Patents by Inventor Satoru Akita

Satoru Akita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lead-free solder paste for reflow soldering
    Patent number: 6896172
    Abstract: A lead-free solder paste suitable for reflow soldering includes a plurality of different types of metal powder mixed with a flux. One of the metal powders is a Sn alloy powder. Another of the metal powders is selected from a Sn alloy powder, elemental Ag powder, elemental Cu powder, and elemental Sn powder. Each Sn alloy powder includes 0-8 mass % of Ag, 0-5 mass % of Cu, and at least 80 mass % of Sn. The plurality of metal powders have a composition when melted of 1-5 mass % Ag, 0.5-3 mass % Cu, and a remainder of Sn.
    Type: Grant
    Filed: May 27, 2004
    Date of Patent: May 24, 2005
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Toshihiko Taguchi, Satoru Akita, Masato Shimamura, Ryoichi Suzuki, Tetsuya Okuno
  • Lead-free solder paste for reflow soldering
    Publication number: 20040217152
    Abstract: A lead-free solder paste suitable for reflow soldering includes a plurality of different types of metal powder mixed with a flux. One of the metal powders is a Sn alloy powder. Another of the metal powders is selected from a Sn alloy powder, elemental Ag powder, elemental Cu powder, and elemental Sn powder. Each Sn alloy powder includes 0-8 mass % of Ag, 0-5 mass % of Cu, and at least 80 mass % of Sn. The plurality of metal powders have a composition when melted of 1-5 mass % Ag, 0.5-3 mass % Cu, and a remainder of Sn.
    Type: Application
    Filed: May 27, 2004
    Publication date: November 4, 2004
    Applicant: Senju Metal Industry Co., Ltd.
    Inventors: Toshihiko Taguchi, Satoru Akita, Masato Shimamura, Ryoichi Suzuki, Tetsuya Okuno