Abstract: In a method of thinning a semiconductor wafer, a protection tape smaller in size than the semiconductor wafer is applied to a front of the semiconductor wafer, and a back of the semiconductor wafer is etched. In the etching process, a chemical liquid falls down from the semiconductor wafer without being accumulated on the protection tape because the protection tape is smaller in size than the semiconductor wafer.

Abstract: In a method of thinning a semiconductor wafer, a protection tape smaller in size than the semiconductor wafer is applied to a front of the semiconductor wafer, and a back of the semiconductor wafer is etched. In the etching process, a chemical liquid falls down from the semiconductor wafer without being accumulated on the protection tape because the protection tape is smaller in size than the semiconductor wafer.

Abstract: In a method of thinning a semiconductor wafer, a protection tape smaller in size than the semiconductor wafer is applied to a front of the semiconductor wafer, and a back of the semiconductor wafer is etched. In the etching process, a chemical liquid falls down from the semiconductor wafer without being accumulated on the protection tape because the protection tape is smaller in size than the semiconductor wafer.

Abstract: A jig used for assembling semiconductor devices has an arrangement wherein the first semiconductor integrated circuit chip, which is die-bonded and wire-bonded onto one surface of a lead frame, is fitted to the inner section of a support stage and is supported by an elastic member that is designed to be higher than the inner section, while the lead frame is supported by the outer section of the support stage. In this state, the second semiconductor integrated circuit chip is die-bonded onto the other surface of the lead frame by applying pressure by means of a bonding collet. Thus, it becomes possible to prevent cracks that may be caused in a passivation film and also to improve the reliability and the final yield of semiconductor devices.

Abstract: In a method of thinning a semiconductor wafer, a protection tape smaller in size than the semiconductor wafer is applied to a front of the semiconductor wafer, and a back of the semiconductor wafer is etched. In the etching process, a chemical liquid falls down from the semiconductor wafer without being accumulated on the protection tape because the protection tape is smaller in size than the semiconductor wafer.

Abstract: A package tester includes an inlet station for arranging a test board in which package sockets mounting packages are disposed in one or plural lines for performing package test by flowing an electric current through the package and transmitting signals to the package, the package being composed of parts including electric parts or electronic parts and being sequentially formed on a package tape, an inlet pusher for pushing the test board mounting the packages by a width of the test board in a feeding direction of the test board from the inlet station to the package socket, a conveyor for receiving the test board sequentially pushed out of the inlet station by the inlet pusher and conveying the received test board to a testing area, a contact device opposed to the conveyor and capable of being electrically connected to the test board arranged on the conveyor, an outlet station receiving the test board sequentially pushed out of the conveyor by sequentially pushing-out of the test board by means of the inlet pu

Abstract: In order to improve the operability of a burn-in apparatus, to shorten the operating time, to reduce the number of the components, and to increase the package density of semiconductor integrated circuits to be accommodated within a burn-in apparatus, semiconductor integrated circuits with a lead frame are mounted on a first wiring board by means of fixing the pressuring member to the first wiring board with a magnetic force. Thereafter, the first wiring board is mounted to a second wiring board, and both are to be inserted into a burn-in apparatus.