Patents by Inventor Satomi Michiya

Satomi Michiya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer polishing apparatus
    Patent number: 6648739
    Abstract: A step part is formed on a face of a retainer ring that contacts with a polishing pad so that a wavily deformed part of the polishing pad enters the step part. The step part is formed like a ring at the inside of the face which actually contacts with the polishing pad. Moreover, a height of the step part is smaller than a thickness of a wafer so that a top face of the step part does not contact with the polishing pad and the wafer does not enter the step part. Further, a width of the step part is set so that the wavily deformed part of the polishing pad can enter the step part.
    Type: Grant
    Filed: July 5, 2001
    Date of Patent: November 18, 2003
    Assignee: Tokyo Seimitsu Co., Ltd.
    Inventors: Hirohiko Izumi, Satomi Michiya, Takashi Fujita, Minoru Numoto, Mikhail Tuzov
  • Wafer polishing apparatus
    Publication number: 20020004361
    Abstract: A step part is formed on a face of a retainer ring that contacts with a polishing pad so that a wavily deformed part of the polishing pad enters the step part. The step part is formed like a ring at the inside of the face which actually contacts with the polishing pad. Moreover, a height of the step part is smaller than a thickness of a wafer so that a top face of the step part does not contact with the polishing pad and the wafer does not enter the step part. Further, a width of the step part is set so that the wavily deformed part of the polishing pad can enter the step part.
    Type: Application
    Filed: July 5, 2001
    Publication date: January 10, 2002
    Inventors: Hirohiko Izumi, Satomi Michiya, Takashi Fujita, Minoru Numoto, Mikhail Tuzov