Abstract: A tether is a net that kinks and is automatically deformed upon tension release. The tether has a length of several kilometers to several tens of kilometers upon deployment and is capable of shrinking to have a length of approximately several tens of meters to several hundreds of meters by kinking and automatically being deformed when the tension is released because of cutting or the like.

Abstract: An electromagnetic shielding composition includes silver particles (A), and a first solvent (B). The first solvent (B) has at least one structure selected from the group consisting of a structure represented by the formula (1) and a structure represented by the formula (2) and has a boiling point of less than 200° C.

Abstract: [Object] To provide an electron source that is lightweight, simple in configuration, and capable of suppressing characteristic degradation or recovering characteristics without causing an increase in power consumption. [Solving Means] A CNT electron source includes: a CNT emitter 32 for emitting electrons; a gate electrode 33 for extracting electrons from the CNT emitter 32; and a gate power supply connection switching relay 37a and a CNT emitter grounding switching relay 37b that cause the gate electrode 33 to emit electrons to irradiate the CNT emitter with electrons.

Abstract: [Object] To provide an electron source that is lightweight, simple in configuration, and capable of suppressing characteristic degradation or recovering characteristics without causing an increase in power consumption. [Solving Means] A CNT electron source includes: a CNT emitter 32 for emitting electrons; a gate electrode 33 for extracting electrons from the CNT emitter 32; and a gate power supply connection switching relay 37a and a CNT emitter grounding switching relay 37b that cause the gate electrode 33 to emit electrons to irradiate the CNT emitter with electrons.

Abstract: [Object] To provide a tether that is automatically deformed from a deployment state in case of cutting or the like. [Solving Means] A tether 10 is a net that kinks and is automatically deformed upon tension release. The tether 10 has a length of several kilometers to several tens of kilometers upon deployment and is capable of shrinking to have a length of approximately several tens of meters to several hundreds of meters by kinking and automatically being deformed when the tension is released because of cutting or the like.

Abstract: A space-debris capturing device includes a harpoon driven into target debris as space debris to be removed. The harpoon includes a first harpoon part having a large diameter, and a second harpoon part having a diameter smaller than the diameter of the first harpoon part and protruding from a leading surface in the direction of the drive of the first harpoon part into the target debris.

Abstract: A debris removal device includes: an end mass adapted to approach debris to be removed; a debris capture device separably-mounted on the end mass; and a tether connecting the debris capture device and the end mass to each other. The debris capture device includes a harpoon adapted to penetrate into the debris, a shooting device adapted to shoot the harpoon, a guide member positioned to come into contact with the surface of the debris to adjust the shooting angle of the harpoon with respect to the surface of the debris, and a switch that sends the shooting signal to the shooting device. When the harpoon is penetrated into the debris, the end mass is separated from the debris capture device, and the tether is released into outer space.

Abstract: Provided is a film adhesive which is preferably used as a NCF, void-free, has excellent electrical connectivity and its high reliability, does not develop cracks easily, and has high surface flatness. Also provided is a semiconductor device in which the film adhesive according to the present invention is used as an NCF during the manufacture of the semiconductor device. The film adhesive according to the present invention contains (A) an epoxy resin; (B) a bisphenol F type phenoxy resin; (C) a phenol resin-based curing agent; (D) a modified imidazole compound; (E) a silica filler; (F) oxyquinoline; and (G) a butadiene-acrylonitrile-methacrylic acid copolymer. The content of component (A) is 19.3 to 33.8 parts by mass. The content of component (B) is 7.5 to 9.1 parts by mass. The content of component (D) is 1.915 to 5 parts by mass. The content of component (E) is 30 to 60 parts by mass. The content of component (F) is 2.5 to 10 parts by mass.

Abstract: Provided is a film adhesive which is preferably used as a NCF, void-free, has excellent electrical connectivity and its high reliability, does not develop cracks easily, and has high surface flatness. Also provided is a semiconductor device in which the film adhesive according to the present invention is used as an NCF during the manufacture of the semiconductor device. The film adhesive according to the present invention contains (A) an epoxy resin; (B) a bisphenol F type phenoxy resin; (C) a phenol resin-based curing agent; (D) a modified imidazole compound; (E) a silica filler; (F) oxyquinoline; and (G) a butadiene-acrylonitrile-methacrylic acid copolymer. The content of component (A) is 19.3 to 33.8 parts by mass. The content of component (B) is 7.5 to 9.1 parts by mass. The content of component (D) is 1.915 to 5 parts by mass. The content of component (E) is 30 to 60 parts by mass. The content of component (F) is 2.5 to 10 parts by mass.

Abstract: A debris removal device includes: an end mass adapted to approach debris to be removed; a debris capture device separably-mounted on the end mass; and a tether connecting the debris capture device and the end mass to each other. The debris capture device includes a harpoon adapted to penetrate into the debris, a shooting device adapted to shoot the harpoon, a guide member positioned to come into contact with the surface of the debris to adjust the shooting angle of the harpoon with respect to the surface of the debris, and a switch that sends the shooting signal to the shooting device. When the harpoon is penetrated into the debris, the end mass is separated from the debris capture device, and the tether is released into outer space.

Abstract: By an electronic component mounting method for electrically connecting bumps to board electrodes, in a contact process for placing a thermosetting resin in a liquid glob state on the board surface and bringing the lower surface of the electronic component into contact with the thermosetting resin, the bumps are pressurized against the electrodes in positional alignment in a liquid glob distribution state where one portion of the liquid glob is arranged inside an electronic component mounting region and a remaining portion greater in liquid measure than the one portion is arranged outside the electronic component mounting region. The thermosetting resin enters into a gap between the electronic component and the board by capillarity in a thermocompression bonding process. This prevents voids occurring in the sealing resin, reinforces bonded portions of bumps and electrodes with thermally cured thermosetting resin, thereby preventing bonded portion breakage due to thermal stress generated during cooling.

Abstract: By an electronic component mounting method for electrically connecting bumps to board electrodes, in a contact process for placing a thermosetting resin in a liquid glob state on the board surface and bringing the lower surface of the electronic component in contact with the thermosetting resin, the bumps are pressurized against the electrodes in positional alignment in a liquid glob distribution state where one portion of the liquid glob is arranged inside an electronic component mounting region and a remaining portion greater in liquid measure than the portion is arranged outside the electronic component mounting region. The thermosetting resin enters into a gap between the electronic component and the board by capillarity in a thermocompression bonding process. This prevents voids occurring in the sealing resin, reinforces bonded portions of bumps and electrodes with thermally cured thermosetting resin, thereby preventing bonded portion breakage due to thermal stress generated during a cooling process.