layer. The core layer has an expansion ratio of 1.6 to 3. The co-extruded sheet has a thickness of 1 to 5 mm and satisfies expression (1): 0.10? (t1+t2)/T?0.5. In expression (1), t1 indicates the thickness of the skin layer, t2 indicates the thickness of the second skin layer, and T indicates the thickness of the co-extruded sheet.

Abstract: A co-extruded sheet reduces swelling and/or cracking of the surface occurring during thermal shaping such as vacuum forming and provides improved mechanical strength. A co-extruded sheet contains a polycarbonate resin, and includes a core layer formed from a foam resin and skin layers formed from a non-foaming resin. The skin layer is laminated to one major surface of the core layer, while the skin layer is laminated to the other major surface of the core layer. The co-extruded sheet has a density of 0.4 to 0.9 g/cm3. The co-extruded sheet has a thickness of 1 to 5 mm and satisfies expression (1): 0.10?(t1+t2)/T?0.5. In expression (1), t1 indicates the thickness of the skin layer, t2 indicates the thickness of the second skin layer, and T indicates the thickness of the co-extruded sheet.

Abstract: A semiconductor device includes a first lead, a second lead spaced apart from the first lead in a first direction, a first semiconductor element on the first lead, a second semiconductor element on the second lead, and a sealing resin covering the first lead, the second lead, the first semiconductor element and the second semiconductor element. The first and second semiconductor elements respectively have first and second element side surfaces facing with each other in the first direction. The sealing resin has a first-direction middle plane equidistant from the first and the second element side surfaces in the first direction. The first lead includes a first main part, and the second lead includes a second main part. The first and the second main parts are spaced apart from each other with reference to the first-direction middle plane.

Abstract: A rectifier includes a first transistor of a drain/source common field effect type and a second transistor of a drain/source common field effect type in which the second transistor is diode-connected to the first transistor so as to allow the first transistor to perform a diode operation, and configures a rectifier stage with the first transistor.

Abstract: A resin sheet is provided that provide both light-weight properties and mechanical strength using a thermoplastic resin with high deflection temperature under load. The resin sheet is formed from a thermoplastic resin, including: a core layer being a foam resin layer; and skin layers located outward of the core layer as determined along the thickness direction, the core and skin layers forming a continuity. The core layer includes a region A1 and regions A2 each located between the region A1 and the associated skin layer. The regions A2 has a lower average porosity than the region A1, said average porosity being lower than 50%. The thermoplastic resin has a deflection temperature under load not lower than 90° C. The resin sheet has a thickness of 1 to 40 mm. Each skin layer has a thickness of 5 to 50% of the thickness of the resin sheet.

Abstract: Provided are a liquid crystal molecule orientation control method and a liquid crystal device which render it possible to change the orientation of liquid crystal molecules without using an electric field. In controlling the orientation of liquid crystal molecules 103a, which are contained in a liquid crystal material 103 sandwiched between alignment films 104, by the liquid crystal molecule orientation control method, an ultrasonic wave is generated in a piezoelectric material 102 so as to propagate to the liquid crystal material 103, and static pressure is generated in accordance with the ultrasonic wave, with the result that the orientation is changed in accordance with the magnitude of the static pressure.