Patents by Inventor Satoko Yoshimura

Satoko Yoshimura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12186963
    Abstract: An antifouling method for polysilicon includes using a tube-shaped resin sheet having an inner surface and an outer surface to prevent the fouling of polysilicon, in which the tube-shaped resin sheet or a resin sheet cut out of the tube-shaped resin sheet is held, with the inner surface being kept in an unexposed state, and the inner surface is exposed just before use and brought into contact with the polysilicon.
    Type: Grant
    Filed: October 29, 2019
    Date of Patent: January 7, 2025
    Assignee: Tokuyama Corporation
    Inventors: Takuya Asano, Satoko Yoshimura
  • Publication number: 20210339450
    Abstract: An antifouling method for polysilicon includes using a tube-shaped resin sheet having an inner surface and an outer surface to prevent the fouling of polysilicon, in which the tube-shaped resin sheet or a resin sheet cut out of the tube-shaped resin sheet is held, with the inner surface being kept in an unexposed state, and the inner surface is exposed just before use and brought into contact with the polysilicon.
    Type: Application
    Filed: October 29, 2019
    Publication date: November 4, 2021
    Applicant: Tokuyama Corporation
    Inventors: Takuya Asano, Satoko Yoshimura
  • Patent number: 10518964
    Abstract: A package in which a bag formed from a polyethylene-based resin film having a small thickness, more specifically a thickness of 300 ?m or less is filled with crushed polysilicon (Si chunks) and damage to the bag by the Si chunks is effectively prevented. In a polysilicon package in which the bag 1 formed from a polyethylene-based resin having an average thickness of 300 ?m or less is filled with the Si chunks 4, the bag 1 has a heat-sealed bonded part 2 at the bottom and is filled with the Si chunks 4 to ensure that the maximum expansion of the bag 1 becomes 5% or less when the bag 1 is held in an upright state with the bottom as a ground contact surface.
    Type: Grant
    Filed: September 18, 2015
    Date of Patent: December 31, 2019
    Assignee: TOKUYAMA CORPORATION
    Inventors: Satoko Yoshimura, Takuya Asano
  • Publication number: 20170233174
    Abstract: A package in which a bag formed from a polyethylene-based resin film having a small thickness, more specifically a thickness of 300 ?m or less is filled with crushed polysilicon (Si chunks) and damage to the bag by the Si chunks is effectively prevented. In a polysilicon package in which the bag 1 formed from a polyethylene-based resin having an average thickness of 300 ?m or less is filled with the Si chunks 4, the bag 1 has a heat-sealed bonded part 2 at the bottom and is filled with the Si chunks 4 to ensure that the maximum expansion of the bag 1 becomes 5% or less when the bag 1 is held in an upright state with the bottom as a ground contact surface.
    Type: Application
    Filed: September 18, 2015
    Publication date: August 17, 2017
    Applicant: TOKUYAMA CORPORATION
    Inventors: Satoko YOSHIMURA, Takuya ASANO
  • Patent number: 9670593
    Abstract: A method for recharging raw material polycrystalline silicon which enables large chunks of polycrystalline silicon to be recharged to a CZ ingot growth process while preventing the CZ crucible from being damaged and restricting a decline of the dislocation free rate and the quality of the grown ingot. Polycrystalline silicon chunks are recharged by first forming cushioning layer silicon of smaller chunks. The cushioning layer of polycrystalline silicon chunks are deposited on a surface of the residual silicon melt in a crucible. Subsequently, large-sized polycrystalline silicon chunks are introduced onto the cushioning layer, the cushioning layer cushioning the impact due to dropping of the large-sized polycrystalline silicon chunks.
    Type: Grant
    Filed: December 19, 2011
    Date of Patent: June 6, 2017
    Assignee: SILTRONIC AG
    Inventors: Hideo Kato, Satoko Yoshimura, Takeshi Ninomiya
  • Publication number: 20120160156
    Abstract: A method for recharging raw material polycrystalline silicon which enables large chunks of polycrystalline silicon to be recharged to a CZ ingot growth process while preventing the CZ crucible from being damaged and restricting a decline of the dislocation free rate and the quality of the grown ingot. Polycrystalline silicon chunks are recharged by first forming cushioning layer silicon of smaller chunks. The cushioning layer of polycrystalline silicon chunks are deposited on a surface of the residual silicon melt in a crucible. Subsequently, large-sized polycrystalline silicon chunks are introduced onto the cushioning layer, the cushioning layer cushioning the impact due to dropping of the large-sized polycrystalline silicon chunks.
    Type: Application
    Filed: December 19, 2011
    Publication date: June 28, 2012
    Applicant: SILTRONIC AG
    Inventors: Hideo Kato, Satoko Yoshimura, Takeshi Ninomiya