Patents by Inventor Satomi Kitagawa

Satomi Kitagawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230323111
    Abstract: A resin composition, a formed article, and, an electromagnetic wave absorber, may each have large electromagnetic wave absorbance. The resin composition may contain: a thermoplastic resin; and an electro-conductive substance, the resin composition, when formed to a 2 mm thick test specimen and a cross section thereof is observed under a digital microscope, giving an aggregate attributable to the electro-conductive substance, with an area percentage of the aggregate, having an equivalent circle diameter of 30 µm or larger, of 0.80% or smaller.
    Type: Application
    Filed: February 24, 2022
    Publication date: October 12, 2023
    Applicant: MITSUBISHI ENGINEERING-PLASTICS CORPORATION
    Inventors: Shuta ISEKI, Hidekazu SHOJI, Satomi KITAGAWA
  • Publication number: 20050276983
    Abstract: The present invention relates to metal object-coating method, which method comprises coating a primer composition (I) prepared by adding an inorganic anti-corrosive agent to at least one binder component selected from the group consisting of a binder component (A) containing an epoxy resin and ant least one of amino resin and phenol resin, a binder component (B) containing a polyester resin, epoxy resin and phenol resin, and a binder component (C) containing ?-olefin•?,?-ethylenically unsaturated carboxylic acid copolymer resin onto the surface of a metal object coating substrate to form a primer coating film layer, followed by coating a topcoat coating composition consisting of a thermoplastic resin based coating composition (II) onto the primer coating film layer to form a topcoat coating film layer consisting of a thermoplastic resin coating film layer; and the primer composition used in the method.
    Type: Application
    Filed: October 16, 2002
    Publication date: December 15, 2005
    Inventors: Seiji Kashiwada, Satomi Kitagawa, Toshio Ohkoshi, Yoshinori Kato, Tohru Hayase, Makoto Mizutani, Minoru Ishikura, Hitoshi Itoh