Abstract: A process for producing a mass transfer device is provided which enables packing of a packing material uniformly in a flow channel, and transfers a specified substance by flowing a fluid containing the specified substance through a flow channel on a substrate. A mass transfer device produced by the process is also provided. The process for producing a mass transfer device comprises steps of preparing a substrate, forming a flow channel on the surface of the substrate, applying a liquid drop composed of a packing material and a liquid medium, and packing the packing material in the flow channel by removing the liquid medium.

Abstract: A process for producing a mass transfer device is provided which enables packing of a packing material uniformly in a flow channel, and transfers a specified substance by flowing a fluid containing the specified substance through a flow channel on a substrate. A mass transfer device produced by the process is also provided. The process for producing a mass transfer device comprises steps of preparing a substrate, forming a flow channel on the surface of the substrate, applying a liquid drop composed of a packing material and a liquid medium, and packing the packing material in the flow channel by removing the liquid medium.

Abstract: A method of mixing plural liquids in a liquid chamber is provided which comprises steps of introducing plural liquids into the liquid chamber, and repeating expansion and shrinkage of a bubble in the liquids in the liquid chamber. In this method, the liquid may be heated to produce the bubble. A liquid-mixing apparatus for mixing plural liquids in a liquid chamber to obtain a liquid mixture is also provided. The liquid-mixing apparatus comprises a liquid chamber; flow channels for introducing the plural liquids into the liquid chamber; a heating part placed in the liquid chamber for heating the liquid mixture in the liquid chamber; and an energy-supplying means for causing expansion and shrinkage of a bubble in the liquid mixture in the liquid chamber.

Abstract: A wire connection structure has light-emitting points formed by third electrodes and second electrodes, each second electrode being electrically connected to a first electrode functioning as a lead-out electrode by way of an electro-conductive member, and comprises electro-conductive members for respectively connecting the second electrodes and the first electrodes. The electro-conductive members are formed either by an ink-jet method or a gas deposition method. Thus, an electro-conductive member directly contacts with an end of each of the first electrodes to establish an excellent electric connection between the first electrode and the corresponding second electrode without using an insulating member.

Abstract: A wire connection structure has light-emitting points formed by third electrodes and second electrodes, each second electrode being electrically connected to a first electrode functioning as a lead-out electrode by way of an electro-conductive member, and comprises electro-conductive members for respectively connecting the second electrodes and the first electrodes. The electro-conductive members are formed either by an ink-jet method or a gas deposition method. Thus, an electro-conductive member directly contacts with an end of each of the first electrodes to establish an excellent electric connection between the first electrode and the corresponding second electrode without using an insulating member.