Abstract: A substrate cleaning method and a substrate cleaning apparatus are provided. The substrate cleaning method includes a first step of applying a chemical solution to a lower surface of a substrate, and a second step of subsequently applying a bubble-containing liquid to the lower surface of the substrate.

Abstract: A PVA brush cleaning method includes immersing a PVA brush in a cleaning solution containing an organic matter, thereby removing a siloxane compound in the PVA brush; and applying vibration to the PVA brush, thereby removing impurities in the PVA brush.

Abstract: There is provided a substrate cleaning apparatus capable of highly effective self-cleaning of a cleaning tool in a short time period. The substrate cleaning apparatus includes a cleaning tool for cleaning a substrate while in contact with a surface of the substrate, a self-cleaning member for self-cleaning the cleaning tool while in contact with the cleaning tool, a rotation mechanism for rotating the cleaning tool, and a holding mechanism for holding the cleaning tool, the holding mechanism being capable of pressing the cleaning tool against the substrate and pressing the cleaning tool against the self-cleaning member.

Abstract: A PVA brush cleaning method includes immersing a PVA brush in a cleaning solution containing an organic matter, thereby removing a siloxane compound in the PVA brush; and applying vibration to the PVA brush, thereby removing impurities in the PVA brush.

Abstract: A wafer drying apparatus capable of preventing formation of a watermark is disclosed. The wafer drying apparatus includes: a conveying mechanism configured to convey a wafer in a drying chamber; an inert-gas jet nozzle disposed above the conveying mechanism and configured to form a descending jet of an inert gas; and a liquid suction nozzle disposed upstream of the inert-gas jet nozzle with respect to a conveying direction of the wafer. A distance between the liquid suction nozzle and a surface of the wafer when the wafer is being conveyed by the conveying mechanism is in a range of 1 mm to 2 mm.

Abstract: A wafer drying apparatus capable of preventing formation of a watermark is disclosed. The wafer drying apparatus includes: a conveying mechanism configured to convey a wafer in a drying chamber; an inert-gas jet nozzle disposed above the conveying mechanism and configured to form a descending jet of an inert gas; and a liquid suction nozzle disposed upstream of the inert-gas jet nozzle with respect to a conveying direction of the wafer. A distance between the liquid suction nozzle and a surface of the wafer when the wafer is being conveyed by the conveying mechanism is in a range of 1 mm to 2 mm.

Abstract: A substrate cleaning apparatus includes a cleaning apparatus 10 including an abutting member which is to be pressed against a cleaning member to clean the cleaning member, a drive control device for controllably driving the abutting member, and a cleaning tank which contains a cleaning liquid and allows a portion of abutment between the cleaning member and the abutting member to be impregnated with the cleaning liquid. The substrate cleaning apparatus also includes an image capturing device which captures a surface image of the cleaning member and an image processing device. A surface condition of the cleaning member is monitored to determine the timing of replacement of the cleaning member. The substrate cleaning apparatus further includes a measurement device which measures the number of particles and/or a concentration of a component in the cleaning liquid in the cleaning tank.

Abstract: An object of the present invention is to provide a cleaning member, a substrate cleaning apparatus and a substrate processing apparatus, which are adapted to work with a reduced amount of contaminants to be discharged from the cleaning member, to prevent inverse contamination in a substrate subject to the cleaning and to preserve a high cleaning power to the substrate in a stable manner. The object is accomplished by a cleaning member of a substrate cleaning apparatus for cleaning a surface of a substrate subject to the cleaning by using a relative motion between the surface of the substrate subject to the cleaning and the cleaning member brought into contact with the surface of the substrate, while supplying a cleaning liquid onto the surface of the substrate, the cleaning member comprising a core portion (23a) made of a waterproof material, wherein a surface of the core portion (23a) is covered with a porous polymeric material to define a coating layer (23b).

Abstract: The present invention provides a substrate processing apparatus having a drying mechanism for removing water from a surface of a substrate which has been cleaned by a wet cleaning process, and a substrate processing apparatus and a substrate processing method which are capable of efficiently removing an unnecessary thin film deposited on or adhering to a bevel or edge portion of a substrate. The substrate processing apparatus of this invention has a substrate holder for holding a substrate, and a dry gas supply section for turning an atmosphere, to which at least a portion of a surface of the substrate held by the substrate holder is exposed, into a humidity-controlled dry gas atmosphere.

Abstract: A substrate processing apparatus has a fluid supply means 20 for supplying fluid to a substrate W and a fluid collection means 21 for collecting the fluid in the vicinity of the substrate W, the fluid supply means 20 having a fluid spurt section 20a, the fluid collection means 21 having a fluid suction section 21a opening in the vicinity of the fluid spurt section 20a. Since the fluid collection means 21 suctions and collects the fluid floating around the substrate W as a result of the liquid having been supplied from the fluid spurt section 20a to the substrate W, it is possible to prevent the substrate W from being contaminated after the substrate W being processed with the fluid supplied from the fluid supply means 20.

Abstract: A substrate cleaning apparatus comprises a cleaning apparatus 10 including an abutting member 14 which is pressed against a cleaning member 2 to clean the cleaning member 2, a drive control means 21 for controllably driving the abutting member 14 and a cleaning tank 12 which contains a cleaning liquid 11 and allows a portion of abutment between the cleaning member 2 and the abutting member 14 to be impregnated with the cleaning liquid 11. The substrate cleaning apparatus also comprises an image capturing means 16 which captures a surface image of the cleaning member 2 and an image processing means 17. A surface condition of the cleaning member 2 is monitored to determine the timing of replacement of the cleaning member 2. The substrate cleaning apparatus further comprises a measurement means 13 which measures the number of particles and/or a concentration of a component in the cleaning liquid 11 in the cleaning tank 12.

Abstract: The present invention relates to a cleaning apparatus which can reduce a potential difference between metals or alloys used to form interconnects on a substrate for thereby minimizing corrosion which may occur during and after a substrate cleaning process. The cleaning apparatus for cleaning a substrate having metal interconnects comprises a cleaning mechanism for cleaning the substrate, and a functional water supply mechanism for supplying functional water to the cleaning mechanism. The cleaning mechanism cleans a surface of the substrate with use of the functional water.

Abstract: The present invention provides a substrate processing apparatus having a drying mechanism for removing water from the surface of a substrate which has been cleaned by a wet cleaning process, and a substrate processing apparatus and a substrate processing method which are capable of efficiently removing an unnecessary thin film deposited on or adhering to a bevel or edge portion of a substrate. The substrate processing apparatus of this invention has a substrate holder for holding a substrate, and a dry gas supply section for turning an atmosphere to which at least a portion of a surface of the substrate held by the substrate holder is exposed into a humidity-controlled dry gas atmosphere.

Abstract: The present invention relates to a cleaning apparatus which can reduce a potential difference between metals or alloys used to form interconnects on a substrate for thereby minimizing corrosion which may occur during and after a substrate cleaning process. The cleaning apparatus for cleaning a substrate having metal interconnects comprises a cleaning mechanism for cleaning the substrate, and a functional water supply mechanism for supplying functional water to the cleaning mechanism. The cleaning mechanism cleans a surface of the substrate with use of the functional water.

Abstract: An apparatus for conveying a workpiece as used to convey the workpiece such as a semiconductor wafer, a glass substrate or liquid crystal panel, between processing apparatuses when the workpiece is processed in the plurality of processing apparatuses. The amount of liquid on a surface of a workpiece is adjusted to a predetermined amount, and the workpiece, which retains the predetermined amount of liquid, is conveyed between processes. The adjusting includes both supplying a sufficient amount of liquid onto the surface of the workpiece, which is in a certain state, and removing a certain amount of liquid from the surface of the workpiece.

Abstract: An apparatus for conveying a workpiece as used to convey the workpiece such as a semiconductor wafer, a glass substrate or liquid crystal panel, between processing apparatuses when the workpiece is processed in the plurality of processing apparatuses. The amount of liquid on a surface of a workpiece is adjusted to a predetermined amount, and the workpiece, which retains the predetermined amount of liquid, is conveyed between processes. The adjusting includes both supplying a sufficient amount of liquid onto the surface of the workpiece, which is in a certain state, and removing a certain amount of liquid from the surface of the workpiece.

Abstract: A method and apparatus for conveying workpiece is used for conveying a workpiece such as a semiconductor wafer, glass substrate or liquid crystal panel between processing apparatuses when the workpiece is processed in a plurality of processing apparatuses. The method includes adjusting the amount of liquid on a surface of a workpiece to a predetermined amount, and conveying the workpiece which retains the predetermined amount of liquid between processes. The surface of the workpiece is kept wet by the liquid on the workpiece. The adjusting includes supplying a sufficient amount of liquid onto the surface of the workpiece which is in a certain state, and removing a certain amount of liquid from the surface of the workpiece.

Abstract: A washing method provides a liquid jet washing by jetting a liquid against a rotating thin-plate-shaped workpiece from a nozzle which shifts while being positioned opposite a front or back surface of the workpiece, thus removing dust adhering to the front or back surface and thereby washing the workpiece. The locus of the shifting nozzle is caused to pass in the vicinity of, but not over, the center of rotation of the workpiece. Electronic circuitry present at the central portion of workpiece is prevented from suffering electrostatic breakage caused by collision with washing liquid. At the same time, an appropriate quantity of washing liquid is made to collide with the entire surface of a workpiece, so that the workpiece can be washed satisfactorily.

Abstract: A cleaning apparatus is used for cleaning a thin disk-shaped workpiece such as a semiconductor wafer, a liquid crystal display or the like. The cleaning apparatus comprises a support mechanism for supporting a workpiece and rotating the workpiece about its own axis, and a cleaning member for being in sliding contact with at least one of opposite surfaces of the workpiece. The support mechanism comprises a plurality of spindles, and a plurality of rotatable holding portions provided on upper ends of the spindles and having respective circumferential edges engageable with a circumferential edge of the workpiece. The plurality of spindles are clustered into groups around the workpiece, and two adjacent groups of the spindles are positioned to form a wide spacing between two adjacent groups of the spindles, and a path along which the workpiece is supplied to and removed from the support mechanism is positioned in the wide spacing.

Abstract: A method of and an apparatus for cleaning workpiece is suitable for cleaning a substrate such as a semiconductor substrate, a glass substrate, or a liquid crystal panel to a high level of cleanliness. The method of cleaning a workpiece comprises the steps of holding a workpiece, scrubbing the workpiece with a cleaning member, and rubbing the cleaning member against a member having a rough surface to carry out a self-cleaning of the cleaning member. The cleaning member which is contaminated by having scrubbed the workpiece is rubbed against the rough surface, and the rough surface scrapes the contaminant off the cleaning member. Therefore, the contaminant can effectively be removed from the cleaning member, and hence the cleaning member has a high self-cleaning effect.