Abstract: In a drive unit according to an embodiment of the present disclosure, in each of a plurality of current pulses, a rising crest value is the largest, and after the rising, the crest value is damped. Further, a rising crest value of a pulse of an n+1-th wave is smaller than a rising crest value of a pulse of an n-th wave. Furthermore, rising crest values of the current pulses of a second wave and waves after the second wave are determined by a mathematical function expressed as an electric potential change caused by ON-OFF of an RC time constant circuit that is single-end grounded. Moreover, in the mathematical function, a time constant at an OFF time is larger than a time constant at an ON time.

Abstract: In a drive unit according to an embodiment of the present disclosure, in each of a plurality of current pulses, a rising crest value is the largest, and after the rising, the crest value is damped. Further, a rising crest value of a pulse of an n+1-th wave is smaller than a rising crest value of a pulse of an n-th wave. Furthermore, rising crest values of the current pulses of a second wave and waves after the second wave are determined by a mathematical function expressed as an electric potential change caused by ON-OFF of an RC time constant circuit that is single-end grounded. Moreover, in the mathematical function, a time constant at an OFF time is larger than a time constant at an ON time.

Abstract: A system and a method of detecting a chipping of the rail part of a slider of a thin film magnetic head obtains the image of the object of detection and its boundary coordinates by tracing the boundary of the object of detection from the image. A chipping size is obtained from the coordinates of the points on the boundary, and the presence or absence of chipping is judged from the chipping size, thereby enabling the highly precise detection of a chipping defect generated on the boundary portion of the object of detection using a simple structure.

Abstract: A pattern detection apparatus based on a scanning transmission electron microscope having an electron gun for generating and accelerating an electron beam, a plurality of convergent lenses for converging the electron beam, a deflection circuit for deflecting the electron beam so that it scans an object to be inspected, such as an X-ray mask, a detection circuit which receives electrons that have been dispersed and transmitted in the object and converts the detected electrons into an electrical signal, and an image forming circuit which forms a detected image of the object under test in response to the detected signal from the detection circuit and in synchronism with the deflection signal applied to the deflection circuit.

Abstract: An auto-focusing electron microscope used for the observation, measurement and/or checking of a circuit pattern or the like comprises an objective lens capable of changing a focal position of an electron beam, an optical system for projecting a light and shade pattern having a light-permeable portion and a light-shielding portion onto the surface of a specimen through the objective lens, and a detector for detecting the projected pattern while optically reflecting it, whereby focusing can be made while reducing any damage and/or charging of the specimen.

Abstract: In accordance with the present invention, there is provided a pattern defect detecting apparatus using a scanning and transmission electron microscope, comprising an electron gun for accelerating an electron beam with high energy enough to transmit it through a sample and for radiating the accelerated electron beam, a condenser lens for focusing the electron beam generated by said electron gun, a beam deflection coil for deflecting the electron beam focused by said condenser lens, an objective lens for further focusing the electron beam deflected by said beam deflection coil onto a fixed spot, an XY stage for disposing the sample so as to be opposed to said objective lens, said XY stage being movable in X and Y directions in a step and repeat manner, a sample chamber for housing the XY stage in vacuum, said sample chamber including at least the outlet of the electron beam of said objective lens, an electron beam detector for detecting electron beams transmitted through said sample, said electron beam detector

Abstract: Method of and apparatus for checking the geometry of multi-layer patterns for IC structures having identical functions, each of the multi-layer patterns including layer patterns arranged in different level layers, wherein electrical image signals corresponding to any two of the multi-layer patterns and having more than two levels are registered with each other and then compared to determine unmatched and matched portions. The comparison of the registered electric image signals may be performed with respect to their amplitude or their gradients. The registration and comparison of two electric image signals may be repeated for all of the layer patterns with the matched portions being no longer subjected to the registration and comparison. A defect detection signal is produced from finally unmatched portions, if any, of the electric image signals having undergone the said registration and comparison.

Abstract: A pattern defect is detected in accordance with the difference between a pair of patterns. The patterns are scanned and imaged to obtain first and second binary signals. A positioning error between the patterns is two-dimensionally detected during the scanning with respective first and second binary signals delayed by a prescribed amount so that each of the picture elements in a prescribed area of a two-dimensional image, delayed and cut out two-dimensionally, corresponding to one pattern, is compared with a specified picture element in a predetermined area of an image delayed and cut out two-dimensionally corresponding to another pattern. The result of the comparison is statistically summed to derive a positioning error by detecting the position shown as an extreme value from the summed values. The positioning error is corrected by two-dimensionally shifting at least one of the delayed binary signals. The corrected binary signals are then two-dimensionally compared with each other.

Abstract: A pattern detection system for inspecting defects in fine or minute patterns such as photomask patterns at a fast speed is disclosed. The system comprises an illuminator, a device for moving objects with the patterns to be inspected with being illuminated by the illuminator, an optical system for imaging the objects, a scanner for scanning the objects in a direction intersected at a given angle with respect to direction of the objects moved by the moving device and arrays of photosensors arranged linearly in a direction perpendicular to that of images on the objects scanned by the scanner, on the surface of which the images are formed by the optical system and for producing respective outputs parallelly on the time basis.