Patents by Inventor Satoru Fukuyama

Satoru Fukuyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of manufacturing bump electrodes and a method of manufacturing a semiconductor device
    Patent number: 6653219
    Abstract: In a method of manufacturing bump electrodes, a solder paste material is filled in concave parts provided on one surface of a jig for forming bumps, and the solder paste material is melted under the condition in that the concave parts of the jig for forming bumps face electrode pads provided on one surface of a substrate (a semiconductor chip or a circuit board), to form bump electrodes on the electrode pads of the substrate, whereby the size of the bump electrodes formed on electrode pads can be uniform. Furthermore, a short circuit among the electrode pads of the substrate (a semiconductor chip or a circuit board) can be prevented. Furthermore, the yield in a production process of a semiconductor device having bump electrodes can be increased.
    Type: Grant
    Filed: December 7, 2001
    Date of Patent: November 25, 2003
    Assignee: Hitachi, Ltd.
    Inventor: Satoru Fukuyama
  • Method of manufacturing bump electrodes and a method of manufacturing a semiconductor device
    Publication number: 20020086515
    Abstract: In a method of manufacturing bump electrodes, a solder paste material is filled in concave parts provided on one surface of a jig for forming bumps, and the solder paste material is melted under the condition in that the concave parts of the jig for forming bumps face electrode pads provided on one surface of a substrate (a semiconductor chip or a circuit board), to form bump electrodes on the electrode pads of the substrate, whereby the size of the bump electrodes formed on electrode pads can be uniform. Furthermore, a short circuit among the electrode pads of the substrate (a semiconductor chip or a circuit board) can be prevented. Furthermore, the yield in a production process of a semiconductor device having bump electrodes can be increased.
    Type: Application
    Filed: December 7, 2001
    Publication date: July 4, 2002
    Applicant: Hitachi, Ltd.
    Inventor: Satoru Fukuyama
  • Method of forming semiconductor device bump electrodes
    Patent number: 6335271
    Abstract: In a method of manufacturing bump electrodes, a solder paste material is filled in concave parts provided on one surface of a jig for forming bumps, and the solder paste material is melted under the condition in that the concave parts of the jig for forming bumps face electrode pads provided on one surface of a substrate (a semiconductor chip or a circuit board), to form bump electrodes on the electrode pads of the substrate, whereby the size of the bump electrodes formed on electrode pads can be uniform. Furthermore, a short circuit among the electrode pads of the substrate (a semiconductor chip or a circuit board) can be prevented. Furthermore, the yield in a production process of a semiconductor device having bump electrodes can be increased.
    Type: Grant
    Filed: January 13, 2000
    Date of Patent: January 1, 2002
    Assignee: Hitachi, Ltd.
    Inventor: Satoru Fukuyama