Abstract: A battery module includes a plurality of battery cells and a function material. The function material is located between adjacent battery cells. The function material includes an elastic particle and a binder. The elastic particle is dispersed in the binder.

Abstract: A polishing head including, below a polishing head body, a rubber film held by a disk-shaped mid plate and an annular guide ring disposed around the rubber film holding the back surface of the workpiece on a lower face portion of the rubber film. The polishing head also includes a base member that is coupled to a polishing head body through an elastic film and holds the guide ring and the mid plate such that the lower surface of the guide ring does not contact the polishing pad during polishing. The polishing head and polishing apparatus, are operable in both of the rough polishing process and final polishing process, that can stably achieve predetermined high flatness and high polishing stock removal uniformity in polishing of a workpiece and can obtain a workpiece with fewer fine particles having a diameter of 45 nm or more.

Abstract: To accurately test the operating state of the APD measuring device. A test device 40 includes a test signal generator 41 that generates a test signal corresponding to the center frequency of a signal to be measured and a control unit 42 that variably controls the amplitude level of a test signal in the dynamic range of an APD measuring device 1 at random, in order to test the operating state of the APD measuring device 1.

Abstract: A polishing head for holding a workpiece when a surface of the workpiece is polished and a polishing apparatus provided with the polishing head, and more particularly a polishing head for holding the workpiece on a rubber film and a polishing apparatus provided with the polishing head. The polishing head and the polishing apparatus provided with the polishing head that can adjust the polishing profile on the basis of the shape of the workpiece before polishing and can stably obtain good flatness.

Abstract: There is disclosed a general-purpose APD measurement apparatus capable of changing a measurement condition, such as the number of channels or a resolution bandwidth (RBW) in compliance with a standard for the subject of measurement, measuring various subjects of measurement, and correcting measurement equipment, thereby enabling a higher accuracy of measurement. The resolution bandwidth (RBW) or the number of channels when measurement is performed can be flexibly changed by controlling the cycle of a clock signal whose data are sampled by A/D conversion means 110, frequency selection means 130, and an APD unit 300. The frequency selection means 130 includes FFT type processing means 131 and filter bank type processing means 132 arranged in parallel. The output of FFT type processing means 131 is corrected based on the output of the filter bank type processing means 132 with a high accuracy of measurement. Accordingly, a higher accuracy of measurement is made possible.

Abstract: To accurately test the operating state of the APD measuring device. A test device 40 includes a test signal generator 41 that generates a test signal corresponding to the center frequency of a signal to be measured and a control unit 42 that variably controls the amplitude level of a test signal in the dynamic range of an APD measuring device 1 at random, in order to test the operating state of the APD measuring device 1.

Abstract: A polishing head having a disklike carrier in which an annular projecting portion and a carrier-engagement portion are formed in a peripheral portion, a disklike head body in which a head-body-engagement portion is formed outside, a diaphragm for connecting the head body with the carrier, a spacer located between the carrier-engagement portion and the head-body-engagement portion in a part of the carrier-engagement portion and/or the head-body-engagement portion, in which the spacer abuts on the carrier-engagement portion and/or the head-body-engagement portion at the time of lifting the head body so that the workpiece is demounted from the polishing pad by lifting the carrier with it inclined. As a result, there is provided a polishing head in which the workpiece can be easily, safely and surely demounted from the polishing pad by lifting the polishing head holding the workpiece without overhanging the polishing head from the turn table and the like.

Abstract: A polishing head including, below a polishing head body, a rubber film held by a disk-shaped mid plate and an annular guide ring disposed around the rubber film holding the back surface of the workpiece on a lower face portion of the rubber film. The polishing head also includes a base member that is coupled to a polishing head body through an elastic film and holds the guide ring and the mid plate such that the lower surface of the guide ring does not contact the polishing pad during polishing. The polishing head and polishing apparatus, are operable in both of the rough polishing process and final polishing process, that can stably achieve predetermined high flatness and high polishing stock removal uniformity in polishing of a workpiece and can obtain a workpiece with fewer fine particles having a diameter of 45 nm or more.

Abstract: The present invention is a polishing head provided with an annular rigid ring, a rubber film bonded to the rigid ring with a uniform tension, a mid plate joined to the rigid ring and forming a space portion together with the rubber film and the rigid ring, and an annular template provided concentrically with the rigid ring in a peripheral portion on a lower face part of the rubber film and having an outer diameter larger than an inner diameter of the rigid ring, in which a pressure of the space portion can be changed by a pressure adjustment mechanism, a back face of a work is held on the lower face part of the rubber film, and a surface of the work is brought into sliding contact with the polishing pad attached onto a turn table for performing polishing, and an inner diameter of the template is smaller than an inner diameter of the rigid ring, and a ratio between an inner diameter difference between the rigid ring and the template and a difference between the inner diameter and an outer diameter of the templ

Abstract: The present invention is a polishing head in which a rubber film is formed in a boot shape in such a manner that a position where the rubber film is held by a mid plate is distantly positioned from a work holding portion; an end portion of the boot shaped rubber film is formed in O-ring shape so that the rubber film is held by the mid plate with decreasing an area of contact between the mid plate and the rubber film as much as possible. As a result, there is provided a polishing head with rubber chuck method in which an occurrence of a surface defect, such as a scratch, on a surface of the work is suppressed as much as possible and the work can be uniformly and stably polished to the outer periphery.

Abstract: A polishing head for holding a workpiece when a surface of the workpiece is polished and a polishing apparatus provided with the polishing head, and more particularly a polishing head for holding the workpiece on a rubber film and a polishing apparatus provided with the polishing head. The polishing head and the polishing apparatus provided with the polishing head that can adjust the polishing profile on the basis of the shape of the workpiece before polishing and can stably obtain good flatness.

Abstract: A method for manufacturing a polishing head having an annular rigid ring; a rubber film bonded to the rigid ring with uniform tension; a mid plate joined to the rigid ring, forming a space together with the rubber film and the rigid ring; and a mechanism for changing pressure of the space, the method including performing a tensile test on the rubber film according to JIS K6251 before bonding the rubber film to the rigid ring, and selecting the rubber film having a value of 10 MPa or less of an inclination obtained by a linear approximation of a stress-strain curve within a strain value of 5%; and bonding the selected rubber film having a value of 10 MPa or less of the inclination to the rigid ring to manufacture the polishing head.

Abstract: The present invention is a polishing head in which a rubber film is formed in a boot shape in such a manner that a position where the rubber film is held by a mid plate is distantly positioned from a work holding portion; an end portion of the boot shaped rubber film is formed in O-ring shape so that the rubber film is held by the mid plate with decreasing an area of contact between the mid plate and the rubber film as much as possible. As a result, there is provided a polishing head with rubber chuck method in which an occurrence of a surface defect, such as a scratch, on a surface of the work is suppressed as much as possible and the work can be uniformly and stably polished to the outer periphery.

Abstract: There is disclosed a general-purpose APD measurement apparatus capable of changing a measurement condition, such as the number of channels or a resolution bandwidth (RBW) in compliance with a standard for the subject of measurement, measuring various subjects of measurement, and correcting measurement equipment, thereby enabling a higher accuracy of measurement. The resolution bandwidth (RBW) or the number of channels when measurement is performed can be flexibly changed by controlling the cycle of a clock signal whose data are sampled by A/D conversion means 110, frequency selection means 130, and an APD unit 300. The frequency selection means 130 includes FFT type processing means 131 and filter bank type processing means 132 arranged in parallel. The output of FFT type processing means 131 is corrected based on the output of the filter bank type processing means 132 with a high accuracy of measurement. Accordingly, a higher accuracy of measurement is made possible.

Abstract: A polishing head having a disklike carrier in which an annular projecting portion and a carrier-engagement portion are formed in a peripheral portion, a disklike head body in which a head-body-engagement portion is formed outside, a diaphragm for connecting the head body with the carrier, a spacer located between the carrier-engagement portion and the head-body-engagement portion in a part of the carrier-engagement portion and/or the head-body-engagement portion, in which the spacer abuts on the carrier-engagement portion and/or the head-body-engagement portion at the time of lifting the head body so that the workpiece is demounted from the polishing pad by lifting the carrier with it inclined. As a result, there is provided a polishing head in which the workpiece can be easily, safely and surely demounted from the polishing pad by lifting the polishing head holding the workpiece without overhanging the polishing head from the turn table and the like.

Abstract: The present invention is a polishing head having at least: an approximately discoid mid plate; a rubber film covering at least a lower face portion and a side face portion of the mid plate; and a space portion surrounded by the mid plate and the rubber film; in which pressure of the space portion can be changed by a pressure adjustment mechanism, a back surface of a workpiece is held on a lower face portion of the rubber film and a front surface of the workpiece is brought into sliding contact with a polishing pad attached onto a turn table for performing polishing; wherein the mid plate and the rubber film do not contact one another to have a gap at least throughout a whole of the lower face portion of the mid plate. As a result, there is provided a polishing head etc by a rubber chuck method in which a uniform polishing load is applied over the workpiece without influence of stiffness or flatness of the mid plate.

Abstract: The present invention is a polishing head provided with an annular rigid ring, a rubber film bonded to the rigid ring with a uniform tension, a mid plate joined to the rigid ring and forming a space portion together with the rubber film and the rigid ring, and an annular template provided concentrically with the rigid ring in a peripheral portion on a lower face part of the rubber film and having an outer diameter larger than an inner diameter of the rigid ring, in which a pressure of the space portion can be changed by a pressure adjustment mechanism, a back face of a work is held on the lower face part of the rubber film, and a surface of the work is brought into sliding contact with the polishing pad attached onto a turn table for performing polishing, and an inner diameter of the template is smaller than an inner diameter of the rigid ring, and a ratio between an inner diameter difference between the rigid ring and the template and a difference between the inner diameter and an outer diameter of the templ

Abstract: In the polishing system of the present invention, a adhering unit adheres a wafer on a carrying plate using liquid. A polishing unit polishes the wafer using a polishing plate. A feeding unit conveys the carrying plate from the adhering unit to the polishing unit. A dismounting unit removes the wafer from the carrying plate. A first discharging unit conveys the carrying plate from the polishing unit to the dismounting unit. A cleaning unit cleans the vacant carrying plate. A second discharging unit conveys the carrying plate from the dismounting unit to the cleaning unit. A third discharging unit conveys the carrying plate from the cleaning unit to the adhering unit. The units are formed into a loop lines so that the carrying plate is circulated in the loop line and the wafers are polished therein.