Abstract: A compound of the following general formula [I]: wherein each symbol has the same meaning as defined herein, or a pharmaceutically acceptable salt thereof, or a solvate thereof, and a pharmaceutical use of the same in treating organ transplant rejection, graft versus host reaction after transplantation, autoimmune disease, allergic disease and chronic myeloproliferative disease.

Abstract: A monitoring system has a notifying unit capable of notifying a driver of information in a tactually recognizable manner, and a processor configured to determine whether a seat position of a driver's seat in which a driver is sitting is within a recommended range that represents an extent of the seat position where the driver sitting in the driver's seat can drive a vehicle, and notify the driver of a move request requiring to adjust the seat position within the recommended range through the notifying control unit based on the determination that the seat position is not within the recommended range.

Abstract: A support structure for a front wiper device for a vehicle having an annular pivot cap which surrounds, under a deck garnish, a periphery of a pivot on which a base end portion of a wiper arm is supported is provided. The pivot cap includes a bottom plate section that is in an annular shape surrounding the periphery of the pivot, and is extended to a vehicle front side, and a flange section extending upward from an edge portion of the bottom plate section. The flange section is opened at a vehicle front side, and is provided with an opening. In a region at a vehicle rear side and at an electric motor side, of the bottom plate section, a protrusion that protrudes upward from a region at a side opposite to the electric motor is included.

Abstract: A support structure for a front wiper device for a vehicle having an annular pivot cap which surrounds, under a deck garnish, a periphery of a pivot on which a base end portion of a wiper arm is supported is provided. The pivot cap includes a bottom plate section that is in an annular shape surrounding the periphery of the pivot, and is extended to a vehicle front side, and a flange section extending upward from an edge portion of the bottom plate section. The flange section is opened at a vehicle front side, and is provided with an opening. In a region at a vehicle rear side and at an electric motor side, of the bottom plate section, a protrusion that protrudes upward from a region at a side opposite to the electric motor is included.

Abstract: A method of manufacturing a rotating electrical machine has steps of a preparation step that accommodates the cap in a jig space while bringing the jig and the pulley in contact in an up-and-down direction so that an operation space is sealed, and a main step that decompresses the operation space to pressure lower than atmospheric pressure, moves the cap to an upper side in the decompressed operation space, and press-fits the cap into the pulley. By this, an inclination and a misalignment in the axial direction of the cap by the action of the reaction force can be suppressed since the reaction force acting downwardly on the cap can be weakened compared with the case where the cap is press-fit under atmospheric pressure. Therefore, the press-fit-state of the cap can be stabilized.

Abstract: According to one embodiment, a semiconductor apparatus includes a semiconductor device, a heat spreader, a regulating unit, a containing unit, and a holding unit. The heat spreader is bonded to the semiconductor device with an interposed solder layer. The regulating unit is configured to regulate a dimension between the semiconductor device and the heat spreader. The containing unit is configured to contain melted solder in an interior of the containing unit. The holding unit is configured to allow melted solder held in an interior of the holding unit. The holding unit is configured to replenish the melted solder in the case where an amount of the melted solder contained in the containing unit is insufficient. The holding unit is configured to recover the melted solder in the case where the amount of the melted solder contained in the containing unit is excessive.

Abstract: A droplet applying device (2) includes: application heads (2d) configured to eject an application liquid as multiple droplets toward to-be-coated subjects (K1, K2); a moving mechanism (2c) configured to move each of the to-be-coated subjects (K1, K2) and the application heads (2d) relative to each other; and a rotating mechanism (2b) configured to rotate the to-be-coated subjects (K1, K2) in a plane intersecting with an ejecting direction in which the multiple droplets are ejected.

Abstract: According to one embodiment, a semiconductor apparatus includes a semiconductor device, a heat spreader, a regulating unit, a containing unit, and a holding unit. The heat spreader is bonded to the semiconductor device with an interposed solder layer. The regulating unit is configured to regulate a dimension between the semiconductor device and the heat spreader. The containing unit is configured to contain melted solder in an interior of the containing unit. The holding unit is configured to allow melted solder held in an interior of the holding unit. The holding unit is configured to replenish the melted solder in the case where an amount of the melted solder contained in the containing unit is insufficient. The holding unit is configured to recover the melted solder in the case where the amount of the melted solder contained in the containing unit is excessive.

Abstract: A method of manufacturing a rotating electrical machine has steps of a preparation step that accommodates the cap in a jig space while bringing the jig and the pulley in contact in an up-and-down direction so that an operation space is sealed, and a main step that decompresses the operation space to pressure lower than atmospheric pressure, moves the cap to an upper side in the decompressed operation space, and press-fits the cap into the pulley. By this, an inclination and a misalignment in the axial direction of the cap by the action of the reaction force can be suppressed since the reaction force acting downwardly on the cap can be weakened compared with the case where the cap is press-fit under atmospheric pressure. Therefore, the press-fit-state of the cap can be stabilized.

Abstract: A semiconductor device includes a circuit board having an element mounting area, connecting pads positioned in the same surface side as the element mounting area and external connectors to be connected with the connecting pads, respectively; and a semiconductor element mounted on the element mounting area of the circuit board and having electrode pads to be electrically connected with the connecting pads, respectively. The external connectors are detachably configured through a combination of convex portions and concave portions which are mechanically and electrically connected with one another.

Abstract: A semiconductor device includes a circuit board having an element mounting area, connecting pads positioned in the same surface side as the element mounting area and external connectors to be connected with the connecting pads, respectively; and a semiconductor element mounted on the element mounting area of the circuit board and having electrode pads to be electrically connected with the connecting pads, respectively. The external connectors are detachably configured through a combination of convex portions and concave portions which are mechanically and electrically connected with one another.

Abstract: A semiconductor device manufacturing apparatus includes: an accommodation section accommodating an application object; an irradiation section irradiating the application object taken out from the accommodation section with ultraviolet light; an application section including a stage allowing the application object to be placed thereon and an application head discharging a plurality of droplets of an adhesive to the application object placed on the stage, the application section applying the adhesive through the application head to the application object which is irradiated by ultraviolet light through the irradiation section and is placed on the stage; a drying section drying the adhesive applied on the application object with heat; and a transport section including a hand supporting the application object, the transport section which is capable of transporting the application object accommodated in the accommodation section to the irradiation section, the application section, and the drying section.

Abstract: A droplet applying device (2) includes: application heads (2d) configured to eject an application liquid as multiple droplets toward to-be-coated subjects (K1, K2); a moving mechanism (2c) configured to move each of the to-be-coated subjects (K1, K2) and the application heads (2d) relative to each other; and a rotating mechanism (2b) configured to rotate the to-be-coated subjects (K1, K2) in a plane intersecting with an ejecting direction in which the multiple droplets are ejected.

Abstract: In a method, a first electrode is moved to contact with first paired ends of first paired conductor segments. Next, a second electrode is moved opposing the first paired ends Electric conduction is established between the first electrode and the second electrode via the first paired ends of the first paired conductor segments to weld the first paired ends of the first paired conductor segments based on the electrical conduction therebetween. Next, the second electrode is moved opposing second paired ends of second paired conductor segments while the first electrode is kept in contact with the first paired ends. Electric conduction is established between the first electrode and the second electrode via the welded first paired ends and the second paired ends to thereby weld the second paired ends of the second paired conductor segments based on the electrical conduction therebetween.

Abstract: According one aspect of the invention, there is provided a mobile apparatus including: a main face; a back face opposite to the main face, the back face being printed with visible user information; a thickness from the main face to the back face; an antenna disposed at a position nearer the back face than the main face; and an attachment portion attachable with a wearing tool, the wearing tool allowing a user to wear the mobile apparatus.

Abstract: According to one aspect of the invention, a mobile terminal includes: a case having two flat faces opposite to each other and side faces having a first side face and a second side face opposed to each other; a first sound input/output unit provided on the first side faces; and a second sound input/output unit provided on the second side face.

Abstract: In a method, a first electrode is moved to contact with first paired ends of first paired conductor segments. Next, a second electrode is moved opposing the first paired ends Electric conduction is established between the first electrode and the second electrode via the first paired ends of the first paired conductor segments to weld the first paired ends of the first paired conductor segments based on the electrical conduction therebetween. Next, the second electrode is moved opposing second paired ends of second paired conductor segments while the first electrode is kept in contact with the first paired ends. Electric conduction is established between the first electrode and the second electrode via the welded first paired ends and the second paired ends to thereby weld the second paired ends of the second paired conductor segments based on the electrical conduction therebetween.

Abstract: A semiconductor device includes a circuit board having an element mounting area, connecting pads positioned in the same surface side as the element mounting area and external connectors to be connected with the connecting pads, respectively; and a semiconductor element mounted on the element mounting area of the circuit board and having electrode pads to be electrically connected with the connecting pads, respectively. The external connectors are detachably configured through a combination of convex portions and concave portions which are mechanically and electrically connected with one another.

Abstract: A pavement composite material having elasticity and permeability can be obtained by accommodating a permeable concrete block after the solidification molding applied with an adhesive having a 50 to 100 centipoise viscosity on the surface to be bonded in a heat press mold, injecting a mixture of 50 to 90% by weight of rubber or plastic chips having a 1.0 to 10.0 mm particle size and 50 to 10% by weight of a thermosetting resin thereon, and a heat compression molding.